-
31.发明授权公开(公告)号：US07744264B2
公开(公告)日：2010-06-29
申请号：US12202557
申请日：2008-09-02
Applicant: Chih-Chung Tsao , Chih-Peng Hsu , Wen-Jang Jiang , Chun-Wei Wang , Chih-Ming Lai , Hung-Kuang Hsu
Inventor： Chih-Chung Tsao , Chih-Peng Hsu , Wen-Jang Jiang , Chun-Wei Wang , Chih-Ming Lai , Hung-Kuang Hsu
IPC: F21V7/04
CPC classification number: F21S2/005 , F21V19/001 , F21V19/045 , F21V23/06 , F21Y2115/10 , G02B6/0068 , G02B6/0073 , H05K1/14 , H05K2201/048 , H05K2201/09963 , H05K2201/10106
Abstract: An exemplary semiconductor solid-state light-source module includes a printed circuit board, at least one semiconductor solid state light source mounted on the printed circuit board and a light guide plate optically coupled to the semiconductor solid state light source. The printed circuit board includes a protrusion and a recess. The protrusion is configured for engaging with a recess of the printed circuit board of another similar semiconductor solid-state light-source module.
Abstract translation: 示例性的半导体固态光源模块包括印刷电路板，安装在印刷电路板上的至少一个半导体固态光源和与半导体固态光源光学耦合的导光板。 印刷电路板包括突起和凹部。 该突出部构造成用于与另一个类似的半导体固态光源模块的印刷电路板的凹部接合。
-
公开(公告)号：US20090047802A1
公开(公告)日：2009-02-19
申请号：US12100294
申请日：2008-04-09
Applicant: TA-HSIANG YEN , YEN-HUNG HUANG , CHIH-MING LAI
Inventor： TA-HSIANG YEN , YEN-HUNG HUANG , CHIH-MING LAI
IPC: H01R12/00
CPC classification number: H05K1/142 , H05K2201/09163 , H05K2201/09963 , H05K2201/10106 , H05K2203/167
Abstract: An illumination device using LEDs (101) has a circuit board and a plurality of LEDs disposed on the circuit board elements. The circuit board can be obtained by assembling a plurality of the circuit board elements (11) together. The circuit board element comprises a board (110) and an electric trace (1151) attached to the board. The board comprises a plurality of connecting units (111, 112, 113, 114) formed at lateral sides thereof. The circuit board element connects with an adjacent circuit board element via the connecting units. The electric trace extends from the board to the connecting units and electrically connects with the electric trace of the adjacent circuit board element.
Abstract translation: 使用LED（101）的照明装置具有布置在电路板元件上的电路板和多个LED。 可以通过将多个电路板元件（11）组装在一起来获得电路板。 电路板元件包括板（110）和连接到板的电迹线（1151）。 板包括形成在其横向侧面的多个连接单元（111,112,113,114）。 电路板元件通过连接单元与相邻的电路板元件连接。 电迹线从板延伸到连接单元，并与相邻电路板元件的电迹线电连接。
-
公开(公告)号：US20080144299A1
公开(公告)日：2008-06-19
申请号：US11998229
申请日：2007-11-29
Applicant: Frank E. Redmond
Inventor： Frank E. Redmond
CPC classification number: H05K1/142 , H01R9/2458 , H05K1/0286 , H05K2201/09145 , H05K2201/09963 , H05K2201/10287 , H05K2201/10363 , H05K2201/10401 , H05K2201/2018 , H05K2201/209 , H05K2203/167
Abstract: A printed circuit board having only one circuit element, said circuit element having one or more leads and each lead being in electrical communication to one end of a trace on the printed circuit board, wherein said trace has a second end terminating at a pad, wherein said pad is in electrical communication with a receptacle capable of receiving and retaining a wire. A printed circuit board selected from the group consisting of a printed circuit board having only two traces, a printed circuit board having only three traces, a printed circuit board having only four traces, a printed circuit board having only six traces, a printed circuit board having only eight traces, a printed circuit board having only ten traces, a printed circuit board having only twelve traces, a printed circuit board having only fourteen traces and a printed circuit board having only sixteen traces, wherein each trace has two ends, one end being a receptacle pad connected to a receptacle capable of receiving and retaining a wire, and the second end of said trace being a lead-pad electrically connected to a lead-receptacle, wherein said lead-receptacle is capable of receiving and retaining a lead or pin from a circuit element.
