Abstract:
A powdery layer is formed on a first side of a web (W) which serves as a substrate by applying electrically charged particles on the web while a rotating grounding electrode is located at a second side of the web.
Abstract:
A method of fabricating an inkjet printhead chip which includes the step of fabricating drive circuitry layers on a substrate with a CMOS fabrication process. A first sacrificial layer is deposited on the substrate. A heater layer for heating circuits is deposited on the first sacrificial layer and etched to form the heating circuits. A resiliently flexible layer of dielectric material is deposited on the substrate to cover the heater layer and etched to form actuators and ink ejection members. A second sacrificial layer is deposited on the substrate to cover the actuators and the ink ejection members and etched to define deposition zones for the nozzle chamber walls and the roof walls. A layer of a structural material is deposited on the second sacrificial layer to form the nozzle chamber walls and the roof walls. The sacrificial layers are finally etched away.
Abstract:
A continuous web having a first surface and a second surface is coated with a coating powder by allowing the web to move between a first and a second electrode, which are in different potentials and are located on the opposite sides of the web, applying the coating powder on the surface of the web by utilizing the difference in the electric potential, and finishing the coated surface of the web. Both surfaces of the web are coated essentially simultaneously by using oppositely charged electrodes.
Abstract:
A coating composition for coating plastic substrates is disclosed which comprises at least one hydroxyl-functional film forming polymer, at least one polyisocyanate compound; and a novel adhesion promoter additive. The adhesion promoter additive comprises (A) at least one modified polyolefin; and (B) at least one component selected from the group consisting of monohydric alcohols, epoxy functional silanes, and mixtures thereof. The invention also relates to coated plastic substrates and method of coating such substrates.
Abstract:
A printhead integrated circuit comprising a drive circuitry and a plurality of nozzles is provided. Each nozzle comprises a chamber for holding ink to be ejected, the chamber having an opening defined in a roof structure; and a thermal bend actuator for ejecting droplets of ink from the chamber through the opening. The bend actuator is configured as a cantilever with one end of the cantilever anchored to a base and the opposite end supporting a paddle. The actuator has a deflector section constructed of a material having a high coefficient of thermal expansion and a barrier layer constructed of a dielectric material having low thermal conductivity. A supply of current from the drive circuitry to the deflector section causes differential thermal expansion between the deflector section and the barrier layer, such that the actuator bends and the paddle ejects a droplet of ink from the nozzle.
Abstract:
An inkjet printhead chip includes a substrate that incorporates drive circuitry. A plurality of nozzle arrangements is positioned on the substrate. Each nozzle arrangement includes a nozzle chamber wall and a roof wall positioned on the substrate to define a nozzle chamber, the roof wall defining an ink ejection port in fluid communication with the nozzle chamber. The nozzles are densely packed on the printhead substrate for greater resolution and print quality. The nozzles are arranged in rows with each row offset relative to its adjacent rows to reduce the effective nozzle pitch across the printhead. The printhead is high speed and energy efficient by ejecting relatively low mass drops at a high frequency.
Abstract:
An ink jet print head chip that includes a substrate that defines a plurality of ink inlet channels. A plurality of nozzle chamber structures is on the substrate to define nozzle chambers in fluid communication with the ink inlet channels and an ink ejection nozzle in fluid communication with each nozzle chamber. Drive transistor circuitry is positioned on the substrate and is connectable to data and power supplies. A plurality of elongate actuators are each fast with the substrate at one end to receive actuating signals from the drive transistor circuitry to be displaceable towards and away from the substrate. A plurality of ink ejection members is fast with respective actuators at opposite ends. Each ink ejection member is positioned in a respective nozzle chamber such that displacement of the respective actuators results in the ejection of a drop of ink from the ink ejection nozzle. The transistor circuitry includes traces that are interposed between each actuator and the substrate and oriented substantially orthogonally to a longitudinal axis of each respective actuator.
Abstract:
A method for preliminary treatment of particles of a powder in a dry surface treatment process before applying the powder particles on a surface of a substrate by utilizing an electric field created by electrodes. The Electrodes are located at opposite sides of the substrate in such a way that at least one first electrode is located at the side of the substrate to be coated, and at least one second electrode is located at the opposites side of the substrate. The particles of the powder are pre-charged before bringing them into the electric field.
Abstract:
A pagewidth color printhead assembly includes an ink distribution arrangement. A plurality of printhead chips is mounted on the ink distribution arrangement to span a print medium feed path. Each printhead chip includes a substrate that defines a plurality of ink supply channels. A plurality of ink-ejecting nozzles is arranged on the substrate in fluid communication with the ink supply channels. The nozzles are arranged in groups, with each group of nozzles being in fluid communication with a respective ink supply channel and the groups of nozzles being arranged in at least three rows, each row of nozzles receiving ink of the same color.
Abstract:
The present invention is to provide a method of enhancement of electrical conductivity for conductive polymer by use of field effect control, wherein on the substrate, whose surface was treated with a field, was coated by a containing monomer or oligomer solution of conductive polymer, through a field mechanism a monomer or oligomer of conductive polymer can demonstrate the sequential order molecular structure layer on the substrate, on this molecular structure layer was coated by an available amount of oxidant to proceed the polymerization, it was subjected to a field during polymerization to form 3-dimensional order stacking structure in order to increase the functional characteristic and electrical conductivity for conductive polymer.