Charged beam exposure apparatus having blanking aperture and basic figure aperture
    31.
    发明授权
    Charged beam exposure apparatus having blanking aperture and basic figure aperture 失效
    充电光束曝光装置具有遮光孔和基本图形孔径

    公开(公告)号:US06703629B2

    公开(公告)日:2004-03-09

    申请号:US09912365

    申请日:2001-07-26

    申请人: Tetsuro Nakasugi

    发明人: Tetsuro Nakasugi

    IPC分类号: G21K510

    摘要: Two or more-staged masks are prepared for a charged beam generating source. One mask has first aperture sections having rectangular apertures arranged into a lattice form, and electrodes which deflects a beam at respective first aperture sections. The other mask has a second aperture section having basic figure apertures for shaping the beam which passes or passed through the first aperture sections. Layout data of a semiconductor apparatus are divided into sizes of the basic figures which take reduction in exposure into consideration so as to be classified according to the basic figures. The beam which is shaped into a form of an overlapped portion of the divided layouts and the classified basic figure is emitted onto a sample.

    摘要翻译: 为带电束产生源准备了两个或多个阶段的掩模。 一个掩模具有布置成格子形状的矩形孔的第一孔径部分和在相应的第一孔径部分偏转梁的电极。 另一个掩模具有第二孔径部分,其具有用于使通过或穿过第一孔部分的梁的成形的基本图形孔。 将半导体装置的布局数据分为基准图的尺寸,这些尺寸考虑到曝光量的降低,以便根据基本图形进行分类。 成形为分割布置的重叠部分的形式的光束和分类的基本图形被发射到样品上。

    Charged beam exposure method
    32.
    发明授权
    Charged beam exposure method 失效
    带电束曝光方法

    公开(公告)号:US06376136B1

    公开(公告)日:2002-04-23

    申请号:US09465932

    申请日:1999-12-17

    IPC分类号: G03F900

    摘要: A charged beam exposing method comprises a step of applying a voltage to a sample to thereby form an acceleration electric field on the sample, a step of accelerating an electron beam emitted from an electron gun and scanning an alignment mark formed on the sample with the electron beam, a step of detecting back-scattered electrons and secondary electrons, generated from the alignment mark, by means of a detector, a step of acquiring the position of the alignment mark based on a signal waveform detected, a step of eliminating or reducing the acceleration electric field by changing the applied voltage to the sample, and a step of exposing a pattern with the electron beam emitted from the electron gun based on information of the position of the alignment mark.

    摘要翻译: 带电束曝光方法包括对样品施加电压从而在样品上形成加速电场的步骤,加速从电子枪发射的电子束并用电子扫描样品上形成的对准标记的步骤 通过检测器检测从对准标记产生的反向散射电子和二次电子的步骤,基于检测到的信号波形获取对准标记的位置的步骤,消除或减少对准标记的步骤 通过改变向样品施加的电压的加速电场,以及基于对准标记的位置的信息,用电子枪发射的电子束曝光图案的步骤。

    Method for fabricating pellicle, photo mask, and semiconductor device
    35.
    发明授权
    Method for fabricating pellicle, photo mask, and semiconductor device 有权
    防护薄膜,光掩模和半导体器件的制造方法

    公开(公告)号:US08895210B2

    公开(公告)日:2014-11-25

    申请号:US13680415

    申请日:2012-11-19

    IPC分类号: G03F1/62 G03F1/64 G03F1/68

    CPC分类号: G03F1/62 G03F1/68

    摘要: An aspect of the present embodiment, there is provided a method for fabricating a pellicle, including acquiring a shape of a pellicle frame, deciding a thickness distribution of an adhesive to be coated on the pellicle frame on a basis of the acquired shape of the pellicle frame, and coating the adhesive on the pellicle frame based on the decision of the thickness distribution.

    摘要翻译: 本实施例的一个方面,提供了一种防护薄膜组件的制造方法,其特征在于,获取防护薄膜组件的形状,根据取得的防护薄膜组件的形状来确定要涂布在防护薄膜框架上的粘合剂的厚度分布 框架,并且基于厚度分布的决定将粘合剂涂覆在防护薄膜框架上。

    METHOD FOR FABRICATING PELLICLE, PHOTO MASK, AND SEMICONDUCTOR DEVICE
    36.
    发明申请
    METHOD FOR FABRICATING PELLICLE, PHOTO MASK, AND SEMICONDUCTOR DEVICE 有权
    制造胶囊,胶片和半导体装置的方法

    公开(公告)号:US20130130158A1

    公开(公告)日:2013-05-23

    申请号:US13680415

    申请日:2012-11-19

    IPC分类号: G03F1/62 G03F1/68

    CPC分类号: G03F1/62 G03F1/68

    摘要: An aspect of the present embodiment, there is provided a method for fabricating a pellicle, including acquiring a shape of a pellicle frame, deciding a thickness distribution of an adhesive to be coated on the pellicle frame on a basis of the acquired shape of the pellicle frame, and coating the adhesive on the pellicle frame based on the decision of the thickness distribution.

    摘要翻译: 本实施例的一个方面,提供了一种防护薄膜组件的制造方法,其特征在于,获取防护薄膜组件的形状,根据取得的防护薄膜组件的形状来确定要涂布在防护薄膜框架上的粘合剂的厚度分布 框架,并且基于厚度分布的决定将粘合剂涂覆在防护薄膜框架上。

    Imprint method
    37.
    发明授权
    Imprint method 有权
    印记法

    公开(公告)号:US08419995B2

    公开(公告)日:2013-04-16

    申请号:US12563461

    申请日:2009-09-21

    IPC分类号: B28B11/08 B29C35/08

    摘要: An imprint method includes applying a light curable resin on a substrate to be processed, the substrate including first and second regions on which the light curable resin is applied, contacting an imprint mold with the light curable resin, curing the light curable resin by irradiating the light curable resin with light passing through the imprint mold, generating gas by performing a predetermined process to the light curable resin applied on a region of the substrate, the region including at least the first region, wherein an amount of gas generated from the light curable resin applied on the first region is larger than an amount of gas generated from the light curable resin of the second region, and forming a pattern by separating the imprint mold from the light curable resin after the gas being generated.

