公开(公告)号：US09126797B2

公开(公告)日：2015-09-08

申请号：US14154227

申请日：2014-01-14

申请人： Atsushi Kikuchi ,  Takuya Sano ,  Takao Watanabe ,  Makoto Hidaka ,  Satoshi Saito ,  Shohichi Satoh ,  Tomomichi Hoshino ,  Kiyoshi Hata ,  Keisuke Sugiyama

发明人： Atsushi Kikuchi ,  Takuya Sano ,  Takao Watanabe ,  Makoto Hidaka ,  Satoshi Saito ,  Shohichi Satoh ,  Tomomichi Hoshino ,  Kiyoshi Hata ,  Keisuke Sugiyama

IPC分类号： B65H45/12 ,  B31F1/00 ,  B65H37/04 ,  B65H45/18 ,  B65H45/04

CPC分类号： B65H45/12 ,  B31F1/00 ,  B65H37/04 ,  B65H45/04 ,  B65H45/18 ,  B65H2301/51232 ,  B65H2701/13212 ,  B65H2801/27

摘要： The present invention is concerning to a sheet processing apparatus comprising: a pressing unit configured to provide additional folding to a fold line portion of a sheet bundle by pressing the fold line portion; a carriage unit configured to reciprocate the pressing unit in width directions of the sheet bundle; a guiding shaft configured to support the pressing unit and guides movement of the pressing unit; and a supporting unit configured to support the pressing unit and moves on a structure provided to the sheet processing apparatus.

摘要翻译： 本发明涉及一种片材处理设备，包括：按压单元，其构造成通过按压折叠线部分向片材折叠线的折叠线部分提供附加折叠; 滑架单元，其构造成使所述按压单元在所述薄片束的宽度方向上往复运动; 引导轴，其构造成支撑所述按压单元并引导所述按压单元的移动; 以及支撑单元，其构造成支撑所述按压单元并且在设置到所述片材处理设备的结构上移动。

公开(公告)号：US09061859B2

公开(公告)日：2015-06-23

申请号：US14160671

申请日：2014-01-22

申请人： Keisuke Sugiyama ,  Kiyoshi Hata ,  Atsushi Kikuchi ,  Tomomichi Hoshino ,  Makoto Hidaka ,  Shohichi Satoh ,  Satoshi Saito ,  Takao Watanabe ,  Takuya Sano

发明人： Keisuke Sugiyama ,  Kiyoshi Hata ,  Atsushi Kikuchi ,  Tomomichi Hoshino ,  Makoto Hidaka ,  Shohichi Satoh ,  Satoshi Saito ,  Takao Watanabe ,  Takuya Sano

IPC分类号： B31F1/00 ,  B65H45/04 ,  B65H45/18 ,  B65H45/16 ,  B65H37/04

CPC分类号： B65H45/04 ,  B31F1/00 ,  B31F1/0006 ,  B31F1/0012 ,  B31F1/0035 ,  B65H37/04 ,  B65H45/16 ,  B65H45/18 ,  B65H2301/51232 ,  B65H2701/13212 ,  B65H2801/27

摘要： A sheet processing apparatus includes: an abutting member that abuts against a sheet surface to bend a sheet; a first moving unit that moves the abutting member; a folding unit that performs a folding process on the sheet bent by the abutting member; a pressing unit that presses a folded portion of the sheet subjected to the folding process; a second moving unit that moves the pressing unit in a direction along a fold of the sheet; and a single operation unit that allows the first moving unit and the second moving unit to be operated.

摘要翻译： 片材处理装置包括：抵靠件，其抵靠片材表面弯曲片材; 移动所述邻接构件的第一移动单元; 折叠单元，其对由所述抵接构件弯曲的片材进行折叠处理; 按压单元，其压缩经受折叠处理的片材的折叠部分; 第二移动单元，其沿着所述片材的折叠方向移动所述按压单元; 以及允许第一移动单元和第二移动单元被操作的单个操作单元。

公开(公告)号：US20150115516A1

公开(公告)日：2015-04-30

申请号：US14508991

申请日：2014-10-07

申请人： Shohichi Satoh ,  Makoto Hidaka ,  Satoshi Saito ,  Mamoru Kambayashi ,  Tomomichi Hoshino ,  Atsushi Kikuchi ,  Kiyoshi Hata ,  Keisuke Sugiyama

