公开(公告)号：US20180158748A1

公开(公告)日：2018-06-07

申请号：US15659222

申请日：2017-07-25

申请人： Oh Jung Kwon

发明人： Oh Jung KWON ,  Sang Ho JEON

IPC分类号： H01L23/367 ,  H01L23/373 ,  F28F3/02 ,  H01L23/427 ,  H05K7/20

CPC分类号： H05K7/20 ,  F28F3/02 ,  H01L23/3672 ,  H01L23/3675 ,  H01L23/373 ,  H01L23/427 ,  H01L23/467 ,  H05K7/20009 ,  H05K7/20136 ,  H05K7/20145 ,  H05K7/2089 ,  H05K7/20909

摘要： A heat dissipation apparatus for a semiconductor module according to an exemplary embodiment of the present invention includes: a heatsink which is provided to be in surface-to-surface contact with a semiconductor module; a duct unit which includes a pair of wall members which extends perpendicularly to an edge of the other surface of the heatsink and a quadrangular box member which is formed in a quadrangular box shape opened at both ends thereof, in which two sides of the opened ends of the quadrangular box member are connected to the wall members, respectively, and any one surface, among surfaces for constituting the quadrangular box shape, is formed to be inclined; and an intake fan which is provided at the other end of the quadrangular box member, in which a vent hole is formed in the inclined lateral surface of the quadrangular box member.

公开(公告)号：US20180077826A1

公开(公告)日：2018-03-15

申请号：US15813293

申请日：2017-11-15

申请人： IHI Corporation ,  National University Corporation Tokyo University of Agriculture and Technology

发明人： Yoji OKITA ,  Akira Murata

IPC分类号： H05K7/20

CPC分类号： H05K7/20909 ,  B64C25/36 ,  H05K7/20172 ,  H05K7/20345 ,  H05K7/2039 ,  H05K7/20918 ,  H05K7/20936

摘要： A cooling device includes a heat sink that includes a plurality of first heat radiating fins and a plurality of second heat radiating fins, and a compressor as a blower that causes cooling air to flow from an inlet toward an outlet of a cooling passage of the heat sink. The cooling device includes in a flow direction of the cooling air that passes via the heat sink a mist supplier arranged upstream of the heat sink and that supplies mist M to the cooling passage of the heat sink.

公开(公告)号：US20180077825A1

公开(公告)日：2018-03-15

申请号：US15700522

申请日：2017-09-11

申请人： JTEKT CORPORATION

发明人： Yoshihiro KOJIMA

IPC分类号： H05K7/20 ,  H01L23/36

CPC分类号： H05K7/20909 ,  H01L23/36 ,  H01L23/367 ,  H01L23/3675 ,  H01L23/3677 ,  H01L23/42 ,  H05K1/0206 ,  H05K1/114 ,  H05K3/0061 ,  H05K2201/0959 ,  H05K2201/10166

摘要： An electronic control device includes a heating element, a circuit substrate, a heat radiation plate, and a heat radiation material. Connection terminals of the heating element are fixed to wiring patterns on a circuit principal surface of the circuit substrate with solder. Through holes are provided in the circuit substrate at portions spaced away from the distal ends of the connection terminals of the heating element by a distance equal to or smaller than a thickness of the circuit substrate. The heat radiation material applied between a circuit principal surface of the circuit substrate and the heat radiation plate is exposed to the circuit principal surface via the through holes. The heat radiation material exposed to the circuit principal surface covers the distal ends of the connection terminals fixed with the solder.

公开(公告)号：US09888616B2

公开(公告)日：2018-02-06

申请号：US15176335

申请日：2016-06-08

申请人： VOLTRONIC POWER TECHNOLOGY CORP.

