Laminated structure, very-large-scale integrated circuit wiring board, and method of formation thereof
    31.
    发明申请
    Laminated structure, very-large-scale integrated circuit wiring board, and method of formation thereof 失效
    层压结构,超大规模集成电路布线板及其形成方法

    公开(公告)号:US20080079154A1

    公开(公告)日:2008-04-03

    申请号:US11529535

    申请日:2006-09-29

    IPC分类号: H01L23/52

    摘要: The laminated structure includes a substrate of low dielectric constant material of silicon compound and an electroless copper plating layer laminated thereon with a barrier layer. The barrier layer is interposed between the substrate and the copper layer, and the barrier layer is formed by electroless plating. And the laminated structure is characterized in that the barrier layer is formed on the substrate with a monomolecular layer of organosilane compound and a palladium catalyst which are interposed between the substrate and the barrier layer, the palladium catalyst modifies the terminal, adjacent to the barrier layer, of the monomolecular layer, and the barrier layer includes an electroless NiB plating layer which is disposed on the substrate side, and a electroless CoWP plating layer.The present invention makes it possible to coat the low dielectric constant material of silicon compound in a simple all-wet process with a firmly adhering barrier layer and an electroless copper plating layer as the wiring layer. the advantage of requiring. Thus, the laminated structure formed in this way includes a substrate of low dielectric constant material of silicon compound, a barrier layer, and a copper layer as the wiring layer formed by electroless plating, which firmly adhere to one another. In addition, the laminated structure is suitable for the copper wiring in a ULSI, particularly the one which is to be formed in a narrower trench than conventional one.

    摘要翻译: 层叠结构包括硅化合物的低介电常数材料的基板和层压有阻挡层的化学镀铜层。 阻挡层插入在基板和铜层之间,通过无电镀形成阻挡层。 层叠结构的特征在于,在基板上形成有分隔层的有机硅烷化合物和钯催化剂插入在基板和阻挡层之间的阻挡层,钯催化剂改变与阻挡层相邻的端子 的阻挡层,并且阻挡层包括设置在基板侧的无电解NiB镀层和无电CoWP镀层。 本发明使得可以以简单的全湿法将具有牢固粘合的阻挡层和化学镀铜层的硅化合物的低介电常数材料涂布作为布线层。 要求的优点。 因此,以这种方式形成的层叠结构包括硅化合物的低介电常数材料的衬底,阻挡层和作为通过无电镀形成的布线层的铜层,其彼此牢固地粘合。 此外,该层压结构适用于ULSI中的铜布线,特别是在比常规的窄沟槽形成的布线中。

    Substrate for magnetic recording medium
    32.
    发明授权
    Substrate for magnetic recording medium 失效
    磁记录介质基板

    公开(公告)号:US07242553B2

    公开(公告)日:2007-07-10

    申请号:US10935519

    申请日:2004-09-07

    IPC分类号: G11B5/66 G11B5/70

    摘要: When a soft magnetic layer for a double layer type perpendicular magnetic recording medium is formed by a plating method, there is the problem of the occurrence of an isolated pulse noise called spike noise so that signal reproduction characteristics are lost. In order to solve this problem, provided are a surface-treated substrate for a magnetic recording medium comprising a substrate having a diameter of not more than 90 mm, and a soft magnetic plating layer comprising an alloy of at least two metals selected from the group consisting of Co, Ni and Fe, which is provided above the substrate, wherein the soft magnetic layer has a coercivity of less than 20 oersted (Oe) in a direction that is parallel to a substrate surface, and wherein a ratio of saturation magnetization to residual magnetization in a direction that is parallel to a surface of the substrate is from 4:1 to 4:3; and a magnetic recording medium comprising the magnetic recording medium substrate.

    摘要翻译: 当通过电镀法形成双层型垂直磁记录介质的软磁性层时,存在称为尖峰噪声的孤立脉冲噪声的问题,从而丢失了信号再现特性。 为了解决这个问题,提供了一种用于磁记录介质的经表面处理的基板,其包括直径不大于90mm的基板,以及软磁性镀层,该软磁性镀层包含选自以下的至少两种金属 由Co,Ni和Fe构成,其设置在衬底上方,其中软磁性层在平行于衬底表面的方向上具有小于20奥斯特(Oe)的矫顽力,并且其中饱和磁化强度与 在平行于衬底表面的方向上的剩余磁化强度为4:1至4:3; 以及包括磁记录介质基板的磁记录介质。

    Preparation of soft magnetic thin film
    33.
    发明授权
    Preparation of soft magnetic thin film 有权
    软磁薄膜的制备

    公开(公告)号:US07135103B2

    公开(公告)日:2006-11-14

    申请号:US10816834

    申请日:2004-04-05

    IPC分类号: C25D5/18

    摘要: A soft magnetic thin film of CoFe alloy having a high Br and low Hc is prepared by furnishing a plating tank including cathode and anode compartments which are separated by a diaphragm or salt bridge so as to permit charge transfer, but inhibit penetration of Fe ions, feeding a plating solution containing Co ions and divalent Fe ions to the cathode compartment, feeding an electrolyte solution to the anode compartment, immersing a substrate in the plating solution, immersing an anode in the electrolyte solution, electroplating, and heat treating the plated film at 100–550° C.; or by immersing a substrate and a soluble anode in a plating solution containing Co ions and divalent Fe ions, electroplating, and heat treating the plated film at 100–550° C.

