公开(公告)号：US10766119B2

公开(公告)日：2020-09-08

申请号：US14322686

申请日：2014-07-02

Applicant: Applied Materials, Inc.

Inventor： Boguslaw A. Swedek ,  Dominic J. Benvegnu ,  Jeffrey Drue David

IPC: B24B49/12 ,  B24B37/013 ,  H01L21/26 ,  B24D7/14 ,  H01L21/66 ,  B24B49/08 ,  B24B37/20 ,  G05B15/02 ,  G05B13/04 ,  H01L21/321 ,  H01L21/3105

Abstract: A computer implemented method of monitoring a polishing process includes, for each sweep of a plurality of sweeps of an optical sensor across a substrate undergoing polishing, obtaining a plurality of current spectra, each current spectrum of the plurality of current spectra being a spectrum resulting from reflection of white light from the substrate, for each sweep of the plurality of sweeps, determining a difference between each current spectrum and each reference spectrum of a plurality of reference spectra to generate a plurality of differences, for each sweep of the plurality of sweeps, determining a smallest difference of the plurality of differences, thus generating a sequence of smallest difference, and determining a polishing endpoint based on the sequence of smallest differences.

公开(公告)号：US10651098B2

公开(公告)日：2020-05-12

申请号：US15173584

申请日：2016-06-03

Applicant: Applied Materials, Inc.

Inventor： Tomohiko Kitajima ,  Jeffrey Drue David ,  Jun Qian ,  Taketo Sekine ,  Garlen C. Leung ,  Sidney P. Huey

IPC: B24B49/10 ,  H01L21/66 ,  H01L21/67 ,  B24B37/013 ,  H01L21/321 ,  H01L21/3105

Abstract: A method of controlling polishing includes storing a base measurement, the base measurement being a measurement of a substrate after deposition of at least one layer overlying a semiconductor wafer and before deposition of an outer layer over the at least one layer, after deposition of the outer layer over the at least one layer and during polishing of the outer layer on substrate, receiving a sequence of raw measurements of the substrate from an in-situ monitoring system, normalizing each raw measurement in the sequence of raw measurement to generate a sequence of normalized measurements using the raw measurement and the base measurement, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on at least the sequence of normalized measurements.

公开(公告)号：US10276460B2

公开(公告)日：2019-04-30

申请号：US15403915

申请日：2017-01-11

Applicant: Applied Materials, Inc.

Inventor： Dominic J. Benvegnu ,  Jeffrey Drue David ,  Boguslaw A. Swedek

IPC: H01L21/66 ,  B24B37/20 ,  H01L21/67 ,  H01L21/306 ,  H01L21/3105 ,  H01L21/321 ,  B24B37/013 ,  B24B49/12 ,  B24B49/08 ,  B24D7/14

Abstract: A method of detecting a polishing endpoint includes storing a plurality of library spectra, measuring a sequence of spectra from the substrate in-situ during polishing, and for each measured spectrum of the sequence of spectra, finding a best matching library spectrum from the plurality of library spectra to generate a sequence of best matching library spectra. Each library spectrum has a stored associated value representing a degree of progress through a polishing process, and the stored associated value for the best matching library spectrum is determined for each best matching library spectrum to generate a sequence of values representing a progression of polishing of the substrate. The sequence of values is compared to a target value, and a polishing endpoint is triggered when the sequence of values reaches the target value.

公开(公告)号：US10086492B2

公开(公告)日：2018-10-02

申请号：US15818366

申请日：2017-11-20

Applicant: Applied Materials, Inc.

Inventor： Jeffrey Drue David ,  Boguslaw A. Swedek ,  Benjamin Cherian

IPC: G01B5/02 ,  B24B37/013 ,  B24B49/12 ,  H01L21/66 ,  H01L21/306

Abstract: A plurality of spectra reflected from one or more substrates at a plurality of different positions on the one or more substrates are represented in the form of a first matrix, and the first matrix is decomposed into products of at least two component matrixes of a first set of component matrixes. The dimensions of each of the at least two component matrixes is reduced to produce a second set of component matrixes containing the at least two matrixes with reduced dimensions.

公开(公告)号：US20170113320A1

公开(公告)日：2017-04-27

申请号：US15400183

申请日：2017-01-06

Applicant: Applied Materials, Inc.

