公开(公告)号：US07817052B2

公开(公告)日：2010-10-19

申请号：US11988733

申请日：2006-07-12

Applicant: Etienne Suzzoni

Inventor： Etienne Suzzoni

IPC: G08B21/00

CPC classification number: H05K1/0201 ,  H05K1/0268 ,  H05K1/181 ,  H05K2201/0761 ,  H05K2201/10151 ,  H05K2201/10689 ,  H05K2201/10969

Abstract: The invention relates to a printed circuit (10) comprising a support (12) that is insulating under normal conditions of operation of the printed circuit (10). The printed circuit (1) carries at least one component (14) that is capable of accidentally causing undesirable heating of a sensitive zone (Z) of the support (12). For this purpose, the printed circuit (10) further includes a detector for detecting heating of the sensitive zone (Z). The detector comprises a device (26) that are sensitive to the increase in the conductivity of the support (12) with temperature.

Abstract translation: 本发明涉及一种印刷电路（10），包括在印刷电路（10）的正常操作条件下绝缘的支撑件（12）。 印刷电路（1）承载能够意外地引起支撑件（12）的敏感区域（Z）的不期望的加热的至少一个部件（14）。 为此，印刷电路（10）还包括用于检测敏感区（Z）的加热的检测器。 检测器包括对温度对支撑件（12）的电导率的增加敏感的装置（26）。

公开(公告)号：US20100139959A1

公开(公告)日：2010-06-10

申请号：US12733105

申请日：2008-06-23

Applicant: Harumi Nagao ,  Yoshiyuki Asakawa ,  Kenji Ikeuchi

Inventor： Harumi Nagao ,  Yoshiyuki Asakawa ,  Kenji Ikeuchi

IPC: H05K1/09 ,  C23F1/00

CPC classification number: H05K3/067 ,  C23C22/52 ,  C23C22/58 ,  C23F1/18 ,  C23F1/28 ,  H05K3/26 ,  H05K3/388 ,  H05K2201/0338 ,  H05K2201/0761 ,  H05K2203/0796

Abstract: A method for manufacturing a printed circuit board enables a metal residue between wirings to be removed inexpensively without side etching of a copper layer while having sufficient insulation reliability for micro wiring working. The method includes forming a base metal layer directly at least on one face of an insulator film without an adhesive, and a copper coat layer formed on the base metal layer to form adhesiveless copper clad laminates, then forming a pattern on the adhesiveless copper clad laminates by an etching method. The etching method includes a process of etching treatment for the adhesiveless copper clad laminates with an iron (III) chloride solution or a copper (II) chloride solution containing hydrochloric acid and then, a process of treatment with an acid oxidant containing permanganate and acetic acid.

Abstract translation: 印刷电路板的制造方法能够廉价地除去布线之间的金属残留物，而不会对铜层进行侧蚀刻，同时具有足够的微布线工作的绝缘可靠性。 该方法包括直接在绝缘膜的至少一个表面上形成基底金属层，而无需粘合剂，以及形成在基底金属层上的铜涂层，以形成无粘合剂的铜包覆层压板，然后在无粘合剂覆铜层压板上形成图案 通过蚀刻方法。 蚀刻方法包括用氯化铁（III）溶液或含有盐酸的氯化铜（II）溶液对无粘合剂铜包覆层压板进行蚀刻处理的方法，然后使用含有高锰酸盐和乙酸的酸式氧化剂进行处理 。

公开(公告)号：US20080236872A1

公开(公告)日：2008-10-02

申请号：US11632793

申请日：2005-06-03

Applicant: Tatsuo Kataoka ,  Yoshikazu Akashi ,  Yutaka Iguchi ,  Hiroaki Kurihara ,  Naoya Yasui

Inventor： Tatsuo Kataoka ,  Yoshikazu Akashi ,  Yutaka Iguchi ,  Hiroaki Kurihara ,  Naoya Yasui

