Abstract:
A test method whereby a high current is supplied to a first pin of an integrated device to be tested, and the variation in the voltage drop between the first pin and a second pin on the device to be tested is determined; the two pins being connected to two pads in turn connected, inside the device to be tested, by a low-voltage-drop path. The variation in the voltage drop of the device to be tested is compared with the measured nominal variation of an undoubtedly sound device of the same type, to determine any excessive deviation indicative of deficiency. The supply current in fact results in power dissipation, local heating and, consequently, a variation in the resistance of the connecting wires or of the die attachment to the lead frame, the extent of which differs according to whether only one or both of the wires of a two-wire connection to be tested are present, and according to whether the die is attached properly, poorly or badly to the lead frame. This variation in resistance is reflected in the amount or speed by which the detected voltage drop varies, thus enabling sound parts to be distinguished from faulty ones.
Abstract:
A method employing a test structure identical to the memory array whose gate oxide quality is to be determined, except for the fact that the cells are connected electrically parallel to one another. The test structure is so stressed electrically as to extract electrons from the floating gate of the defective-gate-oxide cells and so modify the characteristic of the cell while leaving the charge of the non-defective cells unchanged. In this way, only the threshold of the defective cells is altered. A sub-threshold voltage is then applied to the test structure, and the drain current through the cells, which is related to the presence of at least one defective cell in the structure, is measured. Measurement and analysis of the current-voltage characteristic provides for determining the number of defective cells. The method is suitable for in-line quality control of the gate oxide of EPROM, EEPROM and flash-EEPROM memories.
Abstract:
A power supply in which control of the switch-on instant of a power device of a boost-circuit (operating in a discontinuous mode) is implemented by monitoring the current which actually flows through the "fly-back" inductance. The current is monitored on a sensing resistance, and, by the use of a comparator, a signal is produced for enabling/disabling the transfer to an input of a PWM driving circuit of a switch-on signal produced by a null detector. This configuration provide good noise immunity, which is particularly useful in power-factor-correction applications, and reduced power dissipation.
Abstract:
A bipolar power transistor and a low voltage bipolar transistor are combined in an emitter switching or a semibridge configuration in an integrated structure. In a version with non-isolated components, the components of the structure are totally or partially superimposed on each other, partly in a first epitaxial layer and partly in a second epitaxial layer, and the low voltage bipolar transistor is situated above the emitter region of the bipolar power transistor which is thus a completely buried active structure. In a version with isolated components, there are two P+ regions in an N- epitaxial layer. The first P+ region constitutes the power transistor base and encloses the N+ emitter region of the power transistor. The second P+ region encloses two N+ regions and one P+ region, constituting the collector, emitter, and base regions respectively of the low voltage transistor. A metallization on the front of the chip provides a connection between the collector contact of the low voltage transistor and the emitter contact of the power transistor.
Abstract:
A method is provided for directly reading the current of cells of a memory forming part of a microcontroller by performing a write operation of the cells and using the existing cell programming logic. For this purpose, the programming voltage supply line is supplied with a low voltage (e.g., 1 V); the word line of the cell for reading is enabled; and a write instruction of a data item having a predetermined logic level (e.g., zero) is performed at the bit corresponding to the cell for reading. By providing an additional pass transistor connected to each reference bit line (RBL) and an additional reference cell enabling line (REF-EN), the reference cells may also be read directly.
Abstract:
The amplifier includes a pair of bipolar input transistors (Q1, Q2), each having a base adapted to receive a differential input signal, a collector and an emitter which is biased by a first fixed current source (M7, M8) of its own and a degeneration resistor (R) which connects the emitters of the two bipolar transistors. The collector of each bipolar transistor is also biased by a second fixed current source (M5, M6) with a smaller current than that of the first source, and the collectors of the two bipolar transistors are furthermore connected to the input terminals of respective MOS amplifier devices (M1, M2, M3, M4, R.sub.L). The amplifier can be made in BCD, BiCMOS or purely CMOS technology, in which case the bipolar transistors are obtained as lateral bipolar transistors.
Abstract:
A method of manufacture of a low-capacitance programmed cell structure for read-only memory circuits comprises a field-effect transistor having conventional source and drain regions separated by a channel region overlaid by the gate of the transistor. This ROM memory cell is programmed by a channel implant extending only from the source region for a selected distance into the channel region.
Abstract:
The regulation of the output voltage of a voltage multiplier driven by a ring oscillator, an inverter of which is substituted by a NOR gate for providing a terminal through which stopping the oscillation, is effected by controlling the oscillation frequency in function of the current delivered by the voltage multiplier by means of a transistor T1 working as a current generator connected in series with a regulating chain of series-connected diodes by biasing the gate of the transistor with a constant voltage Vref, thus imposing a reference current Iref through the transistor. The voltage signal across the transistor is fed to the input of a first inverter with a preset triggering threshold and the output signal of the inverter is fed through an amplifying and phase-regenerating stage to said terminal for stopping the oscillation of said NOR gate of the ring oscillator. When the discharge current through the regulating chain becomes greater than the imposed current Iref, across the transistor T1 a voltage signal develops which, beyond a certain threshold, determines the switching of the inverter and, through the amplifying and phase-regenerating stage, causes a stop of the oscillation which resumes only when conduction through the regulating chain stops. At steady state the oscillation frequency will result controlled so as to maintain constant the output voltage of the voltage multiplier and to limit the discharge current through the regulating chain thus limiting power consumption.
Abstract:
A fast-discharge switch is controlled by a comparator sensing the voltage difference between the output node and the input node of a driving integrator stage that controls the slew-rate of a power switching output transistor. The fast-discharge switch turns off automatically when the output power transistor reaches (in the case of a MOS transistor) or exits (in the case of a bipolar transistor) saturation. The circuit of the invention accelerates the discharge thus reducing the turn-off delay and is insensitive of load conditions and does not affect the performance of the integrating (driver) stage that control the slew-rate.
Abstract:
A regulator including a power element between the input terminal and output terminal; and a regulating loop including a differential stage for comparing the output voltage of the regulator with a reference voltage and accordingly driving a gain stage connected to the power element. The output voltage is picked up by the differential stage via a resistive divider, the resistance of which varies according to the value of a logic signal at a control input. When the resistance of the divider changes, the inputs of the differential stage are so unbalanced as to produce an output voltage up or down ramp equal to the slew rate of the regulating loop and proportional to the bias current of the differential stage. Over the up ramp, the shorting protection circuit is turned off for a predetermined time .tau., whereas, over the down ramp, a stage is turned on for absorbing the discharge current of the capacitive load.