公开(公告)号：US20110284162A1

公开(公告)日：2011-11-24

申请号：US12913789

申请日：2010-10-28

Applicant: ZONG-QING CAI ,  TUNG-YAO KUO

Inventor： ZONG-QING CAI ,  TUNG-YAO KUO

IPC: H01L21/306

CPC classification number: C23F1/08 ,  B05B12/122 ,  B05B13/0221 ,  H05K3/0085 ,  H05K2203/075 ,  H05K2203/1509 ,  H05K2203/1545

Abstract: An exemplary apparatus for wet processing a substrate includes a conveyor configured for conveying the substrate along a conveying direction and parallel spray pipes. The spray pipes are substantially parallel with the conveyor and substantially perpendicular to the conveying direction. Each spray pipe consisting of at least one spray nozzle faces the conveyor, and the number of the at least one nozzle of each spray pipe increases along the conveying direction.

Abstract translation: 用于湿处理基材的示例性装置包括：输送器，其构造成沿输送方向和平行的喷射管输送基板。 喷射管基本上平行于输送机并且基本上垂直于输送方向。 由至少一个喷嘴组成的每个喷管面向输送机，并且每个喷射管的至少一个喷嘴的数量沿输送方向增加。

公开(公告)号：US08042265B2

公开(公告)日：2011-10-25

申请号：US11957324

申请日：2007-12-14

Applicant: Jun-Qing Zhang ,  Chih-Yi Tu ,  Szu-Min Huang

Inventor： Jun-Qing Zhang ,  Chih-Yi Tu ,  Szu-Min Huang

IPC: H05K3/46

CPC classification number: H05K3/4697 ,  H05K1/0393 ,  H05K3/4611 ,  H05K3/4635 ,  H05K2201/0394 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2203/061 ,  H05K2203/063 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: A method for manufacturing a multilayer FPCB includes the steps of: providing a first substrate, a second substrate and a binder layer; defining an opening on the binder layer; defining a first slit in the dielectric layer of the first substrate; laminating the first substrate, the binder layer and the second substrate; forming a second slit in the conductive layer of the first substrate, the second slit is configured to be aligned with the first slit, cutting the first substrate, the binder layer and the second substrate thereby forming a multilayer flexible printed circuit board having different numbers of layers in different areas.

Abstract translation: 一种制造多层FPCB的方法包括以下步骤：提供第一基板，第二基板和粘合剂层; 在粘合剂层上限定开口; 限定所述第一基板的介电层中的第一狭缝; 层压第一基板，粘合剂层和第二基板; 在所述第一基板的导电层中形成第二狭缝，所述第二狭缝被构造成与所述第一狭缝对准，切割所述第一基板，所述粘合剂层和所述第二基板，从而形成具有不同数量的多层柔性印刷电路板 不同领域的层次。

公开(公告)号：US08009432B2

公开(公告)日：2011-08-30

申请号：US11847300

申请日：2007-08-29

Applicant: Ying Su ,  Wei Huang ,  I-Hsien Chiang

Inventor： Ying Su ,  Wei Huang ,  I-Hsien Chiang

IPC: H05K5/00

CPC classification number: H05K3/00 ,  H05K1/189 ,  H05K2203/0173 ,  H05K2203/085

Abstract: An exemplary mounting support for a flexible printed circuit board is provided. The flexible printed circuit board has a side surface and at least one electronic component mounted on the side surface. The mounting support includes a first surface for contacting with the side surface of the flexible printed circuit board and a second surface on an opposite side of the mounting support to the first surface. The mounting support has at least one first recess defined in the first surface for receiving the at least one electronic component therein and at least one through-hole defined through the first surface and the second surface. The mounting support has at least one second recess defined in the second surface. The mounting support can fix a double surface mounted flexible printed circuit board flatly, thereby enhancing laser processing precision.