Inventor： Jeffrey Drue David ,  Boguslaw A. Swedek ,  Benjamin Cherian

IPC: B24B37/013 ,  H01L21/66 ,  H01L21/306 ,  B24B49/12

CPC classification number: B24B37/013 ,  B24B49/12 ,  G01B11/06 ,  G01B11/0625 ,  H01L21/30625 ,  H01L22/12 ,  H01L22/20 ,  H01L22/26

Abstract: A plurality of spectra reflected from one or more substrates at a plurality of different positions on the one or more substrates are represented in the form of a first matrix, and the first matrix is decomposed into products of at least two component matrixes of a first set of component matrixes. The dimensions of each of the at least two component matrixes is reduced to produce a second set of component matrixes containing the at least two matrixes with reduced dimensions.

公开(公告)号：US09583405B2

公开(公告)日：2017-02-28

申请号：US14832997

申请日：2015-08-21

Applicant: Applied Materials, Inc.

Inventor： Dominic J. Benvegnu ,  Jeffrey Drue David ,  Boguslaw A. Swedek

IPC: H01L21/302 ,  H01L21/66 ,  B24B37/013 ,  B24B37/20 ,  B24B49/08 ,  B24B49/12 ,  B24D7/14 ,  H01L21/321 ,  H01L21/306 ,  H01L21/3105

CPC classification number: H01L22/26 ,  B24B37/013 ,  B24B37/205 ,  B24B49/08 ,  B24B49/12 ,  B24D7/14 ,  H01L21/30625 ,  H01L21/31053 ,  H01L21/31055 ,  H01L21/3212 ,  H01L21/67075 ,  H01L21/67092 ,  H01L21/67253

Abstract: Methods and apparatus for spectrum-based endpointing. An endpointing method includes selecting a reference spectrum. The reference spectrum is a spectrum of white light reflected from a film of interest on a first substrate and has a thickness greater than a target thickness. The reference spectrum is empirically selected for particular spectrum-based endpoint determination logic so that the target thickness is achieved when endpoint is called by applying the particular spectrum-based endpoint logic. The method includes obtaining a current spectrum. The current spectrum is a spectrum of white light reflected from a film of interest on a second substrate when the film of interest is being subjected to a polishing step and has a current thickness that is greater than the target thickness. The method includes determining, for the second substrate, when an endpoint of the polishing step has been achieved. The determining is based on the reference and current spectra.

Abstract translation: 用于基于频谱的终点的方法和装置。 终点方法包括选择参考频谱。 参考光谱是在第一衬底上从感兴趣的膜反射的白光的光谱，并且具有大于目标厚度的厚度。 对于特定的基于频谱的端点确定逻辑，经验地选择参考频谱，使得当通过应用特定的基于频谱的端点逻辑来调用端点时实现目标厚度。 该方法包括获得当前频谱。 目前的光谱是当感兴趣的薄膜经受抛光步骤并且具有大于目标厚度的电流厚度时，在第二基板上从感兴趣的薄膜反射的白光的光谱。 该方法包括为第二基底确定何时已经实现了抛光步骤的终点。 该确定基于参考和当前光谱。

公开(公告)号：US09283653B2

公开(公告)日：2016-03-15

申请号：US14331534

申请日：2014-07-15

Applicant: Applied Materials, Inc.

Inventor： Jeffrey Drue David ,  Harry Q. Lee

IPC: B24B49/12 ,  B24B37/013 ,  B24B37/20

CPC classification number: B24B49/12 ,  B24B37/013 ,  B24B37/205 ,  G01N21/25

Abstract: A method of controlling polishing includes polishing a substrate and receiving an identification of a selected spectral feature, a wavelength range having a width, and a characteristic of the selected spectral feature to monitor during polishing. A sequence of spectra of light from the substrate is measured while the substrate is being polished. A sequence of values of the characteristic of the selected spectral feature is generated from the sequence of spectra. For at least some spectra from the sequence of spectra, a modified wavelength range is generated based on a position of the spectral feature within a previous wavelength range used for a previous spectrum in the sequence of spectra, the modified wavelength range is searched for the selected spectral feature, and a value of a characteristic of the selected spectral feature is determined.

Abstract translation: 控制抛光的方法包括抛光衬底并接收所选择的光谱特征的识别，具有宽度的波长范围以及所选择的光谱特征的特征以在抛光期间进行监视。 在衬底被抛光的同时测量来自衬底的光的光谱序列。 从光谱序列中产生所选光谱特征的特征值的序列。 对于来自光谱序列的至少一些光谱，基于在光谱序列中用于先前光谱的先前波长范围内的光谱特征的位置来生成修改的波长范围，将修改的波长范围搜索所选择的 光谱特征和所选光谱特征的特征值被确定。

公开(公告)号：US09227293B2

公开(公告)日：2016-01-05

申请号：US13791617

申请日：2013-03-08

Applicant: Applied Materials, Inc.

