Abstract:
The present invention provides microfluidic devices, systems and methods for using the same, which facilitate the introduction of fluid to and from a microfluidic channel located within the microfluidic devices.
Abstract:
A MEMS microconnector including a compliant handle and a deflectable connection member. The compliant handle is configured to frictionally engage a manipulation probe. The deflectable connection member includes a first end coupled to the handle and a second end configured to deflect and thereby engage a receptacle in response to disengagement of the manipulation probe from the handle.
Abstract:
A method and system for locally connecting microstructures and devices formed thereby are provided wherein localized solder-bonding creates bonds between pairs of microstructures found on miniature flexible cables and silicon microsystem platforms. Multi-lead contact to the pads are detected automatically, triggering an embedded heater or heaters to initiate solder melting. This approach enables delicate microstructures to be connected and disconnected from microsystem platforms in the field, and is implemented with a process that is compatible with monolithic integration of circuits.
Abstract:
A connector for a stencil-based microfluidic device is provided. A planar substrate is affixed to the stencil-based microfluidic structure. A nipple is formed in the substrate. The tip of the nipple is flush with or recessed from the surface of the substrate to avoid interference with fabrication tools and processes.
Abstract:
A method is disclosed to form external interconnections to a microfluidic device for coupling of a fluid or light or both into a microchannel of the device. This method can be used to form optical or fluidic interconnections to microchannels previously formed on a substrate, or to form both the interconnections and microchannels during the same process steps. The optical and fluidic interconnections are formed parallel to the plane of the substrate, and are fluid tight.
Abstract:
A system and method which provide a general-purpose pressure-fitting receptacle (or “clamp”) suitable for coupling microcomponents are disclosed. A pressure-fitting receptacle is disclosed that is suitable for performing general assembly, including out-of-plane, 3-D assembly of microcomponents, wherein such microcomponents may be securely coupled together. That is, a pressure-fitting receptacle is disclosed which enables microcomponents to be coupled in a manner that constrains undesirable movement of the coupled components relative to each other. Preferably, such a receptacle may be pressure fit with a mating component (or a portion thereof) in a manner that constrains translational and rotational degrees of freedom of the mating component relative to the receptacle. A preferred embodiment provides a “preloaded” receptacle that may be utilized to perform general assembly of microcomponents. An alternative embodiment provides a non-preloaded receptacle suitable for performing general assembly of microcomponents. Still a further alternative embodiment provides an “expansion” receptacle that is suitable for performing general assembly of microcomponents. Such pressure-fitting receptacles may be implemented as an integrated part of a microcomponent, or they may be implemented as separate, stand-alone receptacles.
Abstract:
A microlamp for holding a micropart in a desired position comprising a substrate (12) having an upper surface and a lower surface, and defining a throughhole (20) extending from the upper surface to the lower surface to have an upper opening and a lower opening; at least one first holding element (11, 15) secured to the substrate and provided at the upper end of the throughhole; and at least one second holding element (13, 14) secured to the substrate and provided at the lower end of the throughhole; the first and second holding elements arranged such that when, in use, the micropart is inserted into the throughhole it is held at least partially by the first and second holding elements such that it is located in the desired position along at least one direction perpendicular to the longitudinal axis of the hole.