Abstract translation: 提供了一种用于柔性印刷电路板的示例性安装支撑件。 柔性印刷电路板具有侧表面和安装在侧表面上的至少一个电子部件。 安装支撑件包括用于与柔性印刷电路板的侧表面接触的第一表面和与安装支撑件相对的第一表面到第一表面的第二表面。 安装支撑件具有限定在第一表面中的至少一个第一凹部，用于容纳至少一个电子部件和至少一个通过第一表面和第二表面限定的通孔。 安装支架具有限定在第二表面中的至少一个第二凹部。 安装支架可以平整地固定双面安装的柔性印刷电路板，从而提高激光加工精度。

公开(公告)号：US07987586B2

公开(公告)日：2011-08-02

申请号：US12274190

申请日：2008-11-19

Applicant: Dong-Qing He ,  Ming Wang ,  Yun-Li Zhu ,  Wen-Chin Lee

Inventor： Dong-Qing He ,  Ming Wang ,  Yun-Li Zhu ,  Wen-Chin Lee

IPC: H05K3/36

CPC classification number: H05K3/4691 ,  H05K3/386 ,  H05K3/4652 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2203/063 ,  H05K2203/308 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A method for manufacturing a printed circuit board (PCB) having different thicknesses in different areas includes: providing a first substrate having two lateral unwanted portions bounded two imaginary boundary lines, a binder layer having a through opening and a second substrate having a mounting area for mounting electronic elements; forming two slots bounded the imaginary boundary lines in an intermediated unwanted portion of the first substrate corresponding to the mounting area; laminating the first and second substrates, and the binder layer with the mounting area exposed via the through opening; filling the two slots and the through opening with a filling material, thereby obtaining a semifinished PCB board; cutting the semifinished PCB board along the imaginary boundary lines to remove the two lateral unwanted portions and a portion of the second substrate corresponding to the two lateral unwanted portions; and removing the intermediate unwanted portion and the filling material.

Abstract translation: 一种用于制造在不同区域中具有不同厚度的印刷电路板（PCB）的方法包括：提供具有限定两个假想边界线的两个横向不需要部分的第一基板，具有通孔的粘合剂层和具有用于 安装电子元件; 在对应于安装区域的第一基板的中间不想要的部分中形成限定虚拟边界线的两个槽; 层叠第一和第二基板和粘合剂层，其中安装区域经由通孔暴露; 用填充材料填充两个槽和通孔，从而获得半成品PCB板; 沿着虚拟边界线切割半成品PCB板，以去除对应于两个横向不需要部分的两个横向不需要部分和第二基板的一部分; 并去除中间不需要的部分和填充材料。

公开(公告)号：US07943490B2

公开(公告)日：2011-05-17

申请号：US12051687

申请日：2008-03-19

Applicant: Ying Su ,  Hu-Hai Zhang ,  Huan-Long Lin

Inventor： Ying Su ,  Hu-Hai Zhang ,  Huan-Long Lin

IPC: H01L21/46

CPC classification number: H05K3/0032 ,  H05K3/0052 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2203/0191 ,  H05K2203/1383

Abstract: The present invention relates to a method of cutting PCB module using a laser. The method includes steps of: providing a coverlay film, the coverlay film including at least one opening defined therein; attaching the coverlay film onto the PCB module such that the through holes of the PCB module are covered by the coverlay film and the laser cutting area thereof is exposed via the at least one opening; applying a laser beam to the exposed laser cutting area of the PCB module to cut the PCB module; and removing the coverlay film. A high positioning precision of the PCB module and better cutting result can be obtained.

Abstract translation: 本发明涉及使用激光切割PCB模块的方法。 该方法包括以下步骤：提供覆盖膜，所述覆盖膜包括限定在其中的至少一个开口; 将所述覆盖膜附着到所述PCB模块上，使得所述PCB模块的通孔被所述覆盖膜覆盖，并且所述激光切割区域经由所述至少一个开口暴露; 将激光束施加到PCB模块的暴露的激光切割区域以切割PCB模块; 并移除覆盖膜。 可以获得PCB模块的高定位精度和更好的切割效果。