发明人： Tung-Chen Yu ,  Xiao-Bo Wan ,  Juor-Ming Hsieh

IPC分类号： H05K7/20 ,  H05K7/14 ,  H05K5/02 ,  H02J9/06

CPC分类号： H05K7/20909 ,  H02J9/06 ,  H05K5/0217 ,  H05K7/14 ,  H05K7/1432 ,  H05K7/20154

摘要： The instant disclosure relates to a chassis structure for industrial uninterruptible power supply system including: a chassis having a frame and a front side panel, left side panel, right side panel, rear side panel and top panel installed on the frame; the chassis has a plurality of spacer on the bottom thereof for lifting the chassis from the ground for a distance to forming a gas-intake space; a plurality of protective plates disposed around the gas-intake space, each protective plate has a plurality of gas-intake hole; a bottom plate structure disposed between the bottom of the chassis and the gas-intake space and has at least a gas-intake gap; at least a venting hole disposed on the top panel of the chassis, each venting hole has at least an exhaust fan for outputting a gas from the chassis.

公开(公告)号：US20180006573A1

公开(公告)日：2018-01-04

申请号：US15548477

申请日：2015-03-04

申请人： Hitachi, Ltd.

发明人： Yukio HATTORI ,  Hiroshi KAMIZUMA ,  Daisuke MATSUMOTO ,  Akira MIMA ,  Ryouhei MIYAGAWA

IPC分类号： H02M7/217 ,  H05K7/20

CPC分类号： H02M7/217 ,  H02M7/003 ,  H02M7/219 ,  H02M7/5387 ,  H05K7/209 ,  H05K7/20909 ,  H05K7/20936

摘要： An electrical power conversion unit is provided with: a circuit connecting part which includes a positive electrode conductor, a negative electrode conductor, and an alternating current conductor; a power semiconductor module connected to a specific side of the circuit connecting part; a fin that extends to the opposite side of the circuit connecting part with respect to the power semiconductor module; and a capacitor disposed at one end in the lengthwise direction of the circuit connecting part. A space in which a cooling fan is disposed is formed by an extending part and the fin, when the extending part is defined as a region, of the circuit connecting part, other than the portion at which the fin projects to the circuit connecting part, such region including one end that is opposite, via the fin, the one end where the capacitor is present.

公开(公告)号：US20170347501A1

公开(公告)日：2017-11-30

申请号：US15166366

申请日：2016-05-27

申请人： Toshiba International Corporation

发明人： Michael C. Daskalos ,  John D. Kleinecke

IPC分类号： H05K7/20 ,  G05B19/05

CPC分类号： H05K7/20945 ,  G05B19/05 ,  H05K7/20209 ,  H05K7/20909

摘要： In accordance with presently disclosed embodiments, a system and method for controlling the temperature of medium-voltage power electronics assemblies (i.e., medium-voltage drives) is provided. The disclosed system generally includes a medium-voltage drive having one or more cabinets with power electronics devices disposed therein, one or more fans for circulating air through the cabinet to cool the devices, and one or more space heaters disposed in the cabinet. The drive also features temperature sensors used to measure various temperatures of the drive, a controller communicatively coupled to the sensors, and one or more variable frequency drives (VFD) for the fans. The controller may receive measurements regarding the ambient and power device temperatures and apply controls to vary the space heater power and fan speed in response to environmental changes.

公开(公告)号：US20170331302A1

公开(公告)日：2017-11-16

申请号：US15523040

申请日：2015-09-29

申请人： Hitachi Koki Co. Ltd.

发明人： Masaki Namiki

IPC分类号： H02J7/00 ,  H01M10/6235 ,  H01M10/613 ,  H01M10/0525 ,  H01M10/6563 ,  H05K7/20 ,  H01M10/44

CPC分类号： H02J7/0026 ,  H01M10/0525 ,  H01M10/44 ,  H01M10/46 ,  H01M10/486 ,  H01M10/613 ,  H01M10/617 ,  H01M10/6235 ,  H01M10/637 ,  H01M10/643 ,  H01M10/6563 ,  H01M10/667 ,  H01M2220/30 ,  H02J7/0029 ,  H02J7/0042 ,  H02J7/0045 ,  H02J7/0091 ,  H05K7/20909

摘要： To reduce standby time during charging, a charging device includes a housing on which a battery pack is detachably mountable, a control board, and a cooling fan. The battery pack is formed with a vent hole. The housing is formed with a ventilation opening configured to face the vent hole. The cooling fan is configured to flow an air passing through the control board and the ventilation opening, and is configured to work even in a state where the battery pack is detached.