发明人： Shohichi Satoh ,  Makoto Hidaka ,  Satoshi Saito ,  Mamoru Kambayashi ,  Tomomichi Hoshino ,  Atsushi Kikuchi ,  Kiyoshi Hata ,  Keisuke Sugiyama

IPC分类号： B65H37/04 ,  B65H43/00 ,  B65H45/18 ,  B65H29/70 ,  B65H37/06

CPC分类号： B31F1/0035 ,  B31F1/00 ,  B31F1/0006 ,  B65H31/34 ,  B65H45/04 ,  B65H45/12 ,  B65H45/18 ,  B65H2301/51232 ,  B65H2701/13212 ,  B65H2801/27 ,  G03G15/6541 ,  G03G2215/00877

摘要： A sheet processing apparatus comprises a pressing member configured to press a fold line portion of a folded sheet bundle; and moving unit configured to move a position of pressing by the pressing member in a direction of a fold line of the folded sheet bundle, wherein the moving unit is configured to stand by at a pressing start position in which the pressing member is in a non-pressing state, before the folded sheet bundle is conveyed to the pressing member.

摘要翻译： 片材处理设备包括：压制构件，其压制折叠的片材束的折叠部分; 以及移动单元，被构造成使所述按压构件在所述折叠的薄片束的折叠方向上移动的位置移动，其中，所述移动单元构造成在所述按压构件处于非压缩状态的按压开始位置待机， 在折叠的片材束被传送到按压构件之前。

公开(公告)号：US20130192207A1

公开(公告)日：2013-08-01

申请号：US13878054

申请日：2011-07-27

申请人： Kunihiro Chiba ,  Atsushi Kikuchi ,  Takeshi Miyamoto ,  Toshiki Sawaki ,  Masanori Watanabe ,  Hiroyuki Watanabe

发明人： Kunihiro Chiba ,  Atsushi Kikuchi ,  Takeshi Miyamoto ,  Toshiki Sawaki ,  Masanori Watanabe ,  Hiroyuki Watanabe

IPC分类号： F01N3/20

CPC分类号： F01N3/208 ,  F01N3/2066 ,  F01N2610/02 ,  F01N2610/14 ,  F01N2610/1493 ,  F01N2900/08 ,  Y02T10/24

摘要： [Problem] To provide a reducing agent supply apparatus that can quickly melt urea aqueous solution solidified in a reducing agent injection valve to allow early start of the injection control of urea aqueous solution, a method for controlling the reducing agent supply apparatus, and an exhaust gas purification apparatus.[Means for Resolution] reducing agent supply apparatus, including: a storage tank for storing liquid reducing agent; a pump for pumping the reducing agent; a reducing agent injection valve for injecting the reducing agent pumped by the pump in an exhaust pipe of an internal combustion engine; and a reducing agent passage connecting the pump to the reducing agent injection valve, wherein, when the internal combustion engine stops, a purge process of collecting the reducing agent in the reducing agent passage into the storage tank is performed, and wherein, on part of the reducing agent passage, a siphon function portion is provided for, even when, at the start of the internal combustion engine, the reducing agent injection valve is in injection failure due to solidification of the reducing agent in the reducing agent injection valve, causing some of the reducing agent to reach the reducing agent injection valve after the start of the pump to cause the solidified reducing agent to melt.

摘要翻译： 本发明提供一种还原剂供给装置，其能够快速地将在还原剂喷射阀中固化的尿素水溶液迅速地熔融，从而能够早期开始进行尿素水溶液的喷射控制，控制还原剂供给装置的方法和排气 气体净化装置。 [解决方法]还原剂供给装置，包括：储存液体还原剂的储罐; 用于泵送还原剂的泵; 用于将由泵泵送的还原剂注入内燃机的排气管的还原剂喷射阀; 以及将泵连接到还原剂喷射阀的还原剂通路，其中，当内燃机停止时，执行将还原剂通道中的还原剂收集到储罐中的净化过程，并且其中部分 还原剂通道，虹吸功能部分，即使在内燃机启动时，还原剂喷射阀由于还原剂喷射阀中的还原剂的固化而引起喷射故障，导致一些 的还原剂在泵启动后到达还原剂注入阀以使固化的还原剂熔化。