Abstract translation: 一种仅具有一个电路元件的印刷电路板，所述电路元件具有一个或多个引线，并且每个引线与印刷电路板上的迹线的一端电连通，其中所述迹线具有终止于焊盘的第二端，其中 所述垫与能够接收和保持电线的插座电连通。 一种印刷电路板，其选自由只有两条迹线的印刷电路板组成的印刷电路板，仅具有三条迹线的印刷电路板，仅具有四条迹线的印刷电路板，仅具有六条迹线的印刷电路板，印刷电路板 只有八条迹线，只有十条迹线的印刷电路板，只有十二条迹线的印刷电路板，只有十四条迹线的印刷电路板和只有十六条迹线的印刷电路板，其中每条迹线有两端，一端 作为连接到能够接收和保持线的插座的插座焊盘，并且所述迹线的第二端是电连接到引线插座的引线焊盘，其中所述引线插座能够接收和保持引线或 引脚从电路元件。
-
公开(公告)号：US20050157584A1
公开(公告)日：2005-07-21
申请号：US11009250
申请日：2004-12-10
Applicant: Shih-Hsiung Lien
Inventor： Shih-Hsiung Lien
CPC classification number: H05K1/142 , H05K2201/09172 , H05K2201/09181 , H05K2201/09963 , H05K2201/10159 , H05K2201/209
Abstract: A memory module includes a plurality of memory units and an assembling holder. Each of the memory units includes a memory substrate, at least a memory chipset having a predetermined memory capacity mounted on the memory substrate, and an electric terminal provided at a lower edge portion of the memory substrate. The assembling holder includes an elongated unit housing having an elongated receiving slot extended therealong and a signal terminal provided along the unit housing, wherein the electric terminals of the memory substrates are detachably inserted into the receiving slot of the unit housing to electrically connect the electric terminals with the signal terminal, such that the memory units are alignedly and detachably mounted along the receiving slot in an edge to edge manner.
Abstract translation: 存储器模块包括多个存储器单元和组装保持器。 每个存储器单元包括存储器基板，至少存储器芯片组具有安装在存储器基板上的预定存储器容量，以及设置在存储器基板的下边缘部分处的电端子。 组装保持器包括细长单元壳体，其具有沿其延伸的细长接收槽和沿单元壳体设置的信号端子，其中存储器基板的电端子可拆卸地插入到单元壳体的接收槽中，以电连接电端子 信号端子，使得存储器单元沿着接收槽以边缘到边缘的方式对齐地和可拆卸地安装。
-
35.发明授权Electronic component, circuit device, method for manufacturing the circuit device, and semiconductor device 失效电子部件，电路装置，电路装置的制造方法以及半导体装置公开(公告)号：US06862189B2
公开(公告)日：2005-03-01
申请号：US09961172
申请日：2001-09-24
Applicant: Kazuhito Higuchi
Inventor： Kazuhito Higuchi
CPC classification number: H05K3/4617 , H01L25/50 , H01L2224/83192 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H05K3/205 , H05K2201/0195 , H05K2201/09481 , H05K2201/096 , H05K2201/09881 , H05K2201/09963 , H05K2203/016 , H05K2203/1189
Abstract: An electronic component including an element main body section for performing an electrical function and a terminal section for electrically connecting the element main body section to a conductive member of an external device, the electronic component comprises a pair of sections arranged above the terminal section and opposite to each other in a stacking direction of the electronic component and a distance between the sections corresponding to a maximum thickness of the electronic component.
Abstract translation: 一种电子部件，包括用于执行电功能的元件主体部分和用于将元件主体部分电连接到外部装置的导电部件的端子部分，所述电子部件包括布置在所述端子部分上方的一对部分， 在电子部件的层叠方向上彼此相对的距离和对应于电子部件的最大厚度的部分之间的距离。
-
Patent Agency Ranking36.发明授权
公开(公告)号：US3867759A
公开(公告)日：1975-02-25
申请号：US36965473
申请日：1973-06-13
Applicant: US AIR FORCE
Inventor： SIEFKER ROBERT G
CPC classification number: H05K1/142 , H05K1/0237 , H05K3/429 , H05K3/4614 , H05K3/4623 , H05K2201/09536 , H05K2201/096 , H05K2201/09963 , H05K2201/10303 , H05K2203/061 , Y10T29/49126
Abstract: The method of manufacturing the integrated package includes, but is not limited to, the steps of: fabricating a plurality of identical strip transmission line printed circuit board segments, which are to be used to form a plurality, preferably two, of printed circuit boards, with each board to be a layer in and of the multi-layered integrated package; joining the segments, which collectively constitute and define each circuit board layer, in coplanar relationship, to form the respective circuit boards, drilling, and plating with an electrically conductive material, a plurality of signal path holes in and through each segment of each circuit board (i.e., each layer); inserting one end of a different two-ended electrically conductive wire into each plated signal path hole in the first circuit board layer, and soldering that end in place to its respective plated signal path hole, thereby providing electrical contact by and between each wire and its respective plated hole in the first layer; inserting the other end of each wire in a different plated signal path hole in the second circuit board layer, and soldering that end in place to its respective plated signal path hole, thereby providing electrical contact by and between each end of each wire and the two plated signal path holes to which each wire is soldered, and also thereby providing electrical conductivity between, and from and to, the first and the second layers of printed circuit boards; and, bonding the second layer to the first layer in stacked relationship. By cascading the interconnection (i.e., adding a third layer to the two-layered package, and electrically interconnecting the third layer to the second layer), an integrated package of as many layers as desired or as needed may be formed, without having to penetrate more than any two adjacent layers of circuit boards at any one time. The method may be significantly varied, by performing additional steps to drill, plate and align one or more grounded holes in the circuit board layers, to improve the electrical performance of the transition.