公开(公告)号：US09801314B2

公开(公告)日：2017-10-24

申请号：US15276830

申请日：2016-09-27

申请人： FUJI ELECTRIC CO., LTD.

发明人： Takashi Kuwabara

IPC分类号： H05K7/20 ,  H02M1/14 ,  H05K1/14 ,  H05K1/18 ,  H02M7/00 ,  H02M1/32

CPC分类号： H05K7/20909 ,  H02M1/143 ,  H02M7/003 ,  H02M2001/327 ,  H05K1/0203 ,  H05K1/14 ,  H05K1/181 ,  H05K7/209 ,  H05K2201/04 ,  H05K2201/10015

摘要： A first printed circuit board on which a heatsink having a discrete semiconductor device attached to it and first capacitors for smoothing an electric current after a conversion from AC to DC are mounted is arranged in the horizontal direction of a bottom portion of a device casing. On the first printed circuit board, various electronic components such as a resistor, a diode, a capacitor, a coil, etc. are mounted in addition to the heatsink and the first capacitors. Further, in an in-device-casing vacant space in an upper portion of the heatsink mounted on the first printed circuit board, a second printed circuit board on which second capacitors for performing smoothing upon a conversion from AC to DC are mounted is arranged orthogonally to the first printed circuit board in the device spacing.

公开(公告)号：US20170303444A1

公开(公告)日：2017-10-19

申请号：US15221778

申请日：2016-07-28

申请人： KABUSHIKI KAISHA YASKAWA DENKI

发明人： Fumiya ONO ,  Sumiaki NAGANO

IPC分类号： H05K7/20 ,  H01R9/24

CPC分类号： H05K7/20909 ,  H01R9/2416 ,  H05K7/1432

摘要： An electric power conversion apparatus comprises a terminal block for connecting a conductive member, the terminal block including: a terminal; a movable fastener that switches by movement between a first state and a second state, the first state being a state of holding the conductive member connected with the terminal, the second state being a state of releasing the conductive member; a storage unit that stores at least a part of the movable fastener in at least one of the first state and the second state; and vent holes that are provided in the storage unit.

公开(公告)号：US20170288565A1

公开(公告)日：2017-10-05

申请号：US15625184

申请日：2017-06-16

申请人： SMA SOLAR TECHNOLOGY AG

发明人： Lars Bethke ,  Jens Dittmar

IPC分类号： H02M7/00 ,  H05K5/02 ,  H05K7/20

CPC分类号： H02M7/003 ,  H02M1/32 ,  H05K5/0217 ,  H05K7/1432 ,  H05K7/2039 ,  H05K7/20909 ,  H05K7/20918

摘要： An inverter for converting an input-end direct current into an output-end alternating current to be fed into an AC voltage supply system includes a first housing part with direct current connections for receiving direct current lines of a direct current generator, a second housing part with alternating current connections for receiving alternating current lines of an AC voltage supply system, a third housing part for accommodating power-electronics components of a DC voltage converter, and a fourth housing part for accommodating power-electronics components of an inverter bridge circuit. The housing parts each have an essentially planar rear wall and are arranged in such a way that they enclose a cooling-air duct with an essentially rectangular cross section, wherein the first housing part is arranged opposite the second housing part and the third housing part is arranged opposite the fourth housing part. The inverter also includes a heat sink, which has two essentially planar cooling faces opposite one another arranged in the cooling-air duct, wherein the cooling faces are assigned to the rear walls of the third housing part and the fourth housing part and are in thermal contact with power-electronics components arranged in these housing parts.