公开(公告)号：US07916499B2

公开(公告)日：2011-03-29

申请号：US12055587

申请日：2008-03-26

Applicant: Yong-Hui Feng ,  I-Hsien Chiang ,  Cheng-Hsien Lin

Inventor： Yong-Hui Feng ,  I-Hsien Chiang ,  Cheng-Hsien Lin

IPC: H05K7/14 ,  H05K7/18

CPC classification number: H05K13/0069

Abstract: In one embodiment, a holder for holding printed circuit boards includes a base plate with a plurality of holding unit formed thereon. Each of the holding units includes a spring member, a securing member, and a blocking structure. The spring member includes a first end and a second end. The first end is attached to the base plate. The securing member is slideably mounted on the base plate. The securing member includes a connecting end and a securing end. The connecting end is connected with the second end of the spring member. The blocking structure is located on the base plate. The spring member is configured for pressing the securing member to move toward the blocking structure such that a printed circuit board is retainable between the securing end of the securing member and the blocking structure on the base plate. The holder is capable of holding printed circuit boards in batches.

Abstract translation: 在一个实施例中，用于保持印刷电路板的保持器包括在其上形成有多个保持单元的基板。 每个保持单元包括弹簧构件，固定构件和阻挡结构。 弹簧构件包括第一端和第二端。 第一端连接到基板。 固定构件可滑动地安装在基板上。 固定构件包括连接端和固定端。 连接端与弹簧构件的第二端连接。 阻挡结构位于基板上。 弹簧构件构造成用于按压固定构件朝向阻挡结构移动，使得印刷电路板可保持在固定构件的固定端和基板上的阻挡结构之间。 支架能够分批装载印刷电路板。

公开(公告)号：US07839647B2

公开(公告)日：2010-11-23

申请号：US12346804

申请日：2008-12-30

Applicant: Wen-Chin Lee ,  Cheng-Hsien Lin

Inventor： Wen-Chin Lee ,  Cheng-Hsien Lin

IPC: H05K1/00

CPC classification number: H05K3/4641 ,  B82Y10/00 ,  H05K1/056 ,  H05K9/0088 ,  H05K2201/026 ,  H05K2201/0323 ,  Y10S977/70 ,  Y10S977/701 ,  Y10S977/712 ,  Y10S977/734 ,  Y10T428/24116 ,  Y10T428/30 ,  Y10T442/10

Abstract: An insulating film includes a first polymer layer, a second polymer layer and an electromagnetic shielding layer sandwiched between the first polymer layer and the second polymer layer. The electromagnetic shielding layer includes a number of carbon nanotube films that are substantially parallel to the first and second polymer layer. Each of the carbon nanotube films includes a number of carbon nanotubes that are substantially parallel to each other. The insulating film can provide anti-EMI effect in printed circuit boards without employing additional electromagnetic shielding layers.

Abstract translation: 绝缘膜包括第一聚合物层，第二聚合物层和夹在第一聚合物层和第二聚合物层之间的电磁屏蔽层。 电磁屏蔽层包括大致平行于第一和第二聚合物层的多个碳纳米管薄膜。 每个碳纳米管膜包括基本上彼此平行的多个碳纳米管。 绝缘膜可以在印刷电路板中提供抗电磁效应，而不需要额外的电磁屏蔽层。

公开(公告)号：US07728232B2

公开(公告)日：2010-06-01

申请号：US11964578

申请日：2007-12-26

Applicant: Feng-Yan Huang ,  Shing-Tza Liou

Inventor： Feng-Yan Huang ,  Shing-Tza Liou

IPC: H05K1/00

CPC classification number: H05K1/118 ,  C09J7/10 ,  C09J2201/40 ,  C09J2201/606 ,  C09J2433/00 ,  H05K3/0058 ,  H05K3/323 ,  H05K3/386 ,  H05K2201/0187 ,  H05K2201/055 ,  H05K2201/056 ,  H05K2201/10378 ,  H05K2201/2009 ,  Y10T428/28 ,  Y10T428/2848 ,  Y10T428/2857

Abstract: An exemplary adhesive layer includes an adhesive main body having a first adhesive surface and a second adhesive surface on an opposite side of the adhesive main body to the first adhesive surface. The adhesive main body defines a number of through-holes between the first adhesive surface and the second adhesive surface therein. The through-holes are filled with an inner adhesive that has a higher adhesion than the adhesive main body. Adhesiveness of the first adhesive surface and the second adhesive surface of the adhesive main body can be improved, thereby preventing a printed circuit board having the adhesive layer from distortion.

