公开(公告)号：US11501954B2

公开(公告)日：2022-11-15

申请号：US17324892

申请日：2021-05-19

Applicant: Applied Materials, Inc.

Inventor： Vishwas Kumar Pandey ,  Kartik Shah ,  Christopher S. Olsen ,  Agus Sofian Tjandra ,  Hansel Lo ,  Eric Kihara Shono ,  Hemantha Raju

IPC: C23C16/50 ,  H01J37/32 ,  C23C16/455

Abstract: Embodiments of the present disclosure generally relate to a processing chamber for conformal oxidation of high aspect ratio structures. The processing chamber includes a chamber body with a first side and a second side opposite the first side, and a flow assembly disposed in the first side. The flow assembly includes a flow divider to direct fluid flow away from a center of a substrate disposed in a processing region of the processing chamber. The flow divider includes a crescent shaped first side, a top, and a bottom. The processing chamber also includes a distributed pumping structure located adjacent to the second side. The flow assembly is designed to reduce flow constriction of the radicals, leading to increased radical concentration and flux.

公开(公告)号：US20220334569A1

公开(公告)日：2022-10-20

申请号：US17230897

申请日：2021-04-14

Applicant: Applied Materials, Inc.

Inventor： Ala Moradian ,  Elizabeth Neville ,  Umesh Madhav Kelkar ,  Mark R. Denome ,  Prashanth Kothnur ,  Karthik Ramanathan ,  Kartik Shah ,  Orlando Trejo ,  Sergey Meirovich

IPC: G05B19/418 ,  G05B13/02

Abstract: A method including receiving, by a processing device, a first selection of at least one of a first fabrication process or first manufacturing equipment to perform manufacturing operations of the first fabrication process. The method can further include inputting the first selection into a digital replica of the first manufacturing equipment wherein the digital replica outputs physical conditions of the first fabrication process. The method may further include determining environmental resource usage data indicative of a first environmental resource consumption of the first fabrication process run on the first manufacturing equipment based on the physical conditions of the first fabrication process. The processing device may further determine a modification to the first fabrication process that reduces the environmental resource consumption of the first fabrication process run on the first manufacturing equipment. The method can further include performing at least one of applying the modification to the first fabrication.

公开(公告)号：US20220084842A1

公开(公告)日：2022-03-17

申请号：US17019061

申请日：2020-09-11

Applicant: Applied Materials, Inc.

Inventor： Martin Hilkene ,  Kartik Shah ,  Stephen Moffatt

IPC: H01L21/67 ,  G01F1/86

Abstract: Embodiments disclosed herein include a processing tool and methods of using the processing tool. In an embodiment, the processing tool comprises a chamber, and a cartridge for flowing one or more processing gasses into the chamber from a plurality of gas sources. In an embodiment, the processing tool further comprises a mass flow controller for each of the plurality of gas sources, and a mass flow meter between the gas sources and the cartridge. In an embodiment, the processing tool further comprises a first pressure gauge between the mass flow meter and the cartridge, a second pressure gauge fluidically coupled to the chamber, and an exhaust line coupled to the chamber.

公开(公告)号：US11124878B2

公开(公告)日：2021-09-21

申请号：US16049239

申请日：2018-07-30

Applicant: Applied Materials, Inc.

Inventor： Kartik Shah ,  Vishwas Kumar Pandey ,  Kailash Pradhan ,  Sairaju Tallavarjula ,  Rene George ,  Eric Kihara Shono ,  Philip A. Bottini ,  Roger Curtis

IPC: C23C16/455 ,  C23C16/44 ,  H01L21/67 ,  C23C14/56

Abstract: A gas supply member includes a first side opposite a second side and an inner surface defining a first opening extending between the first and second sides. The gas supply member includes a third side orthogonal to the first side, the third side includes a first extension that has a face partially defining the second side, and the first extension includes a first plurality of holes extending through the first extension to the face. The gas supply member includes a fourth side opposite the third side, the fourth side includes a protrusion that has a face partially defining the second side. The gas supply member also includes a baffle disposed adjacent to the inner surface, the baffle includes a first portion extending from the inner surface and a second portion attached to the first portion, and the second portion orthogonal to the first portion and parallel to the third side.

公开(公告)号：US11077410B2

公开(公告)日：2021-08-03

申请号：US16116531

申请日：2018-08-29

Applicant: Applied Materials, Inc.

Inventor： Vishwas Kumar Pandey ,  Lara Hawrylchak ,  Eric Kihara Shono ,  Kartik Shah ,  Christopher S. Olsen ,  Sairaju Tallavarjula ,  Kailash Pradhan ,  Rene George ,  Johanes F. Swenberg ,  Stephen Moffatt

IPC: C23C16/455 ,  B01F3/02 ,  B01J8/22 ,  H01L21/67 ,  B01J4/00

Abstract: Gas injectors for providing uniform flow of fluid are provided herein. The gas injector includes a plenum body. The plenum body includes a recess, a protrusion adjacent to the recess and extending laterally away from the plenum body, and a plurality of nozzles extending laterally from an exterior surface of the plenum body. The plenum body has a plurality of holes in an exterior wall of the plenum body. Each nozzle is in fluid communication with an interior volume of the plenum body. By directing the flow of fluid, the gas injector provides for a uniform deposition.