    摘要翻译: 压印方法包括将光固化树脂施加在待加工的基板上,所述基板包括施加有光固化树脂的第一和第二区域,使印模与光固化树脂接触,通过照射光固化树脂来固化光固化树脂 光固化树脂,其光通过压印模具,通过对施加在基板的区域上的光固化树脂进行预定处理产生气体,该区域至少包括第一区域,其中从光可固化 施加在第一区域上的树脂大于由第二区域的光固化树脂产生的气体的量,并且在产生气体之后通过从光固化树脂分离压印模具来形成图案。

    METHOD AND DEVICE FOR FORMING PATTERN
    38.
    发明申请
    METHOD AND DEVICE FOR FORMING PATTERN 审中-公开
    用于形成图案的方法和装置

    公开(公告)号:US20120164346A1

    公开(公告)日:2012-06-28

    申请号:US13230591

    申请日:2011-09-12

    IPC分类号: B05D3/06 B05B5/16

    摘要: According to a method for forming a pattern in one embodiment, a first pattern is formed on a substrate, and an upper part of the first pattern is irradiated with ultraviolet rays, to enhance a liquid-repellent property to an inversion resin material. Furthermore, according to the method for forming the pattern, the inversion resin material is applied to the substrate after the irradiation of the ultraviolet rays, the first pattern is removed after the inversion resin material has been applied to form a second pattern containing the inversion resin material, and the substrate is processed using the second pattern as a mask.

    摘要翻译: 根据一个实施例中的图案形成方法,在基板上形成第一图案,并且用紫外线照射第一图案的上部,以提高反转树脂材料的拒水性。 此外,根据形成图案的方法,在照射紫外线之后,将反转树脂材料施加到基板,在反转树脂材料被施加之后去除第一图案以形成包含反转树脂的第二图案 材料,并且使用第二图案作为掩模来处理基板。

    TEMPLATE, METHOD OF MANUFACTURING THE SAME, AND METHOD OF FORMING PATTERN
    39.
    发明申请
    TEMPLATE, METHOD OF MANUFACTURING THE SAME, AND METHOD OF FORMING PATTERN 审中-公开
    模板,其制造方法和形成图案的方法

    公开(公告)号:US20100264113A1

    公开(公告)日:2010-10-21

    申请号:US12724819

    申请日:2010-03-16

    IPC分类号: B44C1/22 B29C35/08 B29C59/02

    摘要: There is provided a template in which a gap region of a substrate to be processed can be covered with an imprint resist, a method of manufacturing the same, and a method of forming a pattern.A template used in an optical imprint method includes a substrate, a pattern forming region that is provided on the substrate and includes an imprint pattern, a first step portion that is provided outside the pattern forming region and is disposed below the pattern forming region, a first side portion that connects the pattern forming region and the first step portion, a second step portion that is provided outside the first step portion and is disposed below the first step portion, and a second side portion that connects the first step portion and the second step portion and has a surface roughness more than that of the first side portion.

    摘要翻译: 提供了一种模板,其中待加工的基板的间隙区域可以用抗蚀刻剂覆盖,其制造方法和形成图案的方法。 在光学印记法中使用的模板包括基板,设置在基板上的图案形成区域,并且包括印模图案,设置在图案形成区域的外侧并设置在图案形成区域下方的第一台阶部, 连接图案形成区域和第一台阶部的第一侧面部分,设置在第一台阶部分的外侧并设置在第一台阶部下方的第二台阶部,以及将第一台阶部和第二台阶部 并且具有比第一侧部的表面粗糙度更多的表面粗糙度。

    Electron beam lithography system, method of electron beam lithography, program and method for manufacturing a semiconductor device with direct writing
    40.
    发明授权
    Electron beam lithography system, method of electron beam lithography, program and method for manufacturing a semiconductor device with direct writing 失效
    电子束光刻系统,电子束光刻方法,用于制造具有直接写入的半导体器件的程序和方法

    公开(公告)号:US07283885B2

    公开(公告)日:2007-10-16

    申请号:US11097357

    申请日:2005-04-04

    申请人: Tetsuro Nakasugi

    发明人: Tetsuro Nakasugi

    IPC分类号: G06F19/00

    摘要: An electron beam lithography system includes: a lithography tool writing patterns onto substrates, which are classified into lots, respectively, using sequentially apertures through which electron beams, based on a specific processing procedures; an aperture manager managing the apertures; a request obtaining module obtaining processing requests of the lots; a processing procedure storing file storing processing procedures; a processing time calculating module calculating corresponding processing times of the lots using the apertures based on corresponding processing procedures defined for each of the lots; and an order deciding module deciding an order of processing the lots based on the processing times.

    摘要翻译: 电子束光刻系统包括:光刻工具,将基板上的图案分别按照特定的处理程序依次分成多个电子束; 管理孔的光圈管理器; 请求获取模块获取批次的处理请求; 存储文件存储处理过程的处理过程; 处理时间计算模块,基于针对每个批次定义的相应处理过程,使用所述孔来计算批次的相应处理时间; 以及基于处理时间决定处理批次的顺序的订单决定模块。