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    Method of manufacturing FPCB substrate
    1.
    发明授权
    Method of manufacturing FPCB substrate 失效
    FPCB基板的制造方法

    公开(公告)号：US08453324B2

    公开(公告)日：2013-06-04

    申请号：US13306811

    申请日：2011-11-29

    申请人： Rui-Wu Liu ,  Yung-Wei Lai ,  Shing-Tza Liou

    发明人： Rui-Wu Liu ,  Yung-Wei Lai ,  Shing-Tza Liou

    IPC分类号： H01K3/10

    CPC分类号： H05K3/4084 ,  H05K3/326 ,  H05K2201/0397 ,  H05K2201/10598 ,  H05K2203/0165 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T29/49167

    摘要： A method for manufacturing a FPCB substrate includes the following steps. First, a FPCB material including an insulation layer and an electrically conductive layer formed on the insulation layer is provided. The electrically conductive layer has a first surface and an opposite second surface. The insulation layer has a third surface and an opposite fourth surface. The third surface comes into contact with the second surface. Secondly, a through hole extends from the first surface to the fourth surface is formed. The through hole includes a metal hole in the electrically conductive layer and an insulation hole in the insulation layer. Thirdly, the insulation hole is enlarged to expose a portion of the electrically conductive layer around the metal hole. Finally, the exposed portion is bent to form a hook which passes through the enlarged insulation hole and protrudes out from the fourth surface of the insulation layer.

    摘要翻译： FPCB基板的制造方法包括以下步骤。 首先，提供一种包含绝缘层和形成在绝缘层上的导电层的FPCB材料。 导电层具有第一表面和相对的第二表面。 绝缘层具有第三表面和相对的第四表面。 第三表面与第二表面接触。 其次，形成从第一表面延伸到第四表面的通孔。 通孔包括导电层中的金属孔和绝缘层中的绝缘孔。 第三，扩大绝缘孔，使金属孔周围的一部分导电层露出。 最后，暴露部分被弯曲以形成通过扩大的绝缘孔并从绝缘层的第四表面突出的钩。

    Flexible printed circuit board
    4.
    发明授权
    Flexible printed circuit board 有权
    柔性印刷电路板

    公开(公告)号：US07511962B2

    公开(公告)日：2009-03-31

    申请号：US11960656

    申请日：2007-12-19

    申请人： Ning Hou ,  Shing-Tza Liou

    发明人： Ning Hou ,  Shing-Tza Liou

    IPC分类号： H05K1/00

    CPC分类号： H05K1/0281 ,  H05K2201/09263 ,  H05K2201/09781 ,  H05K2201/09909 ,  H05K2201/2009

    摘要： A flexible printed circuit board includes a flexible base, a working trace region, and at least one reinforcement trace. The working trace region and the at least one reinforcement trace are formed on the flexible base. The working trace is formed by a number of working traces. In the flexible base, the at least one reinforcement trace is disposed at a periphery of the working trace region.

    摘要翻译： 柔性印刷电路板包括柔性基座，工作迹线区域和至少一个加强迹线。 工作轨迹区域和至少一个加强迹线形成在柔性基座上。 工作痕迹由多条工作痕迹组成。 在柔性基座中，至少一个加强迹线设置在工作轨迹区域的周边。

    METHOD FOR FORMING CIRCUIT IN MAKING PRINTED CIRCUIT BOARD
    5.
    发明申请
    METHOD FOR FORMING CIRCUIT IN MAKING PRINTED CIRCUIT BOARD 审中-公开
    在制作印刷电路板上形成电路的方法

    公开(公告)号：US20090178276A1

    公开(公告)日：2009-07-16

    申请号：US12184942

    申请日：2008-08-01

    申请人： YUNG-WEI LAI ,  FENG-YAN HUANG ,  SHING-TZA LIOU

    发明人： YUNG-WEI LAI ,  FENG-YAN HUANG ,  SHING-TZA LIOU

    IPC分类号： H05K3/02

    CPC分类号： H05K3/048 ,  H05K3/146 ,  H05K3/388 ,  Y10T29/49155

    摘要： A method for forming circuit in making a printed circuit board includes the following steps. A patterned photoresist layer is formed on a surface of an insulating substrate such that a first portion of the surface of the insulating substrate is exposed and a second portion of the surface of the insulating substrate is covered by the patterned photoresist layer. An electrically conductive layer is deposited on the first portion of the surface of the insulating substrate so as to obtain a circuit formed on the surface of the insulating substrate. The patterned photoresist layer is removed from the surface second portion of the surface of the insulating substrate.

    摘要翻译： 一种用于在制造印刷电路板中形成电路的方法包括以下步骤。 图案化的光致抗蚀剂层形成在绝缘基板的表面上，使得绝缘基板的表面的第一部分被暴露，并且绝缘基板的表面的第二部分被图案化的光致抗蚀剂层覆盖。 在绝缘基板的表面的第一部分上沉积导电层，以获得在绝缘基板的表面上形成的电路。 从绝缘基板的表面的表面第二部分去除图案化的光致抗蚀剂层。

    METHOD OF MANUFACTURING FPCB SUBSTRATE
    8.
    发明申请
    METHOD OF MANUFACTURING FPCB SUBSTRATE 失效
    制造FPCB基板的方法

    公开(公告)号：US20120066903A1

    公开(公告)日：2012-03-22

    申请号：US13306811

    申请日：2011-11-29

    申请人： RUI-WU LIU ,  YUNG-WEI LAI ,  SHING-TZA LIOU

    发明人： RUI-WU LIU ,  YUNG-WEI LAI ,  SHING-TZA LIOU

    IPC分类号： H05K3/42

    CPC分类号： H05K3/4084 ,  H05K3/326 ,  H05K2201/0397 ,  H05K2201/10598 ,  H05K2203/0165 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T29/49167

    摘要： A method for manufacturing a FPCB substrate includes the following steps. First, a FPCB material including an insulation layer and an electrically conductive layer formed on the insulation layer is provided. The electrically conductive layer has a first surface and an opposite second surface. The insulation layer has a third surface and an opposite fourth surface. The third surface comes into contact with the second surface. Secondly, a through hole extends from the first surface to the fourth surface is formed. The through hole includes a metal hole in the electrically conductive layer and an insulation hole in the insulation layer. Thirdly, the insulation hole is enlarged to expose a portion of the electrically conductive layer around the metal hole. Finally, the exposed portion is bent to form a hook which passes through the enlarged insulation hole and protrudes out from the fourth surface of the insulation layer.

