公开(公告)号：US20170125313A1

公开(公告)日：2017-05-04

申请号：US15403915

申请日：2017-01-11

Applicant: Applied Materials, Inc.

Inventor： Dominic J. Benvegnu ,  Jeffrey Drue David ,  Boguslaw A. Swedek

IPC: H01L21/66 ,  B24B37/20 ,  H01L21/67 ,  H01L21/306 ,  H01L21/3105 ,  H01L21/321 ,  B24B37/013 ,  B24B49/12

CPC classification number: H01L22/26 ,  B24B37/013 ,  B24B37/205 ,  B24B49/08 ,  B24B49/12 ,  B24D7/14 ,  H01L21/30625 ,  H01L21/31053 ,  H01L21/31055 ,  H01L21/3212 ,  H01L21/67075 ,  H01L21/67092 ,  H01L21/67253

Abstract: A method of detecting a polishing endpoint includes storing a plurality of library spectra, measuring a sequence of spectra from the substrate in-situ during polishing, and for each measured spectrum of the sequence of spectra, finding a best matching library spectrum from the plurality of library spectra to generate a sequence of best matching library spectra. Each library spectrum has a stored associated value representing a degree of progress through a polishing process, and the stored associated value for the best matching library spectrum is determined for each best matching library spectrum to generate a sequence of values representing a progression of polishing of the substrate. The sequence of values is compared to a target value, and a polishing endpoint is triggered when the sequence of values reaches the target value.

公开(公告)号：US09564377B2

公开(公告)日：2017-02-07

申请号：US14088933

申请日：2013-11-25

Applicant: Applied Materials, Inc.

Inventor： Dominic J. Benvegnu ,  Boguslaw A. Swedek ,  David J. Lischka

IPC: H01L21/66 ,  B24B37/013 ,  B24B49/12 ,  B24D7/12 ,  H01L21/3105 ,  H01L21/321

CPC classification number: H01L22/26 ,  B24B37/013 ,  B24B49/12 ,  B24D7/12 ,  H01L21/31053 ,  H01L21/3212

Abstract: A polishing system receives one or more target parameters for a selected peak in a spectrum of light, polishes a substrate, measures a current spectrum of light reflected from the substrate while the substrate is being polished, identifies the selected peak in the current spectrum, measures one or more current parameters of the selected peak in the current spectrum, compares the current parameters of the selected peak to the target parameters, and ceases to polish the substrate when the current parameters and the target parameters have a pre defined relationship.

Abstract translation: 抛光系统接收光谱中所选峰的一个或多个目标参数，抛光衬底，在衬底被抛光时测量从衬底反射的光的当前光谱，识别当前光谱中所选择的峰，测量 当前频谱中所选峰的一个或多个当前参数将所选峰的当前参数与目标参数进行比较，并且当当前参数和目标参数具有预定关系时，停止抛光衬底。

公开(公告)号：US20150160649A1

公开(公告)日：2015-06-11

申请号：US14626147

申请日：2015-02-19

Applicant: Applied Materials, Inc.

Inventor： Jeffrey Drue David ,  Harry Q. Lee ,  Dominic J. Benvegnu ,  Boguslaw A. Swedek

IPC: G05B19/418

CPC classification number: G05B19/418 ,  B24B37/013 ,  B24B37/042 ,  B24B37/205 ,  B24B49/12 ,  G05B2219/45232

Abstract: In one aspect, a method of polishing includes polishing a substrate, and receiving an identification of a selected spectral feature and a characteristic of the selected spectral feature to monitor during polishing. The method includes measuring a sequence of spectra of light reflected from the substrate while the substrate is being polished, where at least some of the spectra of the sequence differ due to material being removed during the polishing. The method of polishing includes determining a value of a characteristic of the selected spectral feature for each of the spectra in the sequence of spectra to generate a sequence of values for the characteristic, fitting a function to the sequence of values, and determining either a polishing endpoint or an adjustment for a polishing rate based on the function.