公开(公告)号：US20120141713A1

公开(公告)日：2012-06-07

申请号：US13256033

申请日：2010-04-16

申请人： Atsushi Kikuchi ,  Misa Sasai ,  Shinichiro Funaoka ,  Yukiko Takahashi

发明人： Atsushi Kikuchi ,  Misa Sasai ,  Shinichiro Funaoka ,  Yukiko Takahashi

IPC分类号： B32B1/02

CPC分类号： B32B27/08 ,  B32B27/302 ,  B32B27/306 ,  B32B27/308 ,  B32B27/32 ,  B32B27/325 ,  B32B27/34 ,  B32B27/36 ,  B32B27/365 ,  B32B2307/302 ,  B32B2307/412 ,  B32B2307/546 ,  B32B2307/72 ,  B32B2307/7242 ,  B32B2553/00 ,  Y10T428/1352 ,  Y10T428/1397

摘要： [Problems] To provide a package excellent in barrier property, transparency and appearance, and having a layer forming an island-in-the-sea structure of a small domain diameter and a high domain density without impairing the formability into containers.[Means for Solution] A package having a mixed layer of a mixture of a base resin and a functional resin composition containing inorganic fine particles, wherein the mixed layer forms an island-in-the-sea structure in which the base resin is forming a continuous phase and the functional resin composition is forming discontinuous phases, and the area percentage of the functional resin composition in cross section is 25 to 55%.

摘要翻译： [问题]提供阻隔性，透明性和外观优异的包装，并且具有形成小畴直径和高结晶域密度的海岛结构的层，而不会损害到容器的成形性。 [解决方案]具有基础树脂和含有无机细颗粒的功能性树脂组合物的混合物的混合层的包装，其中所述混合层形成岛状海岛结构，其中所述基础树脂形成 连续相和功能性树脂组合物形成不连续相，功能性树脂组合物的截面积的面积百分比为25〜55％。

公开(公告)号：US20100221912A1

公开(公告)日：2010-09-02

申请号：US12656981

申请日：2010-02-22

申请人： Tomoo Nakayama ,  Yoshiko Kasama ,  Eiichi Fujikura ,  Atsushi Kikuchi

发明人： Tomoo Nakayama ,  Yoshiko Kasama ,  Eiichi Fujikura ,  Atsushi Kikuchi

IPC分类号： H01L21/768 ,  H01L21/306

CPC分类号： H01L21/02063 ,  H01L21/28518 ,  H01L21/76814

摘要： A method of manufacturing a semiconductor device includes a process of removing, by dry etching, an insulating layer which is formed on the top surface of a Ni-containing silicide layer to thereby at least partially expose the Ni-containing silicide layer; and a process of cleaning the exposed portion of the Ni-containing silicide layer using reduced water having a reductive function.

摘要翻译： 制造半导体器件的方法包括通过干蚀刻除去形成在含Ni硅化物层的顶表面上的绝缘层从而至少部分地暴露含Ni硅化物层的工艺; 以及使用具有还原功能的还原水清洗含Ni硅化物层的暴露部分的工艺。

公开(公告)号：US20100206762A1

公开(公告)日：2010-08-19

申请号：US12594171

申请日：2008-04-02

申请人： Misa Sasai ,  Atsushi Kikuchi ,  Shinichirou Funaoka

发明人： Misa Sasai ,  Atsushi Kikuchi ,  Shinichirou Funaoka

IPC分类号： B65D85/00 ,  B29C49/08

CPC分类号： B29C49/0005 ,  B29B2911/1402 ,  B29B2911/14026 ,  B29B2911/14033 ,  B29B2911/1404 ,  B29B2911/14053 ,  B29B2911/14066 ,  B29B2911/1408 ,  B29B2911/14093 ,  B29B2911/14106 ,  B29B2911/14113 ,  B29B2911/1412 ,  B29B2911/14126 ,  B29B2911/14133 ,  B29B2911/1414 ,  B29B2911/14146 ,  B29B2911/14153 ,  B29B2911/14173 ,  B29B2911/1418 ,  B29B2911/14226 ,  B29B2911/14233 ,  B29B2911/14313 ,  B29C49/22 ,  B29K2077/00 ,  B29K2995/0026 ,  B32B27/08 ,  B32B27/20 ,  B32B27/34 ,  B32B27/36 ,  B32B2250/03 ,  B32B2250/05 ,  B32B2250/24 ,  B32B2250/40 ,  B32B2264/10 ,  B32B2307/412 ,  B32B2307/518 ,  B32B2307/704 ,  B32B2307/7244 ,  B32B2307/7246 ,  B32B2439/00 ,  C08L77/06

摘要： A multilayer polyester container comprising inner and outer layers of a polyester resin and at least one intermediate layer of a polyamide resin, wherein in the container body portion, the intermediate layer of the polyamide resin has an exothermic peak starting temperature due to crystallization of not lower than 96° C. as measured by a differential scanning calorimetry, and a clay is dispersed in the polyamide resin, effectively preventing whitening of the intermediate layer even after the passage of time and featuring excellent transparency despite of using, as an intermediate layer, a polyamide resin composition obtained by blending the polyamide resin with the clay.