-
公开(公告)号：US2899608A
公开(公告)日：1959-08-11
申请号：US2899608D
CPC classification number: H01G2/00 , H01L49/02 , H05K1/142 , H05K2201/09963 , H05K2201/10946
-
公开(公告)号：US09961771B2
公开(公告)日：2018-05-01
申请号：US13571252
申请日：2012-08-09
Applicant: JengPing Lu , Eugene M. Chow
Inventor： JengPing Lu , Eugene M. Chow
CPC classification number: H05K1/142 , H05K1/0286 , H05K1/14 , H05K3/368 , H05K2201/09963 , Y10T29/49124 , Y10T29/49126 , Y10T29/49155
Abstract: A method of forming an interconnect substrate includes providing at least two unit cells, arranging the unit cells to form a desired circuit pattern, and joining the unit cells to form the interconnect substrate having the desired circuit pattern.
-
公开(公告)号：US09545009B2
公开(公告)日：2017-01-10
申请号：US11752759
申请日：2007-05-23
Applicant: Michael Edward Figaro , Scott Edward Bacom , Jay Gregory Sherritt
Inventor： Michael Edward Figaro , Scott Edward Bacom , Jay Gregory Sherritt
CPC classification number: H05K3/0005 , G06F17/5072 , H05K2201/09963
Abstract: A passive electrical component is described including a substrate, at least a first, second and third electrically conductive pad, each disposed on the substrate and at least a first electrical device fixedly attached to the first pad and the second pad. The first electrical device is electrically connected to the first and second pads. The third pad is devoid of electrical connection to either the first or the second pads. The component is recognizable by both a Computer Aided Design program and an automated component assembly machine.
Abstract translation: 描述了一种无源电气部件，其包括基板，至少第一，第二和第三导电焊盘，每个基板设置在基板上，并且至少第一电气装置固定地附接到第一焊盘和第二焊盘。 第一电气设备电连接到第一和第二焊盘。 第三垫没有与第一或第二垫的电连接。 该组件可由计算机辅助设计程序和自动化组件装配机器识别。
-
公开(公告)号：US20160079023A1
公开(公告)日：2016-03-17
申请号：US14947250
申请日：2015-11-20
Applicant: T+Ink, Inc.
Inventor： Daniel Boss , Scott Qualls , David Mcdonald , Terrance Z. Kaiserman , Keith J. Margolin , Michael Wassief , Liang Chai
CPC classification number: H01H59/00 , H01B5/02 , H01B13/165 , H01H49/00 , H01R4/2404 , H01R25/147 , H05K3/103 , H05K2201/09672 , H05K2201/09963 , Y10T29/49117 , Y10T29/49155 , Y10T307/74
Abstract: An electrically conductive element, including an insulator and a first conductor, is provided, which can be affixed to a second conductor consisting of conductive structural element, wherein the insulator is positioned between the first and second conductors to electrically isolate them. A power supply may be connected between the first and second conductors to provide power thereto, and an electrical device may be connected across the first and second conductors.
Abstract translation: 提供了包括绝缘体和第一导体的导电元件，其可以固定到由导电结构元件组成的第二导体，其中绝缘体位于第一和第二导体之间以将它们电隔离。 电源可以连接在第一和第二导体之间以向其提供电力，并且电气设备可以跨越第一和第二导体连接。
-
-
-
-
-
-
-
-
-
Search Results
65
records
(took 0.047 seconds)