    摘要翻译: 制备具有高Br和低Hc的CoFe合金的软磁性薄膜,其包括通过隔膜或盐桥隔开的阴极和阳极隔室的镀槽,以允许电荷转移,但抑制Fe离子的渗透, 将含有Co离子和二价Fe离子的电镀液供给到阴极室,将电解质溶液供给到阳极室,将基板浸渍在电镀液中,将阳极浸渍在电解液中,电镀,并对镀膜进行热处理 100-550°C。 或者将基板和可溶性阳极浸渍在含有Co离子和二价Fe离子的电镀溶液中,电镀,并在100-550℃下热处理该镀膜。

    Method of making a Co-Fe-Ni soft magnetic thin film
    34.
    发明授权
    Method of making a Co-Fe-Ni soft magnetic thin film 失效
    制备Co-Fe-Ni软磁薄膜的方法

    公开(公告)号:US06337007B1

    公开(公告)日:2002-01-08

    申请号:US09488041

    申请日:2000-01-19

    申请人: Tetsuya Osaka

    发明人: Tetsuya Osaka

    IPC分类号: C25D356

    CPC分类号: C25D3/562 H01F41/26

    摘要: A soft magnetic thin film in the form of a Co—Fe—Ni—C thin film consisting essentially of 40-70% by weight of cobalt, 20-40% by weight of iron, 5-20% by weight of nickel, and 0.02-0.1% by weight of carbon has a high saturation magnetic flux density, excellent soft magnetic properties, and a high electric resistivity.

    摘要翻译: 基本上由40-70重量%的钴,20-40重量%的铁,5-20重量%的镍组成的Co-Fe-Ni-C薄膜形式的软磁性薄膜和 0.02-0.1重量%的碳具有高饱和磁通密度,优良的软磁特性和高电阻率。

    OPTICAL SENSOR
    36.
    发明申请
    OPTICAL SENSOR 有权
    光传感器

    公开(公告)号:US20110051142A1

    公开(公告)日:2011-03-03

    申请号:US12934237

    申请日:2009-03-17

    IPC分类号: G01N21/55

    CPC分类号: G01N21/554 G01N21/658

    摘要: There is provided a novel optical sensor utilizing a surface plasmon resonance technique which is capable of detecting a substance to be detected with high sensitivity independently of a wavelength of irradiated light and is capable of obtaining information, other than a refraction index, on the substance to be detected. At the center of a surface of a metallic film 2 which is formed on a substrate and has no aperture, a circular depression 4 with a diameter of 0.1 to 250 nm is formed and with the depression 4 defined as a center, a plurality of depressions 3 are concentrically formed at intervals of 450 to 530 nm.

    摘要翻译: 提供了一种利用表面等离子体共振技术的新型光学传感器,其能够独立于照射光的波长检测高灵敏度的物质,并且能够获得物质以外的折射指数以外的信息 被检测。 在形成在基板上并且没有孔的金属膜2的表面的中心处,形成直径为0.1〜250nm的圆形凹部4,将凹部4定义为中心,形成多个凹部 3以450-530nm的间隔同心地形成。

    Fuel cell
    37.
    发明授权
    Fuel cell 有权
    燃料电池

    公开(公告)号:US07816041B2

    公开(公告)日:2010-10-19

    申请号:US11515871

    申请日:2006-09-06

    IPC分类号: H01M8/00

    摘要: A fuel cell includes a substrate having a pair of grooves, an electrolyte membrane lying on the substrate so as to define a pair of flow channels, and catalyst-bearing current collector layer sections disposed on the inner wall of the grooves or the inside surface of the electrolyte membrane defining the channels. A fuel liquid flows through the first channel to undergo anodic reaction, an oxidant liquid in the form of an aqueous hydrogen peroxide solution flows through the second channel to undergo cathodic reaction, and hydrogen ions traverse the electrolyte membrane.

    摘要翻译: 燃料电池包括具有一对槽的基板,位于基板上的电解质膜,以限定一对流动通道,以及设置在槽或内表面的内壁上的催化剂负载集流层部分 限定通道的电解质膜。 燃料液体流过第一通道进行阳极反应,过氧化氢水溶液形式的氧化剂液体流过第二通道进行阴极反应,氢离子穿过电解质膜。

    ULSI WIRING AND METHOD OF MANUFACTURING THE SAME
    38.
    发明申请
    ULSI WIRING AND METHOD OF MANUFACTURING THE SAME 有权
    ULSI接线及其制造方法

    公开(公告)号:US20100006326A1

    公开(公告)日:2010-01-14

    申请号:US12565448

    申请日:2009-09-23

    IPC分类号: H05K1/09 B05D5/12

    摘要: A method of manufacturing ULSI wiring in which wiring layers are separately formed via a diffusion prevention layer with an insulating interlayer portion made of SiO2. The method comprises the steps of treating, with a silane compound, an SiO2 surface on which the insulating interlayer portion is to be formed, performing catalyzation with an aqueous solution containing a palladium compound, forming the diffusion prevention layer by electroless plating, and then forming the wiring layer on this diffusion prevention layer. Furthermore, a capping layer is formed on the wiring layer by electroless plating. Consequently, the diffusion prevention layer having good adhesive properties can all be formed through a simple process by wet processes, and further, the wiring layer can directly be formed on this diffusion prevention layer by the wet process. In addition, the capping layer can directly be formed on this wiring layer by electroless plating.

    摘要翻译: 一种制造ULSI布线的方法,其中通过具有由SiO 2制成的绝缘夹层部分的扩散防止层分别形成布线层。 该方法包括以下步骤:用硅烷化合物处理要形成绝缘层间部分的SiO 2表面,用含有钯化合物的水溶液进行催化,通过无电镀形成扩散防止层,然后形成 该扩散防止层上的布线层。 此外,通过无电镀在配线层上形成覆盖层。 因此,具有良好粘合性的扩散防止层全部可以通过湿法的简单工艺形成,此外,可以通过湿法直接在该扩散防止层上形成布线层。 此外,可以通过无电解电镀直接在该布线层上形成覆盖层。