公开(公告)号：US20120138091A1

公开(公告)日：2012-06-07

申请号：US12960378

申请日：2010-12-03

申请人： Jason Rye ,  Kyle M. Hanson

发明人： Jason Rye ,  Kyle M. Hanson

IPC分类号： B08B3/04

CPC分类号： H01L21/67051 ,  H01L21/6719 ,  H01L21/68792

摘要： A processing assembly for a semiconductor workpiece generally includes a rotor assembly capable of spinning a workpiece, a chemistry delivery assembly for delivering chemistry to the workpiece, and a chemistry collection assembly for collecting spent chemistry from the workpiece. The chemistry collection assembly may include a weir that is configured to spin with the rotor assembly. A method of processing a semiconductor workpiece is also provided.

摘要翻译： 用于半导体工件的处理组件通常包括能够旋转工件的转子组件，用于将化学物质输送到工件的化学物质输送组件以及用于从工件收集废化学物质的化学收集组件。 化学收集组件可以包括构造成与转子组件一起旋转的堰。 还提供了一种处理半导体工件的方法。

公开(公告)号：US07938942B2

公开(公告)日：2011-05-10

申请号：US11678931

申请日：2007-02-26

申请人： Jason A. Rye ,  Kyle M. Hanson

发明人： Jason A. Rye ,  Kyle M. Hanson

IPC分类号： C25B9/02 ,  C25B9/12

CPC分类号： H01L21/6719 ,  C25D17/001 ,  C25D17/06 ,  H01L21/67051 ,  H01L21/67748 ,  H01L21/67751

摘要： A centrifugal workpiece processor for processing semiconductor wafers and similar workpieces includes a head which holds and spins the workpiece. The head includes a rotor having a gas system. Gas is sprayed or jetted from inlets in the rotor to create a rotational gas flow. The rotational gas flow causes pressure conditions which hold the edges of a first side of the workpiece against contact pins or surfaces on the rotor. The rotor and the workpiece rotate together. Guide pins adjacent to a perimeter may help to align the workpiece with the rotor. An angled surface helps to deflect spent process liquid away from the workpiece. The head is moveable into multiple different engagement positions with a bowl. Spray nozzles in the bowl spray a process liquid onto the second side of the workpiece, as the workpiece is spinning, to process the workpiece. A moving end point detector may be used to detect an end point of processing.

摘要翻译： 用于处理半导体晶片和类似工件的离心工件处理器包括保持和旋转工件的头部。 头包括具有气体系统的转子。 气体从转子中的入口喷射或喷射以产生旋转气流。 旋转气流导致压力条件，其保持工件的第一面的边缘抵靠转子上的接触销或表面。 转子和工件一起旋转。 与周边相邻的导销可能有助于将工件与转子对准。 有角度的表面有助于将废工艺液体偏离工件。 头部可以与碗一起移动到多个不同的接合位置。 当工件旋转时，碗中的喷嘴将工艺液体喷射到工件的第二面上，以处理工件。 可以使用移动端点检测器来检测处理的终点。

公开(公告)号：US07628898B2

公开(公告)日：2009-12-08

申请号：US11198905

申请日：2005-08-05

申请人： John Klocke ,  Kyle M. Hanson ,  Rajesh Baskaran

发明人： John Klocke ,  Kyle M. Hanson ,  Rajesh Baskaran

IPC分类号： C25D17/02 ,  C25D21/00 ,  C25D7/12

CPC分类号： C23C18/1632 ,  C25D7/123 ,  C25D17/001 ,  C25D17/002 ,  C25D21/12 ,  C25F7/00

摘要： Methods and systems for electrochemically processing microfeature workpieces are described herein. In one embodiment, a process for electrochemically treating a surface of a plurality of microfeature workpieces in an electrochemical treating chamber that includes a processing unit separated from an electrode unit by an ion-permeable barrier is described. The process involves an idle stage wherein during the idle stage, processing fluid components are prevented from transferring between the first processing fluid and the second processing fluid. The described system includes a flow control system for controlling the flow of processing fluid to achieve separation of a processing fluid from the barrier during the idle stage.