IPC: H05K1/00 ,  H05K3/00

CPC classification number: H05K3/26 ,  H05K3/06 ,  H05K3/067 ,  H05K3/244 ,  H05K3/388 ,  H05K2201/0761 ,  H05K2203/1157 ,  H05K2203/1476 ,  Y10T29/49124

Abstract: The printed wiring board of the present invention is a printed wiring board produced by selectively etching a base film having a base metal layer and a conductive metal layer, which are formed on an insulating film, through plural etching steps comprising a conductive metal etching step and a base metal etching step to form a wiring pattern and then bringing the base film having the thus formed wiring pattern into contact with a reducing aqueous solution containing a reducing substance, wherein the amount of a residual metal derived from the etching solution on the printed wiring board is not more than 0.05 μg/cm2. According to the present invention, the metal derived from the etching solution is removed by the use of a reducing substance-containing solution. Therefore, the water rinsing step in the production process can be shortened, occurrence of migration attributable to the residual metal can be prevented, and a printed wiring board having high reliability can be efficiently produced.

Abstract translation: 本发明的印刷电路板是通过多个蚀刻步骤选择性地蚀刻形成在绝缘膜上的具有基底金属层和导电金属层的基膜而制造的印刷线路板，其中包括导电金属蚀刻步骤和 贱金属蚀刻步骤，以形成布线图形，然后将具有如此形成的布线图案的基底膜与含有还原物质的还原水溶液接触，其中源自印刷布线上的蚀刻溶液的残余金属的量 板不超过0.05毫升/厘米2。 根据本发明，通过使用还原性物质的溶液除去来自蚀刻溶液的金属。 因此，可以缩短生产过程中的水洗步骤，可以防止由于残留金属引起的迁移的发生，并且可以有效地生产具有高可靠性的印刷线路板。

公开(公告)号：US20080012163A1

公开(公告)日：2008-01-17

申请号：US11789842

申请日：2007-04-25

Applicant: Gerald Donald Andrews ,  Richard Kevin Bailey ,  Graciela Beatriz Blanchet ,  John Catron ,  Feng Gao ,  Gary Delmar Jaycox ,  Lynda Kaye Johnson ,  Roupen Leon Keusseyan ,  Jeffrey Scott Meth ,  Frank S. Principe ,  Rinaldo S. Schiffino ,  Robert Mar Yohannan

Inventor： Gerald Donald Andrews ,  Richard Kevin Bailey ,  Graciela Beatriz Blanchet ,  John Catron ,  Feng Gao ,  Gary Delmar Jaycox ,  Lynda Kaye Johnson ,  Roupen Leon Keusseyan ,  Jeffrey Scott Meth ,  Frank S. Principe ,  Rinaldo S. Schiffino ,  Robert Mar Yohannan

IPC: B29D11/00

CPC classification number: B41M5/38207 ,  B41M5/38214 ,  H01L51/0013 ,  H01L51/0052 ,  H01L51/0068 ,  H01L51/052 ,  H01L51/0545 ,  H05K3/046 ,  H05K3/26 ,  H05K2201/0761 ,  H05K2203/0191 ,  H05K2203/0528 ,  H05K2203/107

Abstract: Provided are processes for enhancing the resolution of a thermally transferred pattern on an imaged thermal transfer receiver, wherein the imaged thermal transfer receiver comprises a surface having an exposed portion and a non-exposed portion of one or more thermally transferred layer(s), comprising: (a) contacting said surface with an adhesive layer for a contact period to provide a laminate; (b) separating said adhesive layer from the laminate to provide a treated thermal transfer receiver having a surface substantially free of said non-exposed portion of one or more thermally transferred layer(s). The processes are useful in the fabrication of electronic devices including thin film transistors, circuits, electromagnetic interference shields, touchpad sensors and other electronic devices.