公开(公告)号：US20200370180A1

公开(公告)日：2020-11-26

申请号：US16876252

申请日：2020-05-18

Applicant: Applied Materials, Inc.

Inventor： Ashutosh Agarwal ,  Sanjeev Baluja ,  Dhritiman Subha Kashyap ,  Kartik Shah ,  Yanjun Xia

IPC: C23C16/455 ,  H01J37/32

Abstract: Provided are gas distribution apparatus with a showerhead having a front plate and a back plate spaced to form a gas volume, the front plate having an inner surface adjacent the gas volume and an outer surface with a plurality of apertures extending therethrough, the gas volume having a center region and an outer region; a first inlet in fluid communication with the center region of the gas volume, the inlet having an inside and an outside; and a mixer disposed on the inside of the inlet to increase gas flow temperature. Also provided are processing chamber apparatus and methods of depositing a film.

公开(公告)号：US10269614B2

公开(公告)日：2019-04-23

申请号：US14885016

申请日：2015-10-16

Applicant: Applied Materials, Inc.

Inventor： Schubert S. Chu ,  Kartik Shah ,  Anhthu Ngo ,  Karthik Ramanathan ,  Nitin Pathak ,  Nyi O. Myo ,  Paul Brillhart ,  Richard O. Collins ,  Kevin Joseph Bautista ,  Edric Tong ,  Zhepeng Cong ,  Anzhong Chang ,  Kin Pong Lo ,  Manish Hemkar

IPC: H01L21/687 ,  H01L21/67 ,  C23C16/458

Abstract: Implementations of the present disclosure generally relate to a susceptor for thermal processing of semiconductor substrates. In one implementation, the susceptor includes a first rim surrounding and coupled to an inner region, and a second rim disposed between the inner rim and the first rim. The second rim includes an angled support surface having a plurality of cut-outs formed therein, and the angled support surface is inclined with respect to a top surface of the inner region.

公开(公告)号：US10221483B2

公开(公告)日：2019-03-05

申请号：US14691496

申请日：2015-04-20

Applicant: Applied Materials, Inc.

Inventor： Kartik Shah ,  Chaitanya A. Prasad ,  Kevin Joseph Bautista ,  Jeffrey Tobin ,  Umesh M. Kelkar ,  Lara Hawrylchak

IPC: C23C16/455 ,  C23C16/458 ,  H01L21/67

Abstract: Embodiments described herein relate to a showerhead having a reflector plate with a gas injection insert for radially distributing gas. In one embodiment, a showerhead assembly includes a reflector plate and a gas injection insert. The reflector plate includes at least one gas injection port. The gas injection insert is disposed in the reflector plate, and includes a plurality of apertures. The gas injection insert also includes a baffle plate disposed in the gas injection insert, wherein the baffle plate also includes a plurality of apertures. A first plenum is formed between a first portion of the baffle plate and the reflector plate, and a second plenum is formed between a second portion of the baffle plate and the reflector plate. The plurality of apertures of the gas injection insert and the plurality of apertures of the baffle plate are not axially aligned.

公开(公告)号：US10047457B2

公开(公告)日：2018-08-14

申请号：US14461137

申请日：2014-08-15

Applicant: Applied Materials, Inc.

Inventor： Kartik Shah ,  Shu-Kwan Lau

IPC: C23C16/458 ,  C30B25/08 ,  C30B25/14 ,  C30B25/12 ,  C30B25/10

CPC classification number: C30B25/14 ,  C23C16/4585 ,  C30B25/08 ,  C30B25/10 ,  C30B25/12 ,  Y10T428/218

Abstract: Embodiments of the present disclosure generally relate to a process chamber having a pre-heat ring for heating the process gas. In one embodiment, the process chamber includes a chamber body defining an interior processing region, a substrate support disposed within the chamber body, the substrate support having a substrate support surface for supporting a substrate, and a pre-heat ring positioned on a ring support disposed within the chamber body, wherein a portion of the pre-heat ring is tilted downwardly by a predetermined angle towards the gas exhaust side with respect to the substrate support surface to promote the purge gas flowing more through the gas exhaust side than the gas injection side.

公开(公告)号：US10000847B2

公开(公告)日：2018-06-19

申请号：US14863063

申请日：2015-09-23

Applicant: Applied Materials, Inc.

Inventor： Preetham Rao ,  Subramani Iyer ,  Kartik Shah ,  Mehran Behdjat

IPC: H05B3/68 ,  C23C16/00 ,  C23C16/458 ,  H01L21/687 ,  H01L21/67

CPC classification number: C23C16/4583 ,  C23C16/4581 ,  H01L21/67098 ,  H01L21/68785

Abstract: Embodiments described herein include a susceptor for semiconductor processing including an oriented graphite plate that may have a thickness of at least 1 mm. The susceptor may have a support member, and the oriented graphite plate may be disposed on the support member. The support member may have a center thermal conduit and an edge thermal conduit, and may be substantially solid between the center thermal conduit and the edge thermal conduit.