摘要翻译： 本文描述了用于电化学处理微特征工件的方法和系统。 在一个实施例中，描述了一种用于电化学处理电化学处理室中的多个微特征工件的表面的方法，其包括通过离子可渗透屏障与电极单元分离的处理单元。 该过程包括空闲阶段，其中在空闲阶段期间，防止处理流体组分在第一处理流体和第二处理流体之间传递。 所描述的系统包括流量控制系统，用于控制处理流体的流动，以在空转阶段期间实现处理流体与屏障的分离。

公开(公告)号：US07438788B2

公开(公告)日：2008-10-21

申请号：US11096477

申请日：2005-03-29

申请人： Kyle M. Hanson ,  Thomas L. Ritzdorf ,  Gregory J. Wilson ,  Paul R. McHugh

发明人： Kyle M. Hanson ,  Thomas L. Ritzdorf ,  Gregory J. Wilson ,  Paul R. McHugh

IPC分类号： C25D17/02 ,  C25D7/12

CPC分类号： C25D17/001 ,  C25D5/18 ,  C25D7/123 ,  C25D17/10

摘要： An apparatus and method for electrochemical processing of microelectronic workpieces in a reaction vessel. In one embodiment, the reaction vessel includes: an outer container having an outer wall; a distributor coupled to the outer container, the distributor having a first outlet configured to introduce a primary flow into the outer container and at least one second outlet configured to introduce a secondary flow into the outer container separate from the primary flow; a primary flow guide in the outer container coupled to the distributor to receive the primary flow from the first outlet and direct it to a workpiece processing site; a dielectric field shaping unit in the outer container coupled to the distributor to receive the secondary flow from the second outlet, the field shaping unit being configured to contain the secondary flow separate from the primary flow through at least a portion of the outer container, and the field shaping unit having at least one electrode compartment through which the secondary flow can pass while the secondary flow is separate from the primary flow; an electrode in the electrode compartment; and an interface member carried by the field shaping unit downstream from the electrode, the interface member being in fluid communication with the secondary flow in the electrode compartment, and the interface member being configured to prevent selected matter of the secondary flow from passing to the primary flow.

摘要翻译： 用于反应容器中微电子工件的电化学处理的装置和方法。 在一个实施例中，反应容器包括：具有外壁的外容器; 分配器，其耦合到所述外部容器，所述分配器具有构造成将主流引入所述外部容器中的第一出口和构造成将二次流引导到与所述主流分离的所述外部容器中的至少一个第二出口; 外部容器中的主要流动引导件联接到分配器以接收来自第一出口的主流并将其引导到工件加工位置; 所述外容器中的电介质场成形单元联接到所述分配器以接收来自所述第二出口的二次流，所述场整形单元构造成容纳所述次流与所述主流分离通过所述外容器的至少一部分，以及 所述场成形单元具有至少一个电极室，所述二次流可以通过所述至少一个电极室，而所述二次流与所述主流分离; 电极室中的电极; 以及由所述场成形单元承载在所述电极的下游的界面构件，所述界面构件与所述电极室中的所述次流体流体连通，并且所述界面构件被构造成防止所述二次流的选定物质通过所述主流 流。

公开(公告)号：US07267749B2

公开(公告)日：2007-09-11

申请号：US10400186

申请日：2003-03-26

申请人： Gregory J. Wilson ,  Paul R. McHugh ,  Kyle M. Hanson

发明人： Gregory J. Wilson ,  Paul R. McHugh ,  Kyle M. Hanson

IPC分类号： C25D5/08 ,  C25D17/06 ,  C25B9/12 ,  C25D3/38

CPC分类号： C25D17/02 ,  C25D5/08 ,  C25D17/001 ,  Y10S204/07

摘要： A processing container (610) for providing a flow of a processing fluid during immersion processing of at least one surface of a microelectronic workpiece is set forth. The processing container comprises a principal fluid flow chamber (505) providing a flow of processing fluid to at least one surface of the workpiece and a plurality of nozzles (535) disposed to provide a flow of processing fluid to the principal fluid flow chamber. The plurality of nozzles are arranged and directed to provide vertical and radial fluid flow components that combine to generate a substantially uniform normal flow component radially across the surface of the workpiece. An exemplary apparatus using such a processing container is also set forth that is particularly adapted to carry out an electroplating process. In accordance with a further aspect of the present disclosure, an improved fluid removal path (640) is provided for removing fluid from a principal fluid flow chamber during immersion processing of a microelectronic workpiece.