Inventor： Jeffrey Drue David ,  Boguslaw A. Swedek ,  Doyle E. Bennett ,  Thomas H. Osterheld ,  Benjamin Cherian ,  Dominic J. Benvegnu ,  Harry Q. Lee ,  Allen L. D'Ambra ,  Jagan Rangarajan

IPC: B24B37/00 ,  B24B37/005 ,  B24B37/013 ,  B24B37/04 ,  B24B37/34

CPC classification number: B24B37/005 ,  B24B37/013 ,  B24B37/04 ,  B24B37/345

Abstract: A polishing apparatus includes a plurality of stations supported on a platform, the plurality of stations including at least two polishing stations and a transfer station, each polishing station including a platen to support a polishing pad, a plurality of carrier heads suspended from and movable along a track such that each polishing station is selectively positionable at the stations, and a controller configured to control motion of the carrier heads along the track such that during polishing at each polishing station only a single carrier head is positioned in the polishing station.

Abstract translation: 抛光装置包括支撑在平台上的多个工位，所述多个工位包括至少两个抛光站和转移站，每个抛光站包括用于支撑抛光垫的压板，多个托架头悬挂并可沿其移动 轨道，使得每个抛光站可选择性地定位在车站处;以及控制器，被配置为控制承载头沿着轨道的运动，使得在每个抛光站的抛光期间，只有单个承载头位于抛光台中。

公开(公告)号：US20140329440A1

公开(公告)日：2014-11-06

申请号：US14331534

申请日：2014-07-15

Applicant: Applied Materials, Inc.

Inventor： Jeffrey Drue David ,  Harry Q. Lee

IPC: B24B49/12

CPC classification number: B24B49/12 ,  B24B37/013 ,  B24B37/205 ,  G01N21/25

Abstract: A method of controlling polishing includes polishing a substrate and receiving an identification of a selected spectral feature, a wavelength range having a width, and a characteristic of the selected spectral feature to monitor during polishing. A sequence of spectra of light from the substrate is measured while the substrate is being polished. A sequence of values of the characteristic of the selected spectral feature is generated from the sequence of spectra. For at least some spectra from the sequence of spectra, a modified wavelength range is generated based on a position of the spectral feature within a previous wavelength range used for a previous spectrum in the sequence of spectra, the modified wavelength range is searched for the selected spectral feature, and a value of a characteristic of the selected spectral feature is determined.

Abstract translation: 控制抛光的方法包括抛光衬底并接收所选择的光谱特征的识别，具有宽度的波长范围以及所选择的光谱特征的特征以在抛光期间进行监视。 在衬底被抛光的同时测量来自衬底的光的光谱序列。 从光谱序列中产生所选光谱特征的特征值的序列。 对于来自光谱序列的至少一些光谱，基于在光谱序列中用于先前光谱的先前波长范围内的光谱特征的位置来生成修改的波长范围，将修改的波长范围搜索所选择的 光谱特征和所选光谱特征的特征值被确定。

公开(公告)号：US20140242880A1

公开(公告)日：2014-08-28

申请号：US13777953

申请日：2013-02-26

Applicant: Applied Materials, Inc.

Inventor： Jeffrey Drue David

IPC: B24B49/12 ,  B24B37/013

CPC classification number: B24B49/12 ,  B24B37/013

Abstract: A method of controlling a polishing operation includes storing an optical model for a layer stack having a plurality of layers. The optical model has a plurality of input parameters, the plurality of input parameters including a first parameter and a second parameter. The second parameter is a polarization angle or a relative contribution between two orthogonal polarizations. A spectrum reflected from the substrate is measured with an in-sequence or in-situ monitoring system to provide a measured spectrum. The optical model is fit to the measured spectrum, or a plurality of reference spectra are calculated using the optical model and a best matching reference spectrum from the plurality of reference spectra is determined.

Abstract translation: 控制抛光操作的方法包括存储具有多个层的层堆叠的光学模型。 所述光学模型具有多个输入参数，所述多个输入参数包括第一参数和第二参数。 第二个参数是两个正交偏振之间的偏振角或相对贡献。 用顺序或原位监测系统测量从底物反射的光谱，以提供测量的光谱。 光学模型适合测量的光谱，或者使用光学模型计算多个参考光谱，并且确定来自多个参考光谱的最佳匹配参考光谱。