    摘要翻译： FPCB基板的制造方法包括以下步骤。 首先，提供一种包含绝缘层和形成在绝缘层上的导电层的FPCB材料。 导电层具有第一表面和相对的第二表面。 绝缘层具有第三表面和相对的第四表面。 第三表面与第二表面接触。 其次，形成从第一表面延伸到第四表面的通孔。 通孔包括导电层中的金属孔和绝缘层中的绝缘孔。 第三，扩大绝缘孔，使金属孔周围的一部分导电层露出。 最后，暴露部分被弯曲以形成通过扩大的绝缘孔并从绝缘层的第四表面突出的钩。

    Method of manufacturing multilayer printed circuit board having buried holes
    9.
    发明授权
    Method of manufacturing multilayer printed circuit board having buried holes 有权
    具有埋孔的多层印刷电路板的制造方法

    公开(公告)号：US08052881B2

    公开(公告)日：2011-11-08

    申请号：US12164422

    申请日：2008-06-30

    申请人： Yun-Li Zhu ,  Yung-Wei Lai ,  Shing-Tza Liou

    发明人： Yun-Li Zhu ,  Yung-Wei Lai ,  Shing-Tza Liou

    IPC分类号： H05K13/00

    CPC分类号： H05K3/4638 ,  H05K1/0269 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4617 ,  H05K2201/09063 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/0156 ,  H05K2203/166 ,  Y10T29/49128 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T156/10

    摘要： A method for manufacturing a multilayer printed circuit board includes the following steps. A number of laminate units are provided. Each of the laminate units includes an electrically conductive layer with a circuit pattern defined therein, and a release layer releasably attached to the electrically conductive layer. A number of insulation layers are provided. Each of the insulation layers definies a metalized through hole therein. The electrically conductive layers and the insulation layers are stacked alternately one on another such that adjacent electrically conductive layers are insulated by one insulation layer and the metalized through holes electrically connects the circuit patterns of the adjacent electrically conductive layers. In the stacking step, the release layer is removed from the laminate unit after the electrically conductive layer is stacked onto the respective insulation layer, thereby obtaining a pre-laminated multilayer printed circuit board. The stacked electrically conductive layers and the insulation layers are laminated together to achieve a multilayer printed circuit board.

    摘要翻译： 一种制造多层印刷电路板的方法包括以下步骤。 提供了许多层压单元。 每个层压单元包括其中限定有电路图案的导电层和可剥离地附接到导电层的剥离层。 提供了许多绝缘层。 每个绝缘层在其中确定了金属化的通孔。 导电层和绝缘层交替地堆叠在一起，使得相邻的导电层被一个绝缘层绝缘，并且金属化的通孔电连接相邻的导电层的电路图案。 在堆叠步骤中，在将导电层堆叠在各绝缘层上之后，从层压单元中去除剥离层，从而获得预层压多层印刷电路板。 层叠的导电层和绝缘层被层叠在一起以实现多层印刷电路板。

    Printed circuit board assembly having adhesive layer
    10.
    发明授权
    Printed circuit board assembly having adhesive layer 有权
    具有粘合剂层的印刷电路板组件

    公开(公告)号：US07728232B2

    公开(公告)日：2010-06-01

    申请号：US11964578

    申请日：2007-12-26

    申请人： Feng-Yan Huang ,  Shing-Tza Liou

    发明人： Feng-Yan Huang ,  Shing-Tza Liou

    IPC分类号： H05K1/00

    CPC分类号： H05K1/118 ,  C09J7/10 ,  C09J2201/40 ,  C09J2201/606 ,  C09J2433/00 ,  H05K3/0058 ,  H05K3/323 ,  H05K3/386 ,  H05K2201/0187 ,  H05K2201/055 ,  H05K2201/056 ,  H05K2201/10378 ,  H05K2201/2009 ,  Y10T428/28 ,  Y10T428/2848 ,  Y10T428/2857

    摘要： An exemplary adhesive layer includes an adhesive main body having a first adhesive surface and a second adhesive surface on an opposite side of the adhesive main body to the first adhesive surface. The adhesive main body defines a number of through-holes between the first adhesive surface and the second adhesive surface therein. The through-holes are filled with an inner adhesive that has a higher adhesion than the adhesive main body. Adhesiveness of the first adhesive surface and the second adhesive surface of the adhesive main body can be improved, thereby preventing a printed circuit board having the adhesive layer from distortion.

    摘要翻译： 示例性粘合剂层包括粘合剂主体，其具有第一粘合剂表面和在粘合剂主体的与第一粘合剂表面相对的一侧上的第二粘合剂表面。 粘合剂主体在第一粘合剂表面和第二粘合剂表面之间限定多个通孔。 通孔填充有比粘合剂主体具有更高粘合力的内部粘合剂。 可以提高粘合剂主体的第一粘合剂表面和第二粘合剂表面的粘附性，从而防止具有粘合剂层的印刷电路板变形。