公开(公告)号：US08466542B2

公开(公告)日：2013-06-18

申请号：US12723039

申请日：2010-03-12

申请人： Moshe Kriman ,  Osher Avsian ,  Belgacem Haba ,  Giles Humpston ,  Dmitri Burshtyn

发明人： Moshe Kriman ,  Osher Avsian ,  Belgacem Haba ,  Giles Humpston ,  Dmitri Burshtyn

IPC分类号： H01L23/48 ,  H01L23/02 ,  H01L29/40

CPC分类号： H01L25/0657 ,  H01L21/76805 ,  H01L23/481 ,  H01L25/50 ,  H01L2224/02371 ,  H01L2224/0401 ,  H01L2224/13024 ,  H01L2224/24145 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2924/1461 ,  H01L2924/00

摘要： A stacked microelectronic assembly is provided which includes first and second stacked microelectronic elements. Each of the first and second microelectronic elements can include a conductive layer extending along a face of such microelectronic element. At least one of the first and second microelectronic elements can include a recess extending from the rear surface towards the front surface, and a conductive via extending from the recess through the bond pad and electrically connected to the bond pad, with a conductive layer connected to the via and extending along a rear face of the microelectronic element towards an edge of the microelectronic element. A plurality of leads can extend from the conductive layers of the first and second microelectronic elements and a plurality of terminals of the assembly can be electrically connected with the leads.

摘要翻译： 提供堆叠的微电子组件，其包括第一和第二堆叠的微电子元件。 第一和第二微电子元件中的每一个可以包括沿着这种微电子元件的表面延伸的导电层。 第一和第二微电子元件中的至少一个可以包括从后表面朝向前表面延伸的凹部，以及从凹槽穿过接合焊盘延伸并电连接到接合焊盘的导电通孔，导电层连接到 所述通孔沿着所述微电子元件的后表面朝向所述微电子元件的边缘延伸。 多个引线可以从第一和第二微电子元件的导电层延伸，并且组件的多个端子可以与引线电连接。

公开(公告)号：US08241959B2

公开(公告)日：2012-08-14

申请号：US12829709

申请日：2010-07-02

申请人： Belgacem Haba ,  Giles Humpston

发明人： Belgacem Haba ,  Giles Humpston

IPC分类号： H01L21/00

CPC分类号： H01L23/525 ,  H01L23/3114 ,  H01L24/11 ,  H01L24/13 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/0603 ,  H01L2224/11 ,  H01L2224/114 ,  H01L2224/1147 ,  H01L2224/116 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/1403 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/484 ,  H01L2224/73215 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15787 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/85399

摘要： A method of making microelectronic packages includes making a subassembly by providing a plate having a top surface, a bottom surface and openings extending between the top and bottom surfaces, attaching a compliant layer to the top surface of the plate, the compliant layer having openings that are aligned with the openings extending through the plate, and providing electrically conductive features on the compliant layer. After making the subassembly, the bottom surface of the plate is attached with the top surface of a semiconductor wafer so that the openings extending through the plate are aligned with contacts on the wafer. At least some of the electrically conductive features on the compliant layer are electrically interconnected with the contacts on the semiconductor wafer.

摘要翻译： 制造微电子封装的方法包括通过提供具有顶表面，底表面和在顶表面和底表面之间延伸的开口的板来制造子组件，将柔性层附接到板的顶表面，顺应层具有开口， 与延伸穿过板的开口对齐，并且在柔性层上提供导电特征。 在制造子组件之后，板的底表面与半导体晶片的顶表面相连，使得延伸穿过该板的开口与晶片上的触点对准。 柔性层上的至少一些导电特征与半导体晶片上的触点电互连。

公开(公告)号：US08193615B2

公开(公告)日：2012-06-05

申请号：US12221204

申请日：2008-07-31

申请人： Belgacem Haba ,  Giles Humpston ,  Moti Margalit

发明人： Belgacem Haba ,  Giles Humpston ,  Moti Margalit

IPC分类号： H01L23/485

CPC分类号： H01L21/76898 ,  H01L21/76805 ,  H01L23/3114 ,  H01L23/481 ,  H01L24/12 ,  H01L24/24 ,  H01L24/82 ,  H01L24/95 ,  H01L24/96 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/13024 ,  H01L2224/13025 ,  H01L2224/2518 ,  H01L2224/82039 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/00

摘要： A microelectronic unit 400 can include a semiconductor element 401 having a front surface, a microelectronic semiconductor device adjacent to the front surface, contacts 403 at the front surface and a rear surface remote from the front surface. The semiconductor element 401 can have through holes 410 extending from the rear surface through the semiconductor element 401 and through the contacts 403. A dielectric layer 411 can line the through holes 410. A conductive layer 412 may overlie the dielectric layer 411 within the through holes 410. The conductive layer 412 can conductively interconnect the contacts 403 with unit contacts.