Abstract translation: 提供了用于增强成像的热转印接收器上的热转印图案的分辨率的方法，其中成像的热转印接收器包括具有一个或多个热转印层的暴露部分和未曝光部分的表面，包括 ：（a）使所述表面与粘合剂层接触接触期以提供层压体; （b）从所述层压体分离所述粘合剂层以提供经处理的热转印接收器，其具有基本上不含一个或多个热转移层的所述未曝光部分的表面。 这些方法在制造包括薄膜晶体管，电路，电磁干扰屏蔽，触摸板传感器和其它电子设备的电子器件中是有用的。

公开(公告)号：US07312404B2

公开(公告)日：2007-12-25

申请号：US11411748

申请日：2006-04-25

Applicant: Andrew Michael Cherniski ,  James Kristian Koch

Inventor： Andrew Michael Cherniski ,  James Kristian Koch

IPC: H05K1/16 ,  H05K3/30

CPC classification number: H01L23/48 ,  H01L23/49562 ,  H01L23/49586 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0256 ,  H05K3/301 ,  H05K3/306 ,  H05K3/3447 ,  H05K2201/0133 ,  H05K2201/0761 ,  H05K2201/10166 ,  H05K2201/10424 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49142 ,  Y10T29/49144 ,  Y10T29/53174 ,  Y10T29/53183 ,  H01L2924/00

Abstract: A method and apparatus to eliminate conductive contamination reliability problems for assembled substrates, such as electrical arcing in power semiconductor leads. One embodiment of the invention involves a method for assembling an electrical component having leads on a substrate having conductive contacts, wherein an elastomer part encapsulates the leads of the electrical component. A second embodiment of the invention involves assembling an electrical component having leads to a substrate having conductive contacts, wherein an elastomer shape cut by a punch die encapsulates the leads of the electrical component. A third embodiment of the invention involves an assembled substrate including an electrical component having leads, and an elastomer surrounding the leads to encapsulate the leads.

Abstract translation: 一种用于消除组装的衬底的导电污染可靠性问题的方法和装置，例如功率半导体引线中的电弧。 本发明的一个实施例涉及一种用于组装具有导体的电气部件的方法，所述导线在具有导电触点的基板上，其中弹性体部件封装电气部件的引线。 本发明的第二实施例涉及将具有导线的电气部件组装到具有导电触点的基板上，其中由冲压模切割的弹性体形状封装电气部件的引线。 本发明的第三实施例涉及包括具有引线的电气部件的组装的基板和围绕引线的弹性体以封装引线。

公开(公告)号：US07148427B2

公开(公告)日：2006-12-12

申请号：US10000841

申请日：2001-10-24

Applicant: Yasuhito Aruga ,  Satoshi Yatabe ,  Kogo Endo ,  Norihito Harada

Inventor： Yasuhito Aruga ,  Satoshi Yatabe ,  Kogo Endo ,  Norihito Harada

IPC: H05K1/16

CPC classification number: G02F1/1345 ,  H01L2224/04026 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00014 ,  H05K1/0256 ,  H05K1/0306 ,  H05K2201/0326 ,  H05K2201/0761 ,  H05K2201/0769 ,  H05K2201/09781 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A wiring substrate is formed of a plurality of metal wirings 14e formed on a substrate 7c. A guard wiring 29 fabricated of an electrically conductive oxide such as ITO is interposed between at least a pair of adjacent ones of a plurality of metal wirings 14e. When voltages V1, V2, V3, and V4 applied to the metal wirings 14e are related to be V1>V2>V3>V4, a guard wiring 29 is present between a metal wiring 14e functioning as an anode and a metal wiring 14e functioning as a cathode, and the anode metal wiring 14e is prevented from being corroded.

