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公开(公告)号：US4708484A
公开(公告)日：1987-11-24
申请号：US789778
申请日：1985-10-21
Applicant: Yoshihiro Komeyama , Yukio Kembo , Asahiro Kuni , Ryuuichi Funatsu , Akira Inagaki , Minoru Ikeda , Keiichi Okamoto
Inventor： Yoshihiro Komeyama , Yukio Kembo , Asahiro Kuni , Ryuuichi Funatsu , Akira Inagaki , Minoru Ikeda , Keiichi Okamoto
CPC classification number: G03F9/7023 , G03F9/7049 , G03F9/7076
Abstract: The present invention relates, in a projection aligner wherein a mask and a wafer are held proximate to one another and wherein a circuit pattern depicted on the mask is transferred onto the wafer, to a method of detecting the respective positions of the mask and the wafer for the relative positioning between the mask and the wafer. To the end of dispensing with the withdrawal of a microscope objective in such a way that the objective of a microscope for detecting the mask and the wafer and projection light, for example, an X-ray, are prevented from interfering, thereby to achieve the enhancement of throughput and to permit the detection of the positions of the mask and the wafer even during projection, the present invention consists in that the objective of the microscope is inclined with respect to a perpendicular to the plane of the mask or the plane of the wafer being a plane to-be-detected, so as not to interfere with the projection light, for example, the X-ray, whereby the circuit pattern can be transferred while the relative positions of the mask and the wafer are being detected.
Abstract translation: 本发明涉及一种投影对准器，其中掩模和晶片彼此靠近地保持，并且其中将掩模上描绘的电路图案转印到晶片上，以检测掩模和晶片的相应位置的方法 用于掩模和晶片之间的相对定位。 以这样的方式分配显微镜物镜的取出的结束，使得防止用于检测掩模和晶片的显微镜和例如X射线的投射光的目的被干扰，从而实现 增加吞吐量并且即使在投影期间也能够检测掩模和晶片的位置，本发明的目的在于，显微镜的目的是相对于掩模的平面垂直于或平面的倾斜 晶片是要被检测的平面，以便不干涉诸如X射线的投影光，由此可以在检测掩模和晶片的相对位置的同时传输电路图案。
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32.发明授权
公开(公告)号：US4698513A
公开(公告)日：1987-10-06
申请号：US9628
申请日：1987-01-23
Applicant: Toru Tojo , Mitsuo Tabata
Inventor： Toru Tojo , Mitsuo Tabata
CPC classification number: G03F9/7023 , G01B11/026
Abstract: A device for measuring the position of an object has a light radiation mechanism for causing light to be obliquely incident on a surface of the object, a vibrating mechanism for vibrating the light incident on the surface of the object at a predetermined frequency, and a detecting mechanism for detecting light reflected by the surface of the object, generating a detection signal, and obtaining the position of the object in accordance with the detection signal.
Abstract translation: 用于测量物体的位置的装置具有用于使光倾斜地入射到物体的表面上的光辐射机构，用于以预定频率振动入射在物体表面上的光的振动机构，以及检测 用于检测由物体的表面反射的光的机构，产生检测信号，并根据检测信号获得物体的位置。
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33.发明授权Apparatus and method for aligning a mask and wafer in the fabrication of integrated circuits 失效在制造集成电路中对准掩模和晶片的装置和方法
公开(公告)号：US4568189A
公开(公告)日：1986-02-04
申请号：US536125
申请日：1983-09-26
Applicant: John F. Bass , Nelson Saks , Martin Peckerar
Inventor： John F. Bass , Nelson Saks , Martin Peckerar
CPC classification number: G03F9/7049 , G03F9/7023 , G03F9/7076
Abstract: An apparatus and method for aligning a mask and wafer in the fabrication ofntegrated circuits utilizing alignment patterns on the mask and wafer. Each alignment pattern comprises a plurality of parallel alignment marks which are spaced from one another such that the patterns may be superimposed so that the marks of one pattern are positioned between marks of the other pattern. When the patterns are misaligned, a moire pattern is produced which disappears on alignment. The marks of each pattern are also disparately spaced from one another, permitting a gross to fine alignment. In aligning the patterns, each mark of one pattern is positioned between pairs of marks of the other pattern in an order corresponding to the widths of spaces defined between marks of the other pattern, progressing from the largest space width, giving gross alignment, to the smallest, giving fine alignment.