摘要翻译： 微电子单元400可以包括具有前表面的半导体元件401，与前表面相邻的微电子半导体器件，在前表面处的触点403和远离前表面的后表面。 半导体元件401可以具有从后表面延伸通过半导体元件401并通过触点403的通孔410.电介质层411可以使通孔410线化。导电层412可覆盖通孔内的电介质层411 导电层412可以将触点403与单元触点导电地互连。

公开(公告)号：US20100230795A1

公开(公告)日：2010-09-16

申请号：US12723039

申请日：2010-03-12

申请人： Moshe Kriman ,  Osher Avsian ,  Belgacem Haba ,  Giles Humpston ,  Dmitri Burshtyn

发明人： Moshe Kriman ,  Osher Avsian ,  Belgacem Haba ,  Giles Humpston ,  Dmitri Burshtyn

IPC分类号： H01L25/065 ,  H01L21/77 ,  H01L23/538

CPC分类号： H01L25/0657 ,  H01L21/76805 ,  H01L23/481 ,  H01L25/50 ,  H01L2224/02371 ,  H01L2224/0401 ,  H01L2224/13024 ,  H01L2224/24145 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2924/1461 ,  H01L2924/00

摘要： A stacked microelectronic assembly is provided which includes first and second stacked microelectronic elements. Each of the first and second microelectronic elements can include a conductive layer extending along a face of such microelectronic element. At least one of the first and second microelectronic elements can include a recess extending from the rear surface towards the front surface, and a conductive via extending from the recess through the bond pad and electrically connected to the bond pad, with a conductive layer connected to the via and extending along a rear face of the microelectronic element towards an edge of the microelectronic element. A plurality of leads can extend from the conductive layers of the first and second microelectronic elements and a plurality of terminals of the assembly can be electrically connected with the leads.

摘要翻译： 提供堆叠的微电子组件，其包括第一和第二堆叠的微电子元件。 第一和第二微电子元件中的每一个可以包括沿着这种微电子元件的表面延伸的导电层。 第一和第二微电子元件中的至少一个可以包括从后表面朝向前表面延伸的凹部，以及从凹槽穿过接合焊盘延伸并电连接到接合焊盘的导电通孔，导电层连接到 所述通孔沿着所述微电子元件的后表面朝向所述微电子元件的边缘延伸。 多个引线可以从第一和第二微电子元件的导电层延伸，并且组件的多个端子可以与引线电连接。

公开(公告)号：US07593636B2

公开(公告)日：2009-09-22

申请号：US12004149

申请日：2007-12-20

申请人： Michael J. Nystrom ,  David B. Tuckerman ,  Belgacem Haba ,  Giles Humpston ,  Jesse Burl Thompson

发明人： Michael J. Nystrom ,  David B. Tuckerman ,  Belgacem Haba ,  Giles Humpston ,  Jesse Burl Thompson

IPC分类号： G03B17/00

CPC分类号： H01L27/14636 ,  H01L27/14618 ,  H01L27/14683 ,  H01L31/0203 ,  H01L31/0232 ,  H01L2224/48091 ,  H01L2224/73265 ,  H04N5/2253 ,  H04N5/2257 ,  H01L2924/00014

摘要： The present invention relates to a camera module. The camera module includes a circuit panel having a top side, a bottom side and transparent region, the circuit panel having conductors. The module further includes sensor unit disposed on the bottom side of the circuit panel, and the sensor unit includes a semiconductor chip having a front surface including an imaging area facing in a forward direction in alignment with the transparent region and an imaging circuit adapted to generate signals representative of an optical image impinging on the imaging area. The module further includes posts protruding from the bottom side of the circuit panel, wherein at least some of the posts being engagement posts having bottom surfaces, and at least some of the bottom surfaces abutting an engagement surface of the sensor unit.

