公开(公告)号：US5449310A

公开(公告)日：1995-09-12

申请号：US222597

申请日：1994-04-04

Applicant: Reinhard Stengl ,  Wolfgang Hoenlein

Inventor： Reinhard Stengl ,  Wolfgang Hoenlein

IPC: H01J1/304 ,  H01J9/02 ,  H01J21/10 ,  H01J1/30

CPC classification number: H01J1/3042 ,  H01J21/105 ,  H01J9/025 ,  H01J2201/30403 ,  H01J2201/30407

Abstract: Rod-shaped or cylindrical structures in the nm range on a substrate of silicon are manufactured. A first cylinder of silicon is selectively epitaxially deposited in the hole of a mask layer of oxide, and the mask layer is removed. The silicon is then oxidized to form an oxide layer having such a thickness that a thinner, second cylinder of silicon having practically the same height as the first cylinder remains. In a last step, this oxide layer is removed, so that the second cylinder forms a freestanding silicon rod on the surface of the substrate.

Abstract translation: 制造在硅衬底上的nm范围内的棒状或圆柱形结构。 硅的第一圆柱体被选择性地外延沉积在氧化物的掩模层的孔中，并且去除掩模层。 然后将硅氧化以形成具有这样厚度的氧化物层，使得具有与第一气缸几乎具有相同高度的较薄的第二硅柱体保持不变。 在最后一步中，去除该氧化物层，使得第二圆柱体在基底表面上形成独立的硅棒。

公开(公告)号：US4980742A

公开(公告)日：1990-12-25

申请号：US335362

申请日：1989-04-10

Applicant: Reinhard Stengl ,  Klaus G. Oppermann

Inventor： Reinhard Stengl ,  Klaus G. Oppermann

IPC: H01L29/744 ,  H01L29/06 ,  H01L29/10 ,  H01L29/36 ,  H01L29/74 ,  H01L29/749

CPC classification number: H01L29/0623 ,  H01L29/1016 ,  H01L29/36

Abstract: A turn-off thyristor whereby an n-base layer not contacted by a gate electrode has at least one thin semiconductor layer inserted into it that is oppositely doped. Its distance from a pn-junction between a p-base and the n-base is selected so small that the maximum field strength of the space charge zone building up at this pn-junction upon turn-off of the thyristor is limited to a non-critical value at which an avalanche breakdown with respect to the charge carriers to be cleared out does not yet occur.

Abstract translation: 一种截止晶闸管，其中不与栅电极接触的n基层具有插入其中的相对掺杂的至少一个薄半导体层。 其与p基极和n基极之间的pn结的距离被选择得很小，使得在晶闸管截止时在该pn结处积聚的空间电荷区域的最大场强被限制为非 - 相对于要清除的电荷载体的雪崩击穿的临界值尚未发生。

公开(公告)号：US06887437B1

公开(公告)日：2005-05-03

申请号：US09718902

申请日：2000-11-22

Applicant: Volker Lehmann ,  Stefan Ottow ,  Reinhard Stengl ,  Hans Reisinger ,  Hermann Wendt

Inventor： Volker Lehmann ,  Stefan Ottow ,  Reinhard Stengl ,  Hans Reisinger ,  Hermann Wendt

IPC: B01D50/00 ,  B01D53/34 ,  B01J19/00 ,  C23C16/02 ,  C23C16/26

CPC classification number: C23C16/26 ,  B01J19/0093 ,  B01J2219/00788 ,  B01J2219/00822 ,  B01J2219/00824 ,  B01J2219/00828 ,  B01J2219/00835 ,  B01J2219/00844 ,  B01J2219/00862 ,  C23C16/0245

Abstract: A reactor configuration contains a housing connected to a silicon wafer. The silicon wafer has pores extending from a first main area of the silicon wafer into an interior of the silicon wafer, preferably as far as a second main area of the silicon wafer. A catalyst layer at least partly covers the surface of the pores.

Abstract translation: 反应器构造包含连接到硅晶片的壳体。 硅晶片具有从硅晶片的第一主区域延伸到硅晶片的内部的孔，优选地直到硅晶片的第二主区域。 催化剂层至少部分地覆盖孔的表面。

公开(公告)号：US06614575B1

公开(公告)日：2003-09-02

申请号：US09636521

申请日：2000-08-10

Applicant: Ulrike Grüning ,  Volker Lehmann ,  Reinhard Stengl ,  Hermann Wendt ,  Hans Reisinger

Inventor： Ulrike Grüning ,  Volker Lehmann ,  Reinhard Stengl ,  Hermann Wendt ,  Hans Reisinger

IPC: G02F103

CPC classification number: B82Y20/00 ,  G02B6/1225

Abstract: An optical structure includes a substrate having semiconductor material and a grating structure. The grating structure has the property of emitting at least one frequency band so that light having a frequency from that frequency band cannot propagate in the grating structure. The grating structure has a configuration of pores and a defective region. The pores are disposed outside the defective region in a periodic array, and the periodic array is disturbed in the defective region. A surface of the grating structure is provided with a conductive layer at least in the vicinity of the defective region. A method for producing the optical structure is also provided.