摘要翻译： 阐述了用于在微电子工件的至少一个表面的浸入处理期间提供处理流体流的处理容器（610）。 处理容器包括主流体流动室（505），其向工件的至少一个表面提供处理流体流，以及设置成向主流体流动室提供处理流体流的多个喷嘴（535）。 多个喷嘴被布置和引导以提供垂直和径向的流体流动分量，其组合以在工件的表面上径向产生基本上均匀的正常流动分量。 还提出了使用这种处理容器的示例性装置，其特别适用于进行电镀工艺。 根据本公开的另一方面，提供改进的流体移除路径（640），用于在微电子工件的浸没处理期间从主流体流动室中移除流体。

公开(公告)号：US07217325B2

公开(公告)日：2007-05-15

申请号：US10867458

申请日：2004-06-14

申请人： Kyle M. Hanson

发明人： Kyle M. Hanson

IPC分类号： B05C11/02

CPC分类号： H01L21/6715 ,  H01L21/32134 ,  H01L21/67017 ,  H01L21/67028 ,  H01L21/67173 ,  H01L21/6719 ,  H01L21/68785

摘要： A system for processing a workpiece includes a process head assembly and a base assembly. The process head assembly has a process head and an upper rotor. The base assembly has a base and a lower rotor. The base and lower rotor have magnets wherein the upper rotor is engageable with the lower rotor via a magnetic force created by the magnets. The engaged upper and lower rotors form a process chamber where a semiconductor wafer is positioned for processing. Process fluids for treating the workpiece are introduced into the process chamber, optionally while the processing head spins the workpiece. Additionally, air flow around and through the process chamber is managed to reduce particle adders on the workpiece.

公开(公告)号：US06930046B2

公开(公告)日：2005-08-16

申请号：US10690864

申请日：2003-10-21

申请人： Kyle M. Hanson ,  Eric Lund ,  Coby Grove ,  Steven L. Peace ,  Paul Z. Wirth ,  Scott A. Bruner ,  Jonathan Kuntz

发明人： Kyle M. Hanson ,  Eric Lund ,  Coby Grove ,  Steven L. Peace ,  Paul Z. Wirth ,  Scott A. Bruner ,  Jonathan Kuntz

IPC分类号： H01L21/00 ,  H01L21/3213 ,  H01L21/311

CPC分类号： H01L21/6715 ,  H01L21/32134 ,  H01L21/67017 ,  Y10S438/906 ,  Y10S438/907 ,  Y10S438/913

摘要： A system and method for processing a workpiece, includes workpiece processors. A robot is moveable within an enclosure to load and unload workpieces into and out of the processors. A processor includes an upper rotor having a central air flow opening. The upper rotor is magnetically driven into engagement with a lower rotor to form a workpiece processing chamber. A moveable drain mechanism aligns different drain paths with the processing chamber so that different processing fluids may be removed from the processing chamber via different drain paths. A moveable nozzle positioned in the air flow opening distributes processing fluid to the workpiece. The processing fluid is distributed across the workpiece surface, via centrifugal force generated by spinning the processing chamber, and removed from the processing chamber via the moveable drain mechanism.

摘要翻译： 用于处理工件的系统和方法包括工件处理器。 机器人可以在机箱内移动，以将工件加载和卸载进出处理器。 处理器包括具有中心气流开口的上转子。 上转子被磁力驱动与下转子接合以形成工件处理室。 可移动排水机构使不同的排放路径与处理室对准，使得不同的处理流体可以经由不同的排出路径从处理室移除。 位于空气流通口中的可移动喷嘴将处理流体分配到工件。 处理液通过旋转处理室产生的离心力分布在工件表面上，并通过可移动的排水机构从处理室中移出。

公开(公告)号：US06251692B1

公开(公告)日：2001-06-26

申请号：US09388140

申请日：1999-09-01

申请人： Kyle M. Hanson

发明人： Kyle M. Hanson

IPC分类号： H01L2100

CPC分类号： H01L21/67259 ,  H01L21/681

摘要： A semiconductor processing workpiece support which includes a detection subsystem that detects whether a wafer or other workpiece is present. The preferred arrangement uses an optical beam emitter and an optical beam detector mounted along the back side of a rotor which acts as a workpiece holder. The emitted beam passes through the workpiece holder and is reflected by any workpiece present in the Workpiece holder. The preferred units include both an optical emitter and pair of detectors. The detection is preferably able to discriminate on the basis of the angle of the reflected beam, so that a portion of the beam reflected by the workpiece holder is not considered or minimized.