Abstract translation: 在一个方面，抛光方法包括抛光衬底，以及接收所选择的光谱特征的识别和所选择的光谱特征的特征以在抛光期间进行监测。 该方法包括测量在衬底被抛光时从衬底反射的光的光谱序列，其中序列的至少一些光谱由于在抛光期间被去除的材料而不同。 抛光方法包括确定光谱序列中的每个光谱的所选光谱特征的特征值，以产生特征值的序列，将功能拟合到值序列，以及确定抛光 端点或基于该功能的抛光速率的调整。

公开(公告)号：US08718810B2

公开(公告)日：2014-05-06

申请号：US13666578

申请日：2012-11-01

Applicant: Applied Materials, Inc.

Inventor： Dominic J. Benvegnu ,  Boguslaw A. Swedek ,  Jeffrey Drue David ,  Harry Q. Lee

IPC: G06F19/00

CPC classification number: H01L22/12 ,  B24B37/013 ,  B24B49/12 ,  H01L22/26

Abstract: While a substrate is polished, it is also irradiated with light from a light source. A current spectrum of the light reflected from the surface of the substrate is measured. A selected peak, having a first parameter value, is identified in the current spectrum. A value of a second parameter associated with the first parameter is determined from a lookup table using a processor. Depending on the value of the second parameter, the polishing of the substrate is changed. An initial spectrum of light reflected from the substrate before the polishing of the substrate can be measured and a wavelength corresponding to a selected peak of the initial spectrum can be determined.

Abstract translation: 当抛光衬底时，也照射来自光源的光。 测量从基板的表面反射的光的当前光谱。 在当前光谱中识别具有第一参数值的选定峰。 使用处理器从查找表确定与第一参数相关联的第二参数的值。 根据第二参数的值，改变衬底的抛光。 可以测量在衬底的抛光之前从衬底反射的光的初始光谱，并且可以确定与初始光谱的选定峰对应的波长。

公开(公告)号：US20250108474A1

公开(公告)日：2025-04-03

申请号：US18478649

申请日：2023-09-29

Applicant: Applied Materials, Inc.

Inventor： Nojan Motamedi ,  Dominic J. Benvegnu ,  Boguslaw A. Swedek ,  Harry Q. Lee ,  Steven M. Zuniga ,  Justin Ho Kuen Wong

IPC: B24B37/005 ,  B24B49/12

Abstract: A notch finding station includes a sensor to generate a signal that depends on an proportion of a sensing region of the sensor that is covered by the substrate, and a controller. The controller is configured to cause an actuator to position a carrier head relative to the sensor such that the sensing region of the sensor is at an edge of the substrate, cause the motor to generate rotational motion such that the sensing region of the sensor scans along a circumference of the substrate, and detect an angular position of a notch in the edge of the substrate based on a signal from the sensor, including compensating for a sinusoidal component of the signal resulting from an offset of the center of the substrate from the axis of rotation.

公开(公告)号：US12169925B2

公开(公告)日：2024-12-17

申请号：US18500811

申请日：2023-11-02

Applicant: Applied Materials, Inc.

Inventor： Sivakumar Dhandapani ,  Arash Alahgholipouromrani ,  Dominic J. Benvegnu ,  Jun Qian ,  Kiran Lall Shrestha

IPC: G06T7/00 ,  B24B37/013 ,  G06T7/60

Abstract: A neural network is trained for use in a substrate thickness measurement system by obtaining ground truth thickness measurements of a top layer of a calibration substrate at a plurality of locations, each location at a defined position for a die being fabricated on the substrate. A plurality of color images of the calibration substrate are obtained, each color image corresponding to a region for a die being fabricated on the substrate. A neural network is trained to convert color images of die regions from an in-line substrate imager to thickness measurements for the top layer in the die region. The training is performed using training data that includes the plurality of color images and ground truth thickness measurements with each respective color image paired with a ground truth thickness measurement for the die region associated with the respective color image.

公开(公告)号：US11931860B2

公开(公告)日：2024-03-19

申请号：US18163217

申请日：2023-02-01

Applicant: Applied Materials, Inc.

