Abstract:
A charged particle beam system for imaging and processing targets is disclosed, comprising a charged particle column, a secondary particle detector, and a secondary particle detection grid assembly between the target and detector. In one embodiment, the grid assembly comprises a multiplicity of grids, each with a separate bias voltage, wherein the electric field between the target and the grids may be adjusted using the grid voltages to optimize the spatial distribution of secondary particles reaching the detector. Since detector lifetime is determined by the total dose accumulated at the area on the detector receiving the largest dose, detector lifetime can be increased by making the dose into the detector more spatially uniform. A single resistive grid assembly with a radial voltage gradient may replace the separate grids. A multiplicity of deflector electrodes may be located between the target and grid to enhance shaping of the electric field.
Abstract:
An electron beam EB0 emitted from an electron gun 101 is cut by a first aperture 103a into a rectangular electron beam DB', which is then cut by second and third apertures 140a, 150a into an electron beam EB3 so that the edge cut by the first aperture 103a is removed from the electron beam EB1. This can prevent blur due to the influence of coulomb interaction of the electron beam EB1 between the first and second apertures 103a to 140a and perform highly accurate exposure with the electron beam EB3 having high current density.
Abstract:
A system for ion beam neutralization includes a beamguide configured to transport an ion beam through a dipole field, a first array of magnets and a second array of magnets configured to generate a multi-cusp magnetic field, the first array of magnets being on a first side of the ion beam path and the second array of magnets being on a second side of the ion beam path. The system may further include a charged particle source having one or more apertures configured to inject charged particles into the ion beam. The system may furthermore align the one or more apertures with at least one of the first array of magnets and the second array of magnets to align the injected charged particles from the charged particle source with one or more magnetic regions for an effective charged particle diffusion into the ion beam.
Abstract:
A scanning microscope is provided for producing a scan image at high spatial resolution and in a low acceleration voltage area. An acceleration tube is located in an electron beam path of an objective lens for applying a post-acceleration voltage of the primary electron beam. The application of an overlapping voltage onto a sample allows a retarding electric field against the primary electron beam to be formed between the acceleration tube and the sample. The secondary electrons generated from the sample and the secondary signals such as reflected electrons are extracted into the acceleration tube through the effect of an electric field (retarding electric field) immediately before the sample. The signals are detected by secondary signal detectors located upwardly than the acceleration tube.
Abstract:
Method and system for generating a diffraction image comprises acquiring multiple frames from a direct-detection detector responsive to irradiating a sample with an electron beam. Multiple diffraction peaks in the multiple frames are identified. A first dose rate of at least one diffraction peak in the identified diffraction peaks is estimated in the counting mode. If the first dose rate is not greater than a threshold dose rate, a diffraction image including the diffraction peak is generated by counting electron detection events. Values of pixels belonging to the diffraction peak are determined with a first set of counting parameter values corresponding to a first coincidence area. Values of pixels not belonging to any of the multiple diffraction peaks are determined using a second, set of counting parameter values corresponding to a second, different, coincidence area.
Abstract:
A substrate processing apparatus includes a plasma processing chamber configured to accommodate a substrate, and a ring assembly provided around the substrate and including a dielectric, and a potential generator disposed on the dielectric and formed of a conductive material. A lower surface of the potential generator is disposed at a position higher than an upper surface of the substrate. The substrate processing apparatus further includes a power supply configured to supply a direct current signal or a radio frequency signal to the potential generator.
Abstract:
A charged particle buncher includes a series of spaced apart electrodes arranged to generate a shaped electric field. The series includes a first electrode, a last electrode and one or more intermediate electrodes. The charged particle buncher includes a waveform device attached to the electrodes and configured to apply a periodic potential waveform to each electrode independently in a manner so as to form a quasi-electrostatic time varying potential gradient between adjacent electrodes and to cause spatial distribution of charged particles that form a plurality of nodes and antinodes. The nodes have a charged particle density and the antinodes have substantially no charged particle density, and the nodes and the antinodes are formed from a charged particle beam configured to hit the target.
Abstract:
A method and a system for imaging an object, the system may include electron optics that may be configured to scan a first area of the object with at least one electron beam; wherein the electron optics may include a first electrode; and light optics that may be configured to illuminate at least one target of (a) the first electrode and (b) the object, thereby causing an emission of electrons between the first electrode and the object.
Abstract:
A radiation source (SO) suitable for providing a beam of radiation to an illuminator of a lithographic apparatus. The radiation source comprises a nozzle (128) configured to direct a stream of fuel droplets along a trajectory (140) towards a plasma formation location (212). The radiation source is configured to receive a first amount of radiation (205) such that, in use, the first amount of radiation is incident on a fuel droplet at the plasma formation location. The first amount of radiation transfers energy to the fuel droplet to generate a radiation generating plasma that emits a second amount of radiation (132). The radiation source further comprises an alignment detector having a first sensor arrangement (122) and a second sensor arrangement (134). The first sensor arrangement is configured to measure a property of a third amount of radiation (205a) that is indicative of a focus position of the first amount of radiation. The second sensor arrangement is configured to measure a property of a fourth amount of radiation (138), the fourth amount of radiation being a portion of the first amount of radiation that is reflected by the fuel droplet upon which the first amount of radiation is incident.
Abstract:
Embodiments of the invention relate to a mass resolving aperture that may be used in an ion implantation system that selectively exclude ion species based on charge to mass ratio (and/or mass to charge ratio) that are not desired for implantation, in an ion beam assembly. Embodiments of the invention relate to a mass resolving aperture that is segmented, adjustable, and/or presents a curved surface to the oncoming ion species that will strike the aperture. Embodiments of the invention also relate to the filtering of a flow of charged particles through a closed plasma channel (CPC) superconductor, or boson energy transmission system.