摘要翻译： 本发明涉及摄像机模块。 相机模块包括具有顶侧，底侧和透明区域的电路板，电路板具有导体。 该模块还包括设置在电路板的底侧上的传感器单元，并且传感器单元包括半导体芯片，该半导体芯片具有前表面，该前表面包括与透明区域对准的向前方向的成像区域和适于 产生表示入射到成像区域上的光学图像的信号。 模块还包括从电路板的底侧突出的柱，其中至少一些柱是具有底表面的接合柱，并且至少一些底表面邻接传感器单元的接合表面。

公开(公告)号：US07521276B2

公开(公告)日：2009-04-21

申请号：US11642616

申请日：2006-12-20

申请人： Michael J. Nystrom ,  Belgacem Haba ,  Giles Humpston

发明人： Michael J. Nystrom ,  Belgacem Haba ,  Giles Humpston

IPC分类号： H01L21/00 ,  H01L21/44 ,  H01L21/4763 ,  H01L23/495 ,  H01L23/14 ,  H01L23/48 ,  H01L23/29

CPC分类号： H01L23/3114 ,  H01L23/525 ,  H01L24/10 ,  H01L24/13 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/00

摘要： A method of making chip assemblies includes providing an in-process assembly including a semiconductor wafer, a wafer compliant structure overlying a front surface of the wafer and cavities, and terminals carried on the compliant structure adjacent the cavities and electrically connected to the wafer, the cavities being substantially sealed. The method includes subdividing the in-process assembly to form individual chip assemblies, each including one or more chip regions of the wafer, a portion of the compliant structure and the terminals carried on the portion, and opening vents communicating with said cavities after said providing step.

摘要翻译： 一种制造芯片组件的方法包括提供包括半导体晶片，覆盖晶片前表面的晶片兼容结构和空腔的过程中组件以及与该空腔相邻并且电连接到晶片的柔性结构承载的端子， 空腔基本上被密封。 该方法包括将进程中的组件细分以形成各自的芯片组件，每个芯片组件包括晶片的一个或多个芯片区域，柔性结构的一部分和承载在该部分上的端子，以及在提供之后与所述空腔连通的开口 步。

公开(公告)号：US20080090333A1

公开(公告)日：2008-04-17

申请号：US11582186

申请日：2006-10-17

申请人： Belgacem Haba ,  Giles Humpston

发明人： Belgacem Haba ,  Giles Humpston

IPC分类号： H01L21/00

CPC分类号： H01L23/525 ,  H01L23/3114 ,  H01L24/11 ,  H01L24/13 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/0603 ,  H01L2224/11 ,  H01L2224/114 ,  H01L2224/1147 ,  H01L2224/116 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/1403 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/484 ,  H01L2224/73215 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15787 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/85399

摘要： A method of making microelectronic packages includes making a subassembly by providing a plate having a top surface, a bottom surface and openings extending between the top and bottom surfaces, attaching a compliant layer to the top surface of the plate, the compliant layer having openings that are aligned with the openings extending through the plate, and providing electrically conductive features on the compliant layer. After making the subassembly, the bottom surface of the plate is attached with the top surface of a semiconductor wafer so that the openings extending through the plate are aligned with contacts on the wafer. At least some of the electrically conductive features on the compliant layer are electrically interconnected with the contacts on the semiconductor wafer.

摘要翻译： 制造微电子封装的方法包括通过提供具有顶表面，底表面和在顶表面和底表面之间延伸的开口的板来制造子组件，将柔性层附接到板的顶表面，顺应层具有开口， 与延伸穿过板的开口对齐，并且在柔性层上提供导电特征。 在制造子组件之后，板的底表面与半导体晶片的顶表面相连，使得延伸穿过该板的开口与晶片上的触点对准。 柔性层上的至少一些导电特征与半导体晶片上的触点电互连。