Abstract translation: 布线基板由形成在基板7c上的多个金属布线14e形成。 由诸如ITO的导电氧化物制成的保护布线29插入在多个金属布线14e中的至少一对相邻的金属布线14e之间。 当施加到金属布线14e的电压V 1，V 2，V 3和V 4与V 1> V 2> V 3> V 4相关时，保护布线29存在于金属布线14e的功能 作为阳极和用作阴极的金属布线14e，并且防止阳极金属布线14e被腐蚀。

公开(公告)号：US20060249304A1

公开(公告)日：2006-11-09

申请号：US10554660

申请日：2004-06-30

Applicant: Hideaki Tanaka ,  Nobuyuki Sensui

Inventor： Hideaki Tanaka ,  Nobuyuki Sensui

IPC: H05K1/03

CPC classification number: H05K3/0023 ,  H05K3/26 ,  H05K3/28 ,  H05K3/4644 ,  H05K2201/0761 ,  H05K2201/0769 ,  H05K2203/0786 ,  H05K2203/0793 ,  Y10T29/49126 ,  Y10T29/49155

Abstract: In the case of using a photosensitive insulating resin for a surface protective layer of a circuit wiring pattern, or for an insulating layer between circuit wiring conductor layers in a circuit board, Na ions adsorbed on the photosensitive insulating resin are replaced with a polyvalent metal through a treatment step containing Na ions which is executed after a heat curing step of the photosensitive insulating resin. For the polyvalent metal, a II group including Mg or Ca can be selected.

Abstract translation: 在电路布线图案的表面保护层用感光绝缘树脂或电路基板的电路布线导体层之间的绝缘层的情况下，吸附在感光绝缘树脂上的Na离子被多价金属代替 包含在感光绝缘树脂的热固化步骤之后执行的Na离子的处理步骤。 对于多价金属，可以选择包括Mg或Ca的II族。

公开(公告)号：US07084097B2

公开(公告)日：2006-08-01

申请号：US10783837

申请日：2004-02-19

Applicant: Norio Ishikawa ,  Yumiko Abe ,  Kiyoto Mori

Inventor： Norio Ishikawa ,  Yumiko Abe ,  Kiyoto Mori

IPC: C11D1/00

CPC classification number: H05K3/26 ,  C11D3/2075 ,  C11D11/0047 ,  H01L21/02063 ,  H05K2201/0761 ,  H05K2203/122

Abstract: The present invention relates to a cleaning solution capable of removing efficiently at the same time particles and metallic impurities from a substrate surface without corroding metallic materials.The cleaning solution for cleaning substrates of electronic materials comprises an organic acid compound and at least one selected from the group consisting of dispersants and surfactants.

Abstract translation: 本发明涉及能够在不腐蚀金属材料的同时从基材表面高效除去颗粒和金属杂质的清洗溶液。 用于清洁电子材料基材的清洁溶液包括有机酸化合物和选自分散剂和表面活性剂中的至少一种。

公开(公告)号：US20050109734A1

公开(公告)日：2005-05-26

申请号：US10979267

申请日：2004-11-02

Applicant: Masayo Kuriyama ,  Ryo Ogushi ,  Daisaku Akiyama ,  Kaoru Urushibata

Inventor： Masayo Kuriyama ,  Ryo Ogushi ,  Daisaku Akiyama ,  Kaoru Urushibata

IPC: C23F1/16 ,  C23F1/28 ,  C23F1/30 ,  H05K3/18 ,  H05K3/26 ,  B44C1/22 ,  C03C15/00 ,  C03C25/68 ,  C23F1/00 ,  C25F3/00

CPC classification number: H05K3/26 ,  C23F1/28 ,  C23F1/30 ,  H05K3/181 ,  H05K2201/0761 ,  H05K2203/0789 ,  H05K2203/124

Abstract: An etchant of the present invention includes an aqueous solution containing hydrochloric acid, nitric acid, and a cupric ion source. An etching method of the present invention includes bringing the etchant into contact with at least one metal selected from nickel, chromium, nickel-chromium alloys, and palladium. Another etching method of the present invention includes bringing a first etchant that includes an aqueous solution containing at least the following components A to C (A. hydrochloric acid; B. at least one compound selected from the following (a) to (c): (a) compounds with 7 or less carbon atoms, containing a sulfur atom(s) and at least one group selected from an amino group, an imino group, a carboxyl group, a carbonyl group, and a hydroxyl group; (b) thiazole; and (c) thiazole compounds; and C. a surfactant) into contact with a surface of the metal, and then bringing a second solution that includes an aqueous solution containing hydrochloric acid, nitric acid, and a cupric ion source into contact with the surface of the metal. According to the etchant and the etching methods of the present invention, it is possible to etch at least one metal selected from nickel, chromium, nickel-chromium alloys, and palladium quickly and suppress excessive dissolution of copper.