Abstract translation: 一种利用掩模和晶片上的对准图案在集成电路的制造中对准掩模和晶片的装置和方法。 每个对准图案包括彼此间隔开的多个平行对准标记，使得图案可以重叠，使得一个图案的标记位于另一图案的标记之间。 当图案不对齐时，会产生莫尔图案，消失。 每个图案的标记也彼此间隔开，允许粗略精细对准。 在对齐图案时，一个图案的每个标记以与另一图案的标记之间限定的间隔的宽度相对应的顺序位于另一图案的标记对之间，从最大空间宽度开始，从而提供总体对准 最小，给予精准对齐。
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公开(公告)号：US4514858A
公开(公告)日：1985-04-30
申请号：US475430
申请日：1983-03-15
Applicant: W. Thomas Novak
Inventor： W. Thomas Novak
CPC classification number: G03F7/70691 , B23Q1/36 , G03F9/7023 , G03F9/7049
Abstract: A lithography system for X-ray or other beam printing on a substrate such as a silicon semiconductor wafer comprises a beam chamber (301), a beam source (302), means (309) for mounting a mask, means (308) for mounting an image sensing means (342) interiorly of the chamber, means (317, 318), for mounting a substrate (307) in multiple including six degrees of freedom and means (308, 292, 320-322) including the image sensing means to align the mask and substrate relative to one another utilizing alignment patterns on the mask and substrate, images of which are brought into registration and sensed by the image sensing means. In a preferred embodiment three sets of target images are provided so as to adjust the substrate and mask relative orientation in six degrees of freedom. The mask seals helium within the chamber. The mask and the substrate are aligned in situ in the same position in which the mask and substrate are to be exposed to the beam. Means (313, 314, 311, 312) are provided for loading masks, calibration assemblies and substrate-holding means. The source-to-substrate distance is adjustable as is the mask-to-substrate gap. To conserve helium volume adjustable optic objectives (342) are provided in the chamber to sense registration of alignment targets on each of the mask and substrate, with essentially the remainder of the optics outside the chamber. Improved compression optics (408) are also provided in the alignment system.
Abstract translation: 用于在诸如硅半导体晶片的衬底上进行X射线或其他光束印刷的光刻系统包括光束室（301），光束源（302），用于安装掩模的装置（309），用于安装的装置（308） 在室内部的图像感测装置（342），用于将包括六个自由度的多个基板（307）安装在一起的装置（317,318），以及包括图像感测装置的装置（308,292,320-322） 使用掩模和衬底上的对准图案相对于彼此对准掩模和衬底，其图像被图像感测装置对准和感测。 在优选实施例中，提供了三组目标图像，以便以六个自由度调节基底并掩盖相对取向。 面罩密封腔内的氦气。 掩模和基底在与掩模和基底要暴露于光束的相同位置中原位取向。 提供装置（313,314,311,312）用于加载掩模，校准组件和基板保持装置。 源到衬底的距离是可调整的，与掩模到衬底间隙一样。 为了保存氦体积可调节的光学物镜（342），设置在腔室中，以感测每个掩模和衬底上的对准靶的配准，基本上在腔室外部的光学器件的其余部分。 改进的压缩光学器件（408）也在对准系统中提供。
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公开(公告)号：US20180299786A1
公开(公告)日：2018-10-18
申请号：US15946038
申请日：2018-04-05
Applicant: DISCO CORPORATION
Inventor： Joel Koerwer , Seiichi Sai
IPC: G03F7/20 , G03F9/00 , B23K26/03 , B23K26/035 , B23K26/06
CPC classification number: B23K26/035 , B23K26/032 , B23K26/0665 , B23K26/0823 , B23K26/0876 , G01B11/14 , G03F9/7023 , G03F9/7076 , H01L21/681 , H01L21/78
Abstract: There is provided a condensing point position detecting method of detecting a position in an optical axis direction of a condensing point of a laser beam condensed by a condenser of a laser processing apparatus. The condensing point position detecting method includes: an irradiation mark forming step of forming a plurality of irradiation marks in a substrate by irradiating the substrate held by a chuck table with the laser beam while moving the condenser in the optical axis direction with respect to the substrate; and a condensing point position detecting step of detecting an irradiation mark having a proper shape from the plurality of irradiation marks formed in the substrate, and detecting the position of the condensing point forming the proper irradiation mark as a position of an accurate condensing point.
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Patent Agency Ranking
公开(公告)号：US20180231900A1
公开(公告)日：2018-08-16
申请号：US15749209
申请日：2016-07-27
Applicant: ASML NETHERLANDS B.V.
Inventor： Patricius Aloysius Jacobus TINNEMANS
CPC classification number: G03F9/7046 , G03F7/70633 , G03F7/70691 , G03F9/7019 , G03F9/7023 , G03F9/7088
Abstract: An initialization method including estimating a characteristic of a property of an object based on a plurality of measurements by the sensor of the property using a respective plurality of different measurement parameters, different ones of the measurements using different measurement parameters, the characteristic including a combination of respective outcomes of respective ones of the measurements weighted by a respective weighting coefficient; performing, for each of a plurality of models of the object, each model configured to enable respective simulation of the performing of the measurements, a respective simulation, the respective simulation including simulating the measurements under control of a respective plurality of different simulation parameters to obtain a respective plurality of simulated characteristics of the property, the different simulation parameters being indicative of the different measurement parameters; determining, for each of the models, a respective bias representative of a respective difference between a respective theoretical characteristic of the property in accordance with the respective model and a respective further combination of the simulated characteristics of the property in the respective model, the respective further combination of the simulated characteristics including the weight coefficients, each particular one of the weight coefficients associated with a particular one of the different simulation parameters; using a cost function configured to optimize a correspondence between the simulated characteristic of the property and the theoretical characteristic of the property, the cost function being a function of the respective biases of the models; and optimizing the cost function to derive the weight coefficients from the cost function; and using the weight coefficients and the associated simulation parameters in a controller associated with the sensor.