摘要翻译： 一种多层聚酯容器，其包含聚酯树脂的内层和外层以及聚酰胺树脂的至少一层中间层，其中，在容器主体部分中，聚酰胺树脂的中间层由于不结晶而具有放热峰值起始温度 通过差示扫描量热法测定的粘度高于96℃，并且粘土分散在聚酰胺树脂中，即使经过时也有效地防止中间层的白化，并且具有优异的透明性，尽管使用作为中间层， 通过将聚酰胺树脂与粘土共混而获得的聚酰胺树脂组合物。

公开(公告)号：US07754534B2

公开(公告)日：2010-07-13

申请号：US12081723

申请日：2008-04-21

申请人： Nobukatsu Saito ,  Masaharu Minamizawa ,  Yoshiyuki Yoneda ,  Nobutaka Shimizu ,  Kazuyuki Imamura ,  Atsushi Kikuchi ,  Tadahiro Okamoto ,  Eiji Watanabe

发明人： Nobukatsu Saito ,  Masaharu Minamizawa ,  Yoshiyuki Yoneda ,  Nobutaka Shimizu ,  Kazuyuki Imamura ,  Atsushi Kikuchi ,  Tadahiro Okamoto ,  Eiji Watanabe

IPC分类号： H01L21/00

CPC分类号： H01L21/6836 ,  H01L21/4857 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/49822 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68331 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68363 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05023 ,  H01L2224/05024 ,  H01L2224/05571 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/75315 ,  H01L2224/75755 ,  H01L2224/7598 ,  H01L2224/81005 ,  H01L2224/83005 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method of manufacturing a semiconductor device using a wiring substrate is provided which can facilitate the handling of the wiring substrate. The method includes the steps of forming a peelable resin layer on a silicon substrate, forming the wiring substrate on the peelable resin layer, mounting semiconductor chips on the wiring substrate, forming semiconductor devices by sealing the plurality of semiconductor chips by a sealing resin, individualizing the semiconductor devices by dicing the semiconductor devices from the sealing resin side but leaving the silicon substrate, peeling each of the individualized semiconductor devices from the silicon substrate between the silicon substrate and the peelable resin layer, and exposing terminals on the wiring substrate by forming openings through the peelable resin layer or by removing the peelable resin layer.

摘要翻译： 提供一种使用布线基板制造半导体器件的方法，其可以有助于布线基板的处理。 该方法包括以下步骤：在硅基板上形成可剥离树脂层，在可剥离树脂层上形成布线基板，在布线基板上安装半导体芯片，通过密封树脂密封多个半导体芯片形成半导体器件， 半导体器件通过从密封树脂侧切割半导体器件但离开硅衬底，从硅衬底和可剥离树脂层之间的硅衬底剥离每个单独的半导体器件，并且通过形成开口 通过可剥离树脂层或通过除去可剥离树脂层。