Abstract translation: 光学结构包括具有半导体材料和光栅结构的衬底。 光栅结构具有发射至少一个频带的特性，使得具有来自该频带的频率的光不能在光栅结构中传播。 光栅结构具有孔和缺陷区的构造。 孔以周期性阵列设置在缺陷区域的外侧，并且周期性阵列在缺陷区域中受到干扰。 光栅结构的表面至少在缺陷区域附近设置有导电层。 还提供了一种用于制造光学结构的方法。

公开(公告)号：US06614066B2

公开(公告)日：2003-09-02

申请号：US10113418

申请日：2002-04-01

Applicant: Reinhard Stengl ,  Hans Reisinger ,  Thomas Haneder ,  Harald Bachhofer

Inventor： Reinhard Stengl ,  Hans Reisinger ,  Thomas Haneder ,  Harald Bachhofer

IPC: H01L2976

CPC classification number: H01L29/516 ,  H01L29/78391

Abstract: A first source-drain region, a channel region, and a second source-drain region are arranged one after another in a semiconductor substrate. At least the surface of the channel region and parts of the first source-drain region are covered by a dielectric layer. A ferroelectric layer is disposed on the surface of the dielectric layer between two polarization electrodes. A gate electrode is arranged on the surface of the dielectric layer. The thickness of the dielectric layer is dimensioned such that a remanent polarization of the ferroelectric layer, which is aligned between the two polarization electrodes, produces compensation charges in part of the channel region. The ferroelectric transistor is suitable as a memory cell for a memory cell configuration.

公开(公告)号：US6117790A

公开(公告)日：2000-09-12

申请号：US302655

申请日：1999-04-30

Applicant: Herbert Schafer ,  Martin Franosch ,  Reinhard Stengl ,  Gerrit Lange ,  Hans Reisinger ,  Hermann Wendt ,  Volker Lehmann

Inventor： Herbert Schafer ,  Martin Franosch ,  Reinhard Stengl ,  Gerrit Lange ,  Hans Reisinger ,  Hermann Wendt ,  Volker Lehmann

IPC: H01L21/02 ,  H01L21/8242 ,  H01L27/108 ,  H01L21/00

CPC classification number: H01L27/10852 ,  H01L27/10817 ,  H01L28/82

Abstract: A method for fabricating a capacitor for a semiconductor memory configuration. In this case, a selectively etchable material is applied to a conductive support, which is connected to a semiconductor body via a contact hole in an insulator layer, and patterned. A first conductive layer is applied thereon and patterned. A hole is introduced into the first conductive layer, through which hole the selectively etchable material is etched out. A cavity is produced under the first conductive layer in the process. The inner surface of the cavity and the outer surface of the first conductive layer are provided with a dielectric layer, to which a second conductive layer is applied and patterned.

Abstract translation: 一种制造用于半导体存储器配置的电容器的方法。 在这种情况下，将可选择的可蚀刻材料施加到导电支撑件，该导电支撑件通过绝缘体层中的接触孔连接到半导体本体并且被图案化。 在其上施加第一导电层并图案化。 在第一导电层中引入一个孔，通过该孔蚀刻可选择性蚀刻的材料。 在该过程中在第一导电层下方产生空腔。 空腔的内表面和第一导电层的外表面设置有电介质层，第二导电层被施加并图案化。

公开(公告)号：US6018174A

公开(公告)日：2000-01-25

申请号：US105580

申请日：1998-06-26

Applicant: Martin Schrems ,  Jack Mandelman ,  Joachim Hoepfner ,  Herbert Schaefer ,  Reinhard Stengl

Inventor： Martin Schrems ,  Jack Mandelman ,  Joachim Hoepfner ,  Herbert Schaefer ,  Reinhard Stengl

IPC: H01L27/04 ,  H01L21/822 ,  H01L21/8242 ,  H01L27/108 ,  H01L29/94 ,  H01L29/76

CPC classification number: H01L27/10861 ,  H01L29/945

Abstract: A bottle-shaped trench capacitor having an expanded lower trench portion with an epi layer therein. The epi layer serves as the buried plate of the trench capacitor. A diffusion region surrounds the expanded lower trench portion to enhance the dopant concentration of the epi layer. The diffusion region is formed by, for example, gas phase doping, plasma doping, or plasma immersion ion implantation.