摘要翻译： 一种半导体加工工件支撑件，其包括检测子晶体，其检测晶片或其它工件是否存在。 优选的布置使用光束发射器和沿着作为工件保持器的转子的后侧安装的光束检测器。 发射的光束通过工件夹持器，并被工件夹具中存在的任何工件反射。 优选的单元包括光发射器和一对检测器。 该检测优选地能够基于反射光束的角度进行鉴别，使得不考虑或最小化由工件保持器反射的光束的一部分。

公开(公告)号：US20120292181A1

公开(公告)日：2012-11-22

申请号：US13110728

申请日：2011-05-18

申请人： Paul R. McHugh ,  Gregory J. Wilson ,  Kyle M. Hanson

发明人： Paul R. McHugh ,  Gregory J. Wilson ,  Kyle M. Hanson

IPC分类号： C25D17/00

CPC分类号： C25D17/001 ,  C25D5/08 ,  C25D17/005 ,  C25D17/007 ,  C25D17/008 ,  C25D17/12

摘要： An electrochemical processor may include a head having a rotor configured to hold a workpiece, with the head moveable to position the rotor in a vessel. Inner and outer anodes are in inner and outer anolyte chambers within the vessel. An upper cup in the vessel, has a curved upper surface and inner and outer catholyte chambers. A current thief is located adjacent to the curved upper surface. Annular slots in the curved upper curved surface connect into passageways, such as tubes, leading into the outer catholyte chamber. Membranes may separate the inner and outer anolyte chambers from the inner and outer catholyte chambers, respectively.

摘要翻译： 电化学处理器可以包括具有被配置为保持工件的转子的头部，头部可移动以将转子定位在容器中。 内阳极和外阳极在容器内部和外部阳极电解液室中。 容器中的上杯具有弯曲的上表面和内部和外部阴极电解液室。 目前的小偷位于弯曲的上表面附近。 弯曲的上曲面中的环形槽连接到通道，例如管，通向外阴极室。 膜可以分别将内部和外部阳极电解液室与内部和外部阴极电解液室分开。

公开(公告)号：US20120152751A1

公开(公告)日：2012-06-21

申请号：US13406387

申请日：2012-02-27

申请人： Rajesh Baskaran ,  Robert W. Batz, JR. ,  Bioh Kim ,  Tom L. Ritzdorf ,  John Lee Klocke ,  Kyle M. Hanson

发明人： Rajesh Baskaran ,  Robert W. Batz, JR. ,  Bioh Kim ,  Tom L. Ritzdorf ,  John Lee Klocke ,  Kyle M. Hanson

IPC分类号： C25D21/00

CPC分类号： C25D5/028 ,  C25D3/12 ,  C25D3/20 ,  C25D3/30 ,  C25D3/34 ,  C25D3/38 ,  C25D3/46 ,  C25D3/54 ,  C25D5/022 ,  C25D17/001 ,  C25D17/002 ,  C25D21/12 ,  C25F3/02 ,  H01L21/2885 ,  H01L21/76846 ,  H01L21/76868 ,  H01L21/76873 ,  H05K3/423

摘要： Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and a counter electrode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, a counter electrode, a second processing fluid, and an anion permeable barrier layer. The anion permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain anionic species to transfer between the two fluids. Some of the described processes produce deposits over repeated plating cycles that exhibit resistivity values within desired ranges.

摘要翻译： 描述了利用第一处理流体和对电极对微特征工件进行电解处理的工艺和系统。 使用第一处理流体，对电极，第二处理流体和阴离子可渗透阻挡层对微特征工件进行电解处理。 阴离子可渗透阻挡层将第一处理流体与第二处理流体分离，同时允许某些阴离子物质在两种流体之间转移。 所描述的一些方法中的一些在反复电镀循环中产生沉积物，其显示出所需范围内的电阻率值。