Abstract:
An electromagnetic interference (“EMI”) shield that can help control the emission of electromagnetic radiation from an optoelectronic module in which the EMI shield is positioned. In one example embodiment, an EMI shield includes a base and plurality of flanges extending from a perimeter of the base. The base defines an optical subassembly (“OSA”) opening and a plurality of complementary structures. The OSA opening is configured to receive an OSA. Each complementary structure is configured to engage a complementary structure of an OSA connector block.
Abstract:
A heat sink and module cage assembly for receiving a pluggable electronics component, such as an opto-electronic transceiver module. The heat sink is attached to the module cage and includes a bottom surface forming one of four sidewalls of a chamber that receives the electronics component. The attachment of the heat sink in this manner enables the heat sink and module cage to be assembled during fabrication and prior to the assembly being shipped to a third party who may use the assembly on a printed circuit board. The top surface of the heat sink defines a plane that enables the assembly to be press fitted onto the printed circuit board using a flat rock tool. The sidewall of the cage assembly opposite the bottom surface of the heat sink includes leaf springs that bias the electronics module against the heat sink, thereby facilitating heat transfer to the heat sink.
Abstract:
A functional module is provided for use in conjunction with an electronic equipment enclosure that includes a card cage having two end card guides and one or more middle card guides interposed between the end card guides. The functional module includes a double-wide card that is configured to be removably received in the card cage. The double-wide card includes electronic circuitry and defines a cutout configured to engage a middle card guide. When the functional module is operably positioned in the electronic equipment enclosure, the edges of the double wide card are supported by the end card guide and the cutout engages the middle card guide so that the double-wide card straddles the middle card guide and is supported thereby.
Abstract:
An optical subassembly is used in connection with an optoelectronic package with a shaped lead configuration. The lead configuration enables the shaped leads to electrically connect with through-hole vias defined in a printed circuit board while minimizing space requirements and providing stress relief for the leads. In one embodiment, an optical subassembly is disclosed, comprising a header containing optoelectronic components, and a plurality of conductive leads that are in operable communication with the optoelectronic components. Each lead includes a straight portion extending from a surface of the header, an end portion oriented so as to be received by a through-hole via defined in a printed circuit board, and a shaped portion interposed between the straight and end portions and having at least one bend defined in a first plane. The optical subassembly further includes a clip assembly having a plurality of cavities that each receive a corresponding one of the leads.
Abstract:
Methods of manufacturing optical transceiver modules using lead frame connectors that connect optical sub-assemblies to printed circuit boards are disclosed. The lead frame connector includes an electrically insulating case having a first part separated from a second part and a plurality of conductors that are electrically isolated one from another by the electrically insulating case. Each of the plurality of conductors can form an electrical contact restrained in a fixed position with respect to the first part and a contact point extending from the second part. The electrical contact is aligned with and soldered to the leads that protrude from the back end of an optical sub-assembly. The contact points can then be connected to electrical pads on a PCB.
Abstract:
An adapter element is provided for interfacing with a card guide of a card cage system to enable ready definition of various card storage configurations within the card cage system. The adapter element is configured to be removably attached to a card guide so that different card storage configurations may be readily defined within a particular card storage level by removing one or more adapter elements from the corresponding card guides and/or positioning one or more adapter elements in corresponding card guides. Additionally, the adapter element is configured to engage the fasteners of a functional module so as to securely retain the functional module in position in the card cage assembly when the adapter element is attached to the card guide.
Abstract:
An optical transceiver module having a plurality of optical subassemblies and a printed circuit board is disclosed. The transceiver module includes lead frame connectors for connecting the optical subassemblies to the printed circuit board. The lead frame connectors include a stamped and bent conductive lead structure that is encased in an insert injection molded plastic casing. The plastic casing provides electrical insulation for the conductors in the lead frame as well as mechanical support for the finished component. The lead frame connectors connect to the leads associated with the optical subassemblies and are surface mounted onto the printed circuit board to establish connectivity between the optical subassembly and the printed circuit board. The lead frame assemblies are generally more reliable and less expensive than using flexible printed circuit board structures to establish electrical connectivity between optical subassemblies and transceiver printed circuit boards.
Abstract:
An optical transceiver module for use in optical communications networks is disclosed. The transceiver features a simplified optical subassembly structure that facilitates the alignment and calibration of active optical components located thereon. The transceiver includes a shell that contains a transceiver printed circuit board and a transmitter/receiver optical subassembly (“TROSA”) connected to the printed circuit board via a TROSA connector. The TROSA includes a singular substrate on which a laser for producing optical signals and a photodetector for receiving optical signals are disposed. The laser and photodetector are precisely positioned on the TROSA substrate to have a specified spacing therebetween. So positioned, the laser and photodetector can be aligned with conduits of a sleeve assembly in a single alignment operation, thereby simplifying calibration of the transceiver module. The present transceiver eliminates the use of multiple substrates separately supporting the laser and the photodetector, thus also eliminating related alignment challenges.
Abstract:
An illumination apparatus for a digitizer tablet includes a support structure and a solid sheet optical light guide supported by the support structure and having first and second opposing surfaces and a plurality of edges. Light sources are carried by the support structure and positioned to direct light into light-receiving edges of the light guide. Reflecting structure is disposed adjacent the first surface of the light guide. A predetermined pattern is disposed on the first surface of the light guide structured and arranged in accordance with distance from the light sources.
Abstract:
An apparatus is presented for stabilizing an optical, thermal, and mechanical interface between a spectroscopic and/or imaging system and a biological sample. The apparatus includes a window retainer having a retainer surface and a well. The retainer surface surrounds the well. Further, the retainer surface is substantially planar. An optical window is located in the well. The optical window comprises a first and second surface. The second surface is in contact with the window retainer. The first surface is substantially flush with the retainer surface. The apparatus further includes an attachment mechanism coupling the window retainer to the biological sample such that a fluid, gel, adhesive or elastomer interposed between the optical window and the biological sample is trapped in the well.