Inventor： Thomas H. Osterheld ,  Dominic J. Benvegnu

IPC: B24B49/12 ,  B24B37/013 ,  B24B37/04 ,  B24B53/017 ,  G06N3/084

CPC classification number: B24B49/12 ,  B24B37/013 ,  B24B37/04 ,  B24B53/017 ,  G06N3/084

Abstract: A polishing apparatus includes a polishing station to hold a polishing pad, a carrier head to hold a substrate in contact with a polishing pad at the polishing station, a camera positioned to capture an image of a lower surface of a consumable part when the consumable part moves away from the polishing pad, and a controller configured to perform an image processing algorithm on the image to determine whether the consumable part is damaged. The consumable part can be a retaining ring on a carrier head, or a conditioner disk on a conditioner head.

公开(公告)号：US20240017376A1

公开(公告)日：2024-01-18

申请号：US18352446

申请日：2023-07-14

Applicant: Applied Materials, Inc.

Inventor： Brian J. Brown ,  Chirantha Rodrigo ,  Ekaterina A. Mikhaylichenko ,  Boguslaw A. Swedek ,  Thomas H. Osterheld ,  Dominic J. Benvegnu ,  Lakshmanan Karuppiah

IPC: B24B49/04 ,  B24B57/02 ,  B24B37/013 ,  B24B37/26

CPC classification number: B24B49/045 ,  B24B57/02 ,  B24B37/013 ,  B24B37/26

Abstract: A chemical mechanical polishing system includes a support configured to hold a substrate face-up, a polishing article having a polishing surface smaller than an exposed surface of the substrate, a port for dispensing a polishing liquid, one or more actuators to bring the polishing surface into contact with a first portion of the exposed surface of the substrate and to generate relative motion between the substrate and the polishing pad and optically transmissive polymer window, an in-situ optical monitoring system, and a controller configured to receive a signal from the optical in-situ monitoring system and to modifying a polishing parameter based on the signal. The optical monitoring system includes a light source and a detector, the in-situ optical monitoring system configured to direct a light beam from above the support to impinge a non-overlapping second portion of the exposed surface of the substrate.

公开(公告)号：US11836913B2

公开(公告)日：2023-12-05

申请号：US17359307

申请日：2021-06-25

Applicant: Applied Materials, Inc.

Inventor： Sivakumar Dhandapani ,  Arash Alahgholipouromrani ,  Dominic J. Benvegnu ,  Jun Qian ,  Kiran Lall Shrestha

IPC: G06K9/00 ,  G06T7/00 ,  G06T7/60 ,  B24B37/013

CPC classification number: G06T7/001 ,  B24B37/013 ,  G06T7/60 ,  G06T2207/10024 ,  G06T2207/20021 ,  G06T2207/20081 ,  G06T2207/20084 ,  G06T2207/30148

Abstract: A neural network is trained for use in a substrate thickness measurement system by obtaining ground truth thickness measurements of a top layer of a calibration substrate at a plurality of locations, each location at a defined position for a die being fabricated on the substrate. A plurality of color images of the calibration substrate are obtained, each color image corresponding to a region for a die being fabricated on the substrate. A neural network is trained to convert color images of die regions from an in-line substrate imager to thickness measurements for the top layer in the die region. The training is performed using training data that includes the plurality of color images and ground truth thickness measurements with each respective color image paired with a ground truth thickness measurement for the die region associated with the respective color image.

公开(公告)号：US20230281801A1

公开(公告)日：2023-09-07

申请号：US18198053

申请日：2023-05-16

Applicant: Applied Materials, Inc.

Inventor： Dominic J. Benvegnu

IPC: G06T7/00 ,  G06T7/90 ,  B24B37/013 ,  H01L21/67

CPC classification number: G06T7/001 ,  G06T7/0006 ,  G06T7/90 ,  B24B37/013 ,  H01L21/67253 ,  H04N23/12

Abstract: A metrology system for obtaining a measurement representative of a thickness of a layer on a substrate includes a camera positioned to capture a color image of at least a portion of the substrate. A controller is configured to receive the color image from the camera, store a predetermined path in a coordinate space of at least two dimension including a first color channel and a second color channel, store a function that provides a value representative of a thickness as a function of a position on the predetermined path, determine a coordinate of a pixel in the coordinate space from color data in the color image for the pixel, determine a position of a point on the predetermined path that is closest to the coordinate of the pixel, and calculate a value representative of a thickness from the function and the position of the point on the predetermined path.