Abstract translation: 一种瓶形沟槽电容器，其具有扩展的下沟槽部分，其中具有外延层。 外延层用作沟槽电容器的掩埋板。 扩散区域围绕扩展的下沟槽部分以增强外延层的掺杂剂浓度。 扩散区域通过例如气相掺杂，等离子体掺杂或等离子体浸入离子注入形成。

公开(公告)号：US5994746A

公开(公告)日：1999-11-30

申请号：US232083

申请日：1999-01-15

Applicant: Hans Reisinger ,  Reinhard Stengl ,  Franz Hofmann ,  Wolfgang Krautschneider ,  Josef Willer

Inventor： Hans Reisinger ,  Reinhard Stengl ,  Franz Hofmann ,  Wolfgang Krautschneider ,  Josef Willer

IPC: G11C17/08 ,  H01L21/8246 ,  H01L21/8247 ,  H01L27/112 ,  H01L27/115

CPC classification number: H01L27/11273 ,  H01L27/112

Abstract: The memory cell has transistors that are arranged three-dimensionally. Vertical MOS transistors are arranged on the sidewalls of semiconductor webs, and a plurality of transistors are arranged one above the other on each sidewall. The transistors that are arranged one above the other on a sidewall are connected in series.

Abstract translation: 存储单元具有三维布置的晶体管。 垂直MOS晶体管布置在半导体薄片的侧壁上，并且多个晶体管彼此并排设置在每个侧壁上。 在侧壁上一个上下配置的晶体管串联连接。

公开(公告)号：US5188977A

公开(公告)日：1993-02-23

申请号：US802811

申请日：1991-12-06

Applicant: Reinhard Stengl ,  Hans-Willi Meul ,  Wolfgang Hoenlein

Inventor： Reinhard Stengl ,  Hans-Willi Meul ,  Wolfgang Hoenlein

IPC: H01J1/30 ,  H01J1/304 ,  H01J9/02 ,  H01L21/20 ,  H01L21/306 ,  H01L45/00

CPC classification number: H01J9/025 ,  H01J1/3042 ,  H01L21/02381 ,  H01L21/02532 ,  H01L21/0262 ,  H01L21/02639 ,  H01J2201/30426 ,  Y10S148/05

Abstract: For manufacturing an electrically conductive tip composed of a doped semiconductor material, a mask layer is produced on a substrate composed of the semiconductor material. This mask layer contains a material at least at its surface and directly on the substrate whereon the semiconductor material does not grow in a selective epitaxy. An opening wherein the surface of the substrate lies exposed is produced in the mask layer. The electrically conductive tip is produced by a selective epitaxy on the exposed surface of the substrate such that the layer growth in the direction parallel to the surface of the substrate is lower than in the direction perpendicular to the surface of the substrate.

Abstract translation: 为了制造由掺杂半导体材料构成的导电尖端，在由半导体材料构成的基板上制造掩模层。 该掩模层至少在其表面包含材料，并且直接在衬底上，半导体材料不会在选择性外延生长中。 在掩模层中产生其中裸露表面露出的开口。 通过在衬底的暴露表面上的选择性外延产生导电尖端，使得沿与衬底表面平行的方向上的层生长低于垂直于衬底表面的方向。

公开(公告)号：US06518613B2

公开(公告)日：2003-02-11

申请号：US09968304

申请日：2001-10-01

Applicant: Josef Willer ,  Hans Reisinger ,  Till Schlosser ,  Reinhard Stengl

Inventor： Josef Willer ,  Hans Reisinger ,  Till Schlosser ,  Reinhard Stengl

IPC: H01L27108

CPC classification number: H01L27/10864 ,  H01L27/10867 ,  H01L27/1087

Abstract: A MOS transistor of a memory cell and a bit line connected thereto are disposed on a first surface of a substrate. A capacitor of the memory cell is disposed on a second surface of the substrate, the second surface being opposite to the first surface. A contact is disposed in the substrate and connects the capacitor to the MOS transistor.

Abstract translation: 存储单元的MOS晶体管和与其连接的位线设置在基板的第一表面上。 存储单元的电容器设置在基板的第二表面上，第二表面与第一表面相对。 接触件设置在衬底中并将电容器连接到MOS晶体管。