公开(公告)号：US20100116707A1

公开(公告)日：2010-05-13

申请号：US12594072

申请日：2008-04-02

申请人： Misa Sasai ,  Atsushi Kikuchi ,  Shinichirou Funaoka

发明人： Misa Sasai ,  Atsushi Kikuchi ,  Shinichirou Funaoka

IPC分类号： B65D90/02 ,  B29C49/08

CPC分类号： B65D1/0215 ,  B29B2911/1402 ,  B29B2911/14026 ,  B29B2911/14033 ,  B29B2911/1404 ,  B29B2911/14053 ,  B29B2911/14066 ,  B29B2911/1408 ,  B29B2911/14093 ,  B29B2911/14106 ,  B29B2911/14113 ,  B29B2911/1412 ,  B29B2911/14126 ,  B29B2911/14133 ,  B29B2911/1414 ,  B29B2911/14146 ,  B29B2911/14153 ,  B29B2911/14173 ,  B29B2911/1418 ,  B29B2911/14226 ,  B29B2911/14233 ,  B29B2911/14313 ,  B29C49/0005 ,  B29C49/22 ,  B29K2995/0026 ,  B32B27/08 ,  B32B27/20 ,  B32B27/306 ,  B32B27/34 ,  B32B27/36 ,  B32B2250/03 ,  B32B2250/05 ,  B32B2250/24 ,  B32B2250/40 ,  B32B2264/10 ,  B32B2307/412 ,  B32B2307/518 ,  B32B2307/704 ,  B32B2307/7244 ,  B32B2307/7246 ,  B32B2439/00 ,  B32B2439/60 ,  C08J5/00

摘要： A pressure-resistant polyester container having a multilayer structure comprising inner and outer layers of a polyester resin and at least one intermediate layer of a functional resin, wherein in the container body portion, the inner layer of the polyester resin has a crystallinity of not less than 23%, the outer layer thereof has a crystallinity of not less than 18%, the average value of the crystallinity of the inner layer and the crystallinity of the outer layer is not less than 24%. The pressure-resistant polyester container effectively prevents whitening even after the passage of time and features excellent transparency despite of using, as an intermediate layer, a functional resin composition obtained by blending a functional resin with a clay. The invention, further, provides a process for producing the same.

摘要翻译： 一种耐压聚酯容器，其具有包含聚酯树脂的内层和外层以及功能性树脂的至少一个中间层的多层结构，其中在所述容器主体部分中，所述聚酯树脂的内层的结晶度不低于 超过23％，其外层的结晶度不低于18％，内层的结晶度的平均值和外层的结晶度不低于24％。 耐压性聚酯容器即使经过时也能有效地防止发白，并且具有优异的透明性，尽管使用通过将功能性树脂与粘土共混而获得的功能性树脂组合物作为中间层。 本发明还提供了一种制备该方法的方法。

公开(公告)号：US20090061132A1

公开(公告)日：2009-03-05

申请号：US11912417

申请日：2006-04-21

申请人： Toshiki Yamada ,  Atsushi Kikuchi

发明人： Toshiki Yamada ,  Atsushi Kikuchi

IPC分类号： B32B1/00 ,  B29C49/00

CPC分类号： B65D1/0207 ,  B29B11/14 ,  B29B2911/1402 ,  B29B2911/14026 ,  B29B2911/14033 ,  B29B2911/1404 ,  B29B2911/14053 ,  B29B2911/14066 ,  B29B2911/1408 ,  B29B2911/14093 ,  B29B2911/14106 ,  B29B2911/14113 ,  B29B2911/1412 ,  B29B2911/14133 ,  B29B2911/1414 ,  B29B2911/14146 ,  B29B2911/14666 ,  B29B2911/1498 ,  B29C49/0005 ,  B29C49/08 ,  B29C49/12 ,  B29C2035/046 ,  B29C2035/0811 ,  B29C2035/0822 ,  B29K2067/00 ,  B29L2031/7158 ,  C08K3/34 ,  C08L67/02 ,  C08L2205/02 ,  Y10T428/1352 ,  C08L2666/18

摘要： A stretch-formed container having a layer comprising a blend of an ethylene terephthalate type polyester resin and another material, characterized in that the layer comprising the blend has a dispersion structure composed of a continuous phase comprising the ethylene terephthalate type polyester resin and a dispersed phase comprising the other material and that at least the container body part has a tan δ maximum temperature of 115° C. or lower in a dynamic viscoelasticity examination. Due to the constitution, even when the mechanical stretching rate reaches a limit, strain hardening effectively occurs. Thus, a stretch-formed container of a polyester resin can be provided which has both of excellent heat resistance attributable to high-temperature stretching and a stretch balance attributable to strain hardening.

摘要翻译： 一种拉伸成型的容器，其具有包含对苯二甲酸乙二醇酯型聚酯树脂和另一种材料的共混物的层，其特征在于，包含共混物的层具有由包含对苯二甲酸乙二醇酯类聚酯树脂的连续相和分散相 包括其他材料，并且在动态粘弹性检查中，至少容器主体部分的tanδ最大温度为115℃以下。 由于该结构，即使机械拉伸速度达到极限，也可以有效地发生应变硬化。 因此，可以提供一种聚酯树脂的拉伸成形容器，其具有归因于高温拉伸的优异耐热性和由应变硬化引起的拉伸平衡。