-
公开(公告)号：US20210094128A1
公开(公告)日：2021-04-01
申请号：US17024871
申请日：2020-09-18
申请人： DISCO CORPORATION
发明人： Keiji NOMARU
摘要： A laser beam applying unit of a laser processing apparatus includes a beam splitter disposed on a first optical path connecting a laser oscillator and a condenser, a wide band light source disposed on a second optical path branched by the beam splitter, a spectroscope that is disposed between the wide band light source and the beam splitter and that branches the laser beam from the second optical path to a third optical path, and a Z position detection unit that is disposed on the third optical path branched by the spectroscope and that detects the position in a Z-axis direction of a workpiece according to an intensity of light corresponding to the wavelength of return light that is generated when the light of the wide band light source is condensed by the condenser and is reflected by the workpiece held by a chuck table.
-
公开(公告)号：US10888925B2
公开(公告)日：2021-01-12
申请号：US15909783
申请日：2018-03-01
申请人： VELO3D, INC.
发明人： Kimon Symeonidis , Rueben Joseph Mendelsberg , Nina Cathryn Bordeaux , Gregory Ferguson Brown , Tasso Lappas
IPC分类号： B23K9/04 , B22F3/105 , B23K15/00 , B23K15/02 , B23K26/03 , B23K26/04 , B23K26/06 , B23K26/342 , G05B19/4099 , B23K37/06 , B23K15/06 , B23K15/10 , B23K26/00 , B23K26/12 , B22F3/11 , B23K26/70 , B23K26/354 , B23K26/352 , B23K26/34 , B23K26/08 , B23K26/082 , B23K26/10 , B33Y10/00 , B33Y30/00 , B33Y40/00 , B33Y50/02 , B23K103/00 , B22F7/00 , C22C1/04 , B33Y80/00
摘要： The present disclosure provides three-dimensional (3D) printing methods, apparatuses, systems and/or software to form one or more three-dimensional objects, some of which may be complex. The three-dimensional objects may be formed by three-dimensional printing using one or more methodologies. In some embodiments, the three-dimensional object may comprise an overhang portion, such as a cavity ceiling, with diminished deformation and/or auxiliary support structures.
-
公开(公告)号：US20200290156A1
公开(公告)日：2020-09-17
申请号：US16889791
申请日：2020-06-01
申请人： Gigaphoton Inc.
IPC分类号： B23K26/382 , B23K26/0622 , B23K26/066 , B23K26/06 , B23K26/04 , B23K26/03
摘要： A laser processing method of performing laser processing on a transparent material that is transparent to ultraviolet light includes: A. a positioning step of performing positioning so that a transfer position of a transfer image is set at a position inside the transparent material at a predetermined depth ΔZsf from a surface of the transparent material in an optical axis direction; B. an irradiation condition acquisition step; C. a determination step of determining whether a maximum fluence of a pulse laser beam at the surface of the transparent material is within a predetermined range based on irradiation conditions; and D. a control step of allowing irradiation with the pulse laser beam when the maximum fluence is determined to be in the predetermined range.
-
公开(公告)号：US10763322B2
公开(公告)日：2020-09-01
申请号：US16509819
申请日：2019-07-12
IPC分类号： H01L27/32 , H01L51/00 , H01L51/56 , H01L51/52 , H01L27/12 , H01L29/24 , H01L29/66 , H01L29/786 , B23K26/0622 , B23K26/04 , B23K26/06 , B23K26/08 , H01L51/50 , H01L41/314
摘要： A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over the second organic resin layer; a second element layer is formed over the second insulating film; the first substrate and the second substrate are bonded; a first separation step in which adhesion between the first organic resin layer and the first substrate is reduced; the first organic resin layer and a first flexible substrate are bonded with a first bonding layer; a second separation step in which adhesion between the second organic resin layer and the second substrate is reduced; and the second organic resin layer and a second flexible substrate are bonded with a second bonding layer.
-
公开(公告)号：US10737355B2
公开(公告)日：2020-08-11
申请号：US15823505
申请日：2017-11-27
申请人： Glowforge Inc.
IPC分类号： B23K26/04 , B23K26/402 , B23K37/04 , B23K26/0622 , B23K26/08 , B23K26/38 , B23K26/364 , B23K26/40 , B23K37/02 , G05B19/4093 , B23K26/361 , B23K26/03 , B23K26/06 , B23K26/073 , B23K26/362 , B23K103/00
摘要： A method for dithering can include receiving, at a computer numerically controlled machine comprising a laser, a motion plan corresponding to a first image. The output of the laser can be dithered, in accordance with the motion plan, to effect a change in a material within an interior space of the computer numerically controlled machine. The change can substantially reproduce at least a portion of the first image on the material. The dithering can include providing laser energy to the material at a native resolution based at least on a spot size of the laser. The spot size can be determined based at least on one or more parameters of the computer numerically controlled machine and/or one or more properties of the material. The laser energy can be delivered at locations separated by a distance no less than the spot size.
