Apparatus for dispensing droplet and method for dispensing droplet

    公开(公告)号:US11858264B2

    公开(公告)日:2024-01-02

    申请号:US17391383

    申请日:2021-08-02

    Applicant: SEMES CO., LTD

    Abstract: An apparatus for dispensing droplet may include a droplet discharging member, a stage and a control member. The droplet discharging member may include a plurality of nozzles arranged in a first direction by a constant interval. The stage may receive a substrate including a plurality of regions for forming a plurality of pixels of a same size disposed in the first direction and a second direction substantially perpendicular to the first direction. The control member may control the droplet discharging member such that amounts of droplets may be substantially identical in the regions of the substrate for the pixels if the numbers of the nozzles of the droplet discharging member with respect to sides of the regions of the substrate for the pixels are different in the first direction. The control member may identify patterns of discharged droplets in the regions of the substrate for the pixels and adjusts the amounts of the droplets form the nozzles of the droplet discharging member by controlling operation of each of nozzles of the droplet discharging member.

    COMPONENT CARRIER FOR SEMICONDUCTOR MANUFACTURING AND COMPONENT TRANSPORT SYSTEM USING SAME

    公开(公告)号:US20230411196A1

    公开(公告)日:2023-12-21

    申请号:US18126974

    申请日:2023-03-27

    Inventor: Jae Won SHIN

    CPC classification number: H01L21/67766 H01L21/6719 H01L21/67769 H01L21/6831

    Abstract: Proposed is a component carrier for semiconductor manufacturing and component transport system using the same and, more particularly, to a component carrier for semiconductor manufacturing and component transport system using the same with an improved structure to prevent a ring from being separated from the component carrier for semiconductor manufacturing during a ring transport process by temporarily fixing the ring using vacuum adsorption. The carrier transports components while a lower surface thereof is in contact with a transport hand and an upper surface thereof is in contact with a component for semiconductor manufacturing. The carrier includes a first vacuum hole formed through the upper surface, a second vacuum hole formed through the lower surface, and an air passage provided between the first vacuum hole and the second vacuum hole.

    Head cleaning device and substrate treating apparatus

    公开(公告)号:US11840089B2

    公开(公告)日:2023-12-12

    申请号:US17394803

    申请日:2021-08-05

    CPC classification number: B41J2/16552 B41J2/1652 B41J2002/16558

    Abstract: An inkjet head cleaning device includes a body; an ejection part formed in the body, and configured to eject a cleaning liquid to a nozzle surface of a head; and a suction part formed in the body, and configured to suck the cleaning liquid ejected from the ejection part and used for cleaning the nozzle surface of the head, and foreign substances separated from the nozzle surface of the head; and the ejection part includes a vertical passage through which the cleaning liquid flows and a discharge end at the end of the vertical passage and configured to guide the cleaning liquid to eject toward the suction part.

    APPARATUS FOR MOUNTING COMPONENT AND METHOD FOR MOUNTING COMPONENT

    公开(公告)号:US20230382660A1

    公开(公告)日:2023-11-30

    申请号:US18323709

    申请日:2023-05-25

    CPC classification number: B65G47/905

    Abstract: An apparatus for mounting a component includes an articulated robot mounting a component on a replacement target where the component is provided at a mounting position, a first sensor unit provided in the articulated robot and sensing the mounting position or whether or not the component is provided, a second sensor unit provided in the articulated robot and sensing spaced distances between the articulated robot and the mounting position at a plurality of points, and a control unit controlling the articulated robot to mount the component on the replacement target and controlling a position of the articulated robot so that a difference between spaced distance values between the articulated robot and the plurality of points sensed by the second sensor unit converges to zero, when the component is not sensed or a surface of the mounting position is sensed by the first sensor unit.

    Apparatus for treating a substrate
    470.
    发明授权

    公开(公告)号:US11829070B2

    公开(公告)日:2023-11-28

    申请号:US17557230

    申请日:2021-12-21

    CPC classification number: G03F7/162 B05C11/02

    Abstract: An apparatus for treating a substrate, the apparatus comprising: a treating container having an inner space; a support unit supporting and rotating the substrate in the inner space; and an exhaust unit exhausting an air flow in the inner space, wherein the treating container includes an outer cup providing the inner space; and an inner cup disposed at the inner space and spaced apart from the outer cup, and wherein the outer cup has a protrusion at a side wall thereof.

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