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公开(公告)号：US20180011400A1
公开(公告)日：2018-01-11
申请号：US15714080
申请日：2017-09-25
Applicant: CANON KABUSHIKI KAISHA
Inventor： Yoshihiro Shiode
CPC classification number: G03F7/0002 , B29C59/026 , B29C2059/023 , B29K2101/00 , B82Y10/00 , B82Y40/00 , G03F9/7023 , G03F9/703 , G03F9/7049 , G11B5/855
Abstract: The present invention provides an imprint apparatus comprising a deforming unit configured to deform a pattern surface by applying a force to a mold, a measuring unit configured to measure a deformation amount of the pattern surface, a control unit configured to control the measuring unit to measure the deformation amount in each of a plurality of states in which a plurality of the forces are applied to the mold, a calculation unit configured to calculate a rate of change in the deformation amount as a function of a change in the force applied to the mold, and a calibration unit configured to calibrate a control profile describing a time in the imprint process, and the force applied to the mold, based on the rate of change in the deformation amount.
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公开(公告)号：US09798231B2
公开(公告)日：2017-10-24
申请号：US14372595
申请日：2013-01-09
Applicant: CANON KABUSHIKI KAISHA
Inventor： Yoshihiro Shiode
CPC classification number: G03F7/0002 , B29C59/026 , B29C2059/023 , B29K2101/00 , B82Y10/00 , B82Y40/00 , G03F9/7023 , G03F9/703 , G03F9/7049 , G11B5/855
Abstract: The present invention provides an imprint apparatus comprising a deforming unit configured to deform a pattern surface by applying a force to a mold, a measuring unit configured to measure a deformation amount of the pattern surface, a control unit configured to control the measuring unit to measure the deformation amount in each of a plurality of states in which a plurality of the forces are applied to the mold, a calculation unit configured to calculate a rate of change in the deformation amount as a function of a change in the force applied to the mold, and a calibration unit configured to calibrate a control profile describing a time in the imprint process, and the force applied to the mold, based on the rate of change in the deformation amount.
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39.发明授权Lithography system for processing a target, such as a wafer, and a method for operating a lithography system for processing a target, such as a wafer 有权用于处理诸如晶片的目标的平版印刷系统和用于操作用于处理诸如晶片的目标的光刻系统的方法公开(公告)号：US09395636B2
公开(公告)日：2016-07-19
申请号：US13453994
申请日：2012-04-23
Applicant: Guido De Boer , Niels Vergeer , Godefridus Cornelius Antonius Couweleers , Laurens Plandsoen , Cor Verburg
Inventor： Guido De Boer , Niels Vergeer , Godefridus Cornelius Antonius Couweleers , Laurens Plandsoen , Cor Verburg
CPC classification number: G03F9/7088 , G03F7/70616 , G03F7/70666 , G03F7/70775 , G03F7/7085 , G03F9/7023 , G03F9/7053
Abstract: The invention relates to a lithography system for processing a target, such as a wafer. The lithography system comprises a beam source arranged for providing a patterning beam, a final projection system arranged for projecting a pattern on the target surface, a chuck arranged for supporting the target and a mark position system connected to the final projection system and arranged for detecting a position mark on a surface.
Abstract translation: 本发明涉及一种用于处理诸如晶片的靶的光刻系统。 光刻系统包括布置成提供图案化光束的光束源，布置成用于在目标表面上投影图案的最终投影系统，布置成用于支撑目标的卡盘和连接到最终投影系统的标记位置系统，并且布置成用于检测 表面上的位置标记。
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公开(公告)号：US20140367875A1
公开(公告)日：2014-12-18
申请号：US14372595
申请日：2013-01-09
Applicant: CANON KABUSHIKI KAISHA
Inventor： Yoshihiro Shiode
IPC: B29C59/02
CPC classification number: G03F7/0002 , B29C59/026 , B29C2059/023 , B29K2101/00 , B82Y10/00 , B82Y40/00 , G03F9/7023 , G03F9/703 , G03F9/7049 , G11B5/855
Abstract: The present invention provides an imprint apparatus comprising a deforming unit configured to deform a pattern surface by applying a force to a mold, a measuring unit configured to measure a deformation amount of the pattern surface, a control unit configured to control the measuring unit to measure the deformation amount in each of a plurality of states in which a plurality of the forces are applied to the mold, a calculation unit configured to calculate a rate of change in the deformation amount as a function of a change in the force applied to the mold, and a calibration unit configured to calibrate a control profile describing a time in the imprint process, and the force applied to the mold, based on the rate of change in the deformation amount.
Abstract translation: 本发明提供了一种压印装置，包括：变形单元，其被配置为通过向模具施加力而使图案表面变形;测量单元，被配置为测量图案表面的变形量;控制单元，被配置为控制测量单元测量 将多个力施加到模具的多个状态中的每一个中的变形量，计算单元，被配置为计算作为施加到模具的力的变化的变化量的变化率 以及校准单元，被配置为基于变形量的变化率来校准描述压印过程中的时间的控制简档和施加到模具的力。
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