公开(公告)号：US20070267730A1

公开(公告)日：2007-11-22

申请号：US11435345

申请日：2006-05-16

申请人： Victor Liew ,  Giles Humpston ,  Belgacem Haba

发明人： Victor Liew ,  Giles Humpston ,  Belgacem Haba

IPC分类号： H01L23/02

CPC分类号： H01L24/13 ,  H01L24/11 ,  H01L2224/0231 ,  H01L2224/02333 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05171 ,  H01L2224/05644 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/1319 ,  H01L2224/16 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/00014

摘要： A wafer having a front surface and contacts exposed at the front surface is treated by forming electrically conductive risers projecting upwardly from the contacts as, for example, by electroless plating, and then applying a flowable material over the front surface of the device, around the risers, to form a dielectric layer with the risers exposed at a top surface of the dielectric layer facing away from the device. Traces extending over the top surface of the dielectric layer may be formed, and may be connected to at least some of the risers.

摘要翻译： 具有前表面和暴露在前表面的触点的晶片通过形成从接触件向上突出的导电立管来进行处理，例如通过无电镀，然后将可流动材料施加在器件的前表面周围 提升器，以形成电介质层，其中提升板在电介质层的顶表面处暴露于远离设备的顶表面。 可以形成在电介质层的顶表面上延伸的迹线，并且可以连接至至少一些上升管。

公开(公告)号：US07759166B2

公开(公告)日：2010-07-20

申请号：US11582186

申请日：2006-10-17

申请人： Belgacem Haba ,  Giles Humpston

发明人： Belgacem Haba ,  Giles Humpston

IPC分类号： H01L21/00

CPC分类号： H01L23/525 ,  H01L23/3114 ,  H01L24/11 ,  H01L24/13 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/0603 ,  H01L2224/11 ,  H01L2224/114 ,  H01L2224/1147 ,  H01L2224/116 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/1403 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/484 ,  H01L2224/73215 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15787 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/85399

摘要： A method of making microelectronic packages includes making a subassembly by providing a plate having a top surface, a bottom surface and openings extending between the top and bottom surfaces, attaching a compliant layer to the top surface of the plate, the compliant layer having openings that are aligned with the openings extending through the plate, and providing electrically conductive features on the compliant layer. After making the subassembly, the bottom surface of the plate is attached with the top surface of a semiconductor wafer so that the openings extending through the plate are aligned with contacts on the wafer. At least some of the electrically conductive features on the compliant layer are electrically interconnected with the contacts on the semiconductor wafer.

摘要翻译： 制造微电子封装的方法包括通过提供具有顶表面，底表面和在顶表面和底表面之间延伸的开口的板来制造子组件，将柔性层附接到板的顶表面，顺应层具有开口， 与延伸穿过板的开口对齐，并且在柔性层上提供导电特征。 在制造子组件之后，板的底表面与半导体晶片的顶表面相连，使得延伸穿过该板的开口与晶片上的触点对准。 柔性层上的至少一些导电特征与半导体晶片上的触点电互连。

公开(公告)号：US07453139B2

公开(公告)日：2008-11-18

申请号：US11318815

申请日：2005-12-27

申请人： Michael J. Nystrom ,  Belgacem Haba ,  Giles Humpston

发明人： Michael J. Nystrom ,  Belgacem Haba ,  Giles Humpston

IPC分类号： H01L21/44 ,  H01L23/495

CPC分类号： H01L23/3114 ,  H01L23/525 ,  H01L24/10 ,  H01L24/13 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/00

摘要： A compliant structure is provided on a semiconductor wafer. The compliant structure includes cavities. The compliant structure and the wafer seal the cavities during process steps used to form conductive elements on the compliant structure. After processing, vents are opened to connect the cavities to the exterior of the assembly. The vents may be formed by severing the wafer and compliant structure to form individual units, so that the severance planes intersect channels or other voids communicating with the cavities. Alternatively, the vents may be formed by forming holes in the compliant structure, or by opening bores extending through the wafer.

摘要翻译： 在半导体晶片上提供柔性结构。 顺应结构包括腔。 顺应结构和晶片在用于在柔性结构上形成导电元件的工艺步骤期间密封空腔。 处理后，通风口打开，将空腔连接到组件的外部。 通孔可以通过切断晶片和柔顺结构以形成单独的单元而形成，使得分离平面与通道或与空腔连通的其它空隙相交。 或者，可以通过在柔性结构中形成孔或通过打开延伸穿过晶片的孔而形成通气口。