-
公开(公告)号：US20200251547A1
公开(公告)日：2020-08-06
申请号：US16856139
申请日：2020-04-23
IPC分类号： H01L27/32 , H01L51/00 , H01L51/56 , H01L51/52 , H01L27/12 , H01L29/24 , H01L29/66 , H01L29/786 , B23K26/0622 , B23K26/04 , B23K26/06 , B23K26/08
摘要： A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over the second organic resin layer; a second element layer is formed over the second insulating film; the first substrate and the second substrate are bonded; a first separation step in which adhesion between the first organic resin layer and the first substrate is reduced; the first organic resin layer and a first flexible substrate are bonded with a first bonding layer; a second separation step in which adhesion between the second organic resin layer and the second substrate is reduced; and the second organic resin layer and a second flexible substrate are bonded with a second bonding layer.
-
公开(公告)号：US10730139B2
公开(公告)日：2020-08-04
申请号：US15502034
申请日：2015-08-04
IPC分类号： B23K26/04 , B23K26/082 , B23K26/08 , B23K26/32 , B23K37/04 , B23K26/244 , B23K26/282 , B23K101/06 , B23K103/04 , B23K103/10 , B23K103/14 , B23K101/10
摘要： This laser irradiation mechanism includes a control unit which has a function allowing the focal point of a laser beam to describe a circle, performs control such that the focal point describes a spiral, and performs control such that the central axis of the spiral moves along a curved surface.
-
公开(公告)号：US10712151B2
公开(公告)日：2020-07-14
申请号：US15595352
申请日：2017-05-15
发明人： Robert Borgstrom , Brian Smith
IPC分类号： G01B11/27 , B23K26/03 , B23K26/035 , G01B11/00 , G01B11/14 , G01D5/353 , B23K26/70 , B23K26/042 , B23K26/14 , B23K26/04 , H04W4/00
摘要： The present invention relates to a sensor device for determining alignment/misalignment of a laser beam relative to a gas nozzle of a laser machining head which comprises a sensor housing provided with mounting means adapted to mount the housing to a laser machining head, a camera device comprising a camera, the camera device is provided in the sensor housing, so that the camera faces the tip of the gas nozzle when the sensor housing is mounted to the laser machining head for visualizing an orifice of the gas nozzle and a pilot laser simultaneously, and output means for outputting image signals obtained by the camera.
-
公开(公告)号：US10707130B2
公开(公告)日：2020-07-07
申请号：US15911389
申请日：2018-03-05
发明人： Shih-Chi Chen , Hiu Hung Lee , Dapeng Zhang , Erxuan Zhao , Yina Chang , Dihan Chen
IPC分类号： B23K26/06 , B23K26/03 , B23K26/067 , B23K26/38 , B23K26/0622 , B23K26/04 , B23K26/14 , B23K26/08 , H01L21/78 , H01L21/268 , H01L21/67
摘要： Systems and methods for dicing a sample by a Bessel beam matrix are disclosed. The method for dicing a sample by a Bessel beam matrix may comprise generating a Bessel beam matrix including multiple Bessel beams arranged in a matrix form, according to a predetermined dicing layout of the sample; controlling a focus position of each Bessel beam in the generated Bessel beam matrix; and focusing simultaneously the Bessel beams of the Bessel beam matrix at the respective controlled focus positions within the sample for dicing.
-
公开(公告)号：US10695863B1
公开(公告)日：2020-06-30
申请号：US16548939
申请日：2019-08-23
发明人： Christoph Dietz
摘要： A method for controlled machining of a workpiece includes focusing a laser light beam on a target point of the workpiece to generate a laser focus point. An optical distance measuring device gathers measuring data to determine a distance between the target point and a laser target optics. The workpiece is positioned in relation to the laser focus point based on the distance measuring data gathered. The distance measuring device is a confocal optical distance measuring device having a measuring light source for generating a measuring light and having a variable-focal-length measuring lens system. The focal length of the variable-focal-length measuring lens system is varied over time to gather distance measuring data at different focal length values of the variable-focal-length measuring lens system. A device for controlled machining includes a laser light source, a laser target optics, a distance measuring device, a positioning device, and an evaluation and control unit.
-
-
-
-
-
-
-
-
-
搜索结果
1136 条记录 (耗时 0.021 秒)
