Abstract:
A field emitter comprising an exposed wide band gap emission area in contact with and protruding from a planar surface of a conductive metal, and a method of making is disclosed. Suitable wide band gap materials (2.5-7.0 electron-volts) include diamond, aluminum-nitride and gallium-nitride; suitable conductive metals include titanium, tungsten, gold and graphite. The method includes disposing the wide band gap material on a substrate, disposing the conductive metal on the wide band gap material, and etching the conductive metal to expose wide band gap emission areas. The emission areas are well suited for large area flat panel displays.
Abstract:
A method is provided for manufacturing a cold cathode field emission device. The method comprises the steps of:providing a layer of anodised alumina having a plurality of elongate pores which are substantially orthogonal to major surfaces of the layer;filling said pores completely with an electron emission material, and then removing at least a part of said layer to form a defined surface of said layer and to produce a plurality of electron emissive spikes extruding from and at an angle to said defined surface wherein a plurality of electron emissive structures are produced, each structure comprising a plurality of electron emissive spikes inclined to one another.
Abstract:
A semiconductor type batch fabrication procedure is disclosed in the preferred and illustrated embodiment. The process forms individual field emission devices and the necessary electron optics for each. The optics, having the form of various anodes, is aligned on a common axis above a pyramid or conic member terminating at a tip which functions as a microgun with the anodes. The microgun structure is supported on a substrate and forms, modulates, deflects and focuses electron beams. The complete device utilizes voltage levels routinely obtained in conventional integrated circuits, which integrated circuits may be simultaneously fabricated on the same supportive substrate with the microguns. The procedure further contemplates the fabrication of a complete array of microguns arranged in rows and columns.
Abstract:
Electron emitters and methods of fabricating the electron emitters are disclosed. According to certain embodiments, an electron emitter includes a tip with a planar region having a diameter in a range of approximately (0.05-10) micrometers. The electron emitter tip is configured to release field emission electrons. The electron emitter further includes a work-function-lowering material coated on the tip.
Abstract:
The present disclosure relates to a manufacturing method for an electron emitting device using a graphite adhesive material. A method of preparing paste for forming a cathode of an electron emitting device includes: mixing and dispersing a nanomaterial for electron emission and a graphite filler in a solvent; drying a mixed solution in which the nanomaterial and the graphite filler are mixed; and preparing paste by mixing a graphite binder with the dried mixture.
Abstract:
A method of fabricating a composite field emission source is provided. A first stage of film-forming process is performed by using RF magnetron sputtering, so as to form a nano structure film on a substrate, in which the nano structure film is a petal-like structure composed of a plurality of nano graphite walls. Afterward, a second stage of film-forming process is performed for increasing carbon accumulation amount on the nano structure film. Therefore, the composite field emission source with high strength and nano coral-like structures can be obtained, whereby improving the effect and life of electric field emission.
Abstract:
A field emission cathode plate is disclosed, which includes: a substrate; a cathode layer, disposed on the substrate; a conductive layer with an arc surface or a resistor layer with an opening and resistivity larger than that of the cathode layer, disposed on the cathode layer; and a cambered field emission layer, having an arc surface and disposed on the conductive layer or on the cathode layer in the opening of the resistor layer and covering the resistor layer around the opening. The present invention also provides a method for fabricating the above-mentioned field emission cathode plate. The method can provide field emission cathode plate achieving uniform field emission and does not involve high resolution and cost.
Abstract:
A method of operating and process for fabricating an electron source. A conductive rod is covered by an insulating layer, by dipping the rod in an insulation solution, for example. The rod is then covered by a field emitter material to form a layered conductive rod. The rod may also be covered by a second insulating material. Next, the materials are removed from the end of the rod and the insulating layers are recessed with respect to the field emitter layer so that a gap is present between the field emitter layer and the rod. The layered rod may be operated as an electron source within a vacuum tube by applying a positive bias to the rod with respect to the field emitter material and applying a higher positive bias to an anode opposite the rod in the tube. Electrons will accelerate to the charged anode and generate soft X-rays.
Abstract:
The present invention relates to a field emission device and an electrode structure thereof, comprising a starting base and a curved extending part formed on a surface of various shaped or dimensional structure. Therefore, the applied device and range is increased. The curved extending part is also for reducing the number of the contact point, as to simplify the procedure to design the peripheral circuit. Besides, a resisting section can be formed on the starting base. The resisting value of the resisting section is designed to provide various lighting effects.
Abstract:
A field emission type cold cathode device comprises a substrate, and a metal plating layer formed on the substrate, the metal plating layer contains at least one carbon structure selected from a group of fullerenes and carbon nanotubes, the carbon structure is stuck out from the metal plating layer and a part of the carbon structure is buried in the metal plating layer.