Abstract translation: 示例性粘合剂层包括粘合剂主体，其具有第一粘合剂表面和在粘合剂主体的与第一粘合剂表面相对的一侧上的第二粘合剂表面。 粘合剂主体在第一粘合剂表面和第二粘合剂表面之间限定多个通孔。 通孔填充有比粘合剂主体具有更高粘合力的内部粘合剂。 可以提高粘合剂主体的第一粘合剂表面和第二粘合剂表面的粘附性，从而防止具有粘合剂层的印刷电路板变形。

公开(公告)号：US20100059910A1

公开(公告)日：2010-03-11

申请号：US12535909

申请日：2009-08-05

Applicant: WEN-TSUN CHEN ,  SHIN-CHIH LIAW ,  TAO-MING LIAO ,  CHIA-HUNG SHEN ,  CHENG-HSIEN LIN

Inventor： WEN-TSUN CHEN ,  SHIN-CHIH LIAW ,  TAO-MING LIAO ,  CHIA-HUNG SHEN ,  CHENG-HSIEN LIN

IPC: C22B3/02

CPC classification number: C22B7/006 ,  C02F2101/20 ,  C02F2103/346 ,  C22B3/02 ,  C22B3/46 ,  C22B15/0091 ,  Y02P10/234 ,  Y02P10/236

Abstract: An apparatus for recycling metals from metal ions containing waste solution includes a conveying device, a reducing agent supplier and a solution supplier. The conveying device includes a first ferromagnetic conveyor belt, a first roller, and a second roller. The first and second rollers are substantially horizontally arranged, and the second roller is arranged at a lower position relative to the first roller and spaced from the first roller. The ferromagnetic conveyor belt is wrapped around the first and second rollers. The reducing agent supplier is used for supplying a reducing agent onto the first conveyor belt, the ferromagnetic conveyor belt is capable of conveying the reducing agent from the second roller to the first roller. The solution supplier is configured for supplying the waste solution onto the first conveyor belt.

Abstract translation: 用于从含金属离子的废液中回收金属的设备包括输送装置，还原剂供应商和溶液供应商。 输送装置包括第一铁磁输送带，第一辊和第二辊。 第一和第二辊基本上是水平布置的，并且第二辊布置在相对于第一辊子的下部位置并与第一辊子间隔开。 铁磁输送带缠绕在第一和第二辊子周围。 还原剂供应器用于将还原剂供应到第一传送带上，铁磁传送带能够将还原剂从第二辊输送到第一辊。 解决方案供应商被配置为将废溶液供应到第一传送带上。

公开(公告)号：US20090286006A1

公开(公告)日：2009-11-19

申请号：US12327621

申请日：2008-12-03

Applicant: CHENG-HSIEN LIN ,  QIU-YUE ZHANG ,  YAO-WEN BAI

Inventor： CHENG-HSIEN LIN ,  QIU-YUE ZHANG ,  YAO-WEN BAI

IPC: C09D11/00 ,  B05D3/06

CPC classification number: H05K3/182 ,  C09D11/38 ,  C09D11/52 ,  C23C18/14 ,  C23C18/1608 ,  C23C18/161 ,  C23C18/1651 ,  C23C18/405 ,  C23C18/44 ,  H05K3/105 ,  H05K2203/013 ,  H05K2203/1157

Abstract: An exemplary ink for forming electrical traces includes an aqueous carrier medium, a palladium salt and a reducing agent. The palladium salt is capable of being dissolved in the aqueous carrier medium. The reducing agent is configured for reducing the palladium ions into palladium particles under an irradiation ray.

Abstract translation: 用于形成电迹线的示例性油墨包括水性载体介质，钯盐和还原剂。 钯盐能够溶解在载体介质中。 还原剂被配置为在照射光线下将钯离子还原成钯颗粒。