Abstract translation: 本发明的蚀刻剂包括含有盐酸，硝酸和铜离子源的水溶液。 本发明的蚀刻方法包括使蚀刻剂与选自镍，铬，镍 - 铬合金和钯中的至少一种金属接触。 本发明的另一种蚀刻方法包括使包含至少含有以下组分A至C的水溶液的第一蚀刻剂（A.盐酸; B.至少一种选自以下（a）至（c）的化合物： （a）具有7个以下碳原子的含有硫原子和至少1个选自氨基，亚氨基，羧基，羰基和羟基的基团的化合物;（b）噻唑 ;和（c）噻唑化合物;和C.a表面活性剂）与金属的表面接触，然后使包含含有盐酸，硝酸和铜离子源的水溶液的第二溶液与 金属表面。 根据本发明的蚀刻剂和蚀刻方法，可以快速地蚀刻选自镍，铬，镍 - 铬合金和钯中的至少一种金属并抑制铜的过度溶解。

公开(公告)号：US20040262367A1

公开(公告)日：2004-12-30

申请号：US10805768

申请日：2004-03-22

Inventor： Junji Nakamura

IPC: B23K031/02

CPC classification number: H01L23/3735 ,  C04B37/026 ,  C04B2237/125 ,  C04B2237/126 ,  C04B2237/127 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/407 ,  C04B2237/64 ,  C04B2237/704 ,  C04B2237/706 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/06 ,  H05K3/067 ,  H05K3/26 ,  H05K3/38 ,  H05K2201/0761 ,  H05K2203/1476 ,  H01L2924/00

Abstract: There is provided a method for producing a reliable metal/ceramic bonding substrate at low costs by forming a desired fillet on the peripheral portion of a metal circuit by a small number of steps. After an active metal containing brazing filler metal 12 is applied on a ceramic substrate 10 to bond a metal member 14 thereto, a resist 16 is applied on a predetermined portion of a surface of the metal member 14 to etch unnecessary portions, and then the resist is removed. Thereafter, unnecessary part of a metal layer 12b, which is formed of a metal other than an active metal of the active metal containing brazing filler metal 12, is etched with a chemical to be removed. Then, unnecessary part of an active metal layer 12a, which is formed of the active metal and a compound thereof, is selectively etched with a chemical, which inhibits the metal member 14 and the metal layer 12b from being etched and which selectively etch the active metal layer 12b, to form a metal circuit on the ceramic substrate 10. This metal circuit is chemically polished to form a fillet on the peripheral portion of the metal circuit.

Abstract translation: 提供了一种通过以少量的步骤在金属电路的周边部分上形成所需的圆角而以低成本制造可靠的金属/陶瓷接合基板的方法。 在将含有活性金属的钎料12施加到陶瓷基板10上以将金属构件14接合到其上之后，将抗蚀剂16施加在金属构件14的表面的预定部分上以蚀刻不需要的部分，然后将抗蚀剂 被删除。 此后，用除去活性金属的活性金属以外的金属形成的金属层12b的不需要的部分被除去。 然后，用化学物质选择性地蚀刻由活性金属形成的活性金属层12a的不必要部分和其化合物，这种化学物质抑制金属部件14和金属层12b被蚀刻并选择性地蚀刻活性物质 金属层12b，以在陶瓷基板10上形成金属电路。该金属电路被化学抛光以在金属电路的周边部分上形成圆角。