Method and apparatus for indirect planarization
    41.
    发明授权
    Method and apparatus for indirect planarization 失效
    用于间接平面化的方法和装置

    公开(公告)号:US07746089B2

    公开(公告)日:2010-06-29

    申请号:US11537164

    申请日:2006-09-29

    IPC分类号: G01R31/02

    CPC分类号: G01R1/07364

    摘要: Methods and apparatus for indirect planarization of a substrate are provided herein. In one embodiment, an apparatus for indirectly planarizing a probe card assembly includes an adjustment portion for controlling a force applied to a probe substrate of the probe card assembly; a force application portion configured to apply the force to the probe substrate at a location that is laterally offset from the adjustment portion; and a mechanism coupling the adjustment portion to the force application portion.

    摘要翻译: 本文提供了用于衬底的间接平面化的方法和装置。 在一个实施例中,用于间接平面化探针卡组件的装置包括用于控制施加到探针卡组件的探针基板的力的调节部分; 力施加部,其构造成在从所述调节部侧向偏移的位置处向所述探针基板施加力; 以及将调节部联接到力施加部的机构。

    Probe card assembly with a mechanically decoupled wiring substrate
    42.
    发明授权
    Probe card assembly with a mechanically decoupled wiring substrate 有权
    具有机械去耦接线基板的探头卡组件

    公开(公告)号:US07622935B2

    公开(公告)日:2009-11-24

    申请号:US11551545

    申请日:2006-10-20

    IPC分类号: G01R31/02 G01R31/28

    CPC分类号: G01R31/2893

    摘要: A probe card assembly can comprise a probe head assembly and a wiring substrate. The probe head assembly can comprise a plurality of probes disposed to contact an electronic device disposed on a holder in a test housing. The wiring substrate can include an electrical interface to a test controller and a plurality of electrical wiring composing electrical paths between the electrical interface and ones of the probes, and the wiring substrate can comprise a first portion on which the electrical interface is disposed and a second portion composing the probe head assembly. The second portion of the wiring substrate can be moveable with respect to the first portion of the wiring substrate.

    摘要翻译: 探针卡组件可以包括探针头组件和布线衬底。 探针头组件可以包括多个探针,其设置成接触设置在测试壳体中的保持器上的电子设备。 布线基板可以包括与测试控制器的电接口以及构成电接口和探针之间的电气路径的多个电线,并且布线基板可以包括其上设置有电接口的第一部分和第二部分 组成探头组件的部分。 布线基板的第二部分能够相对于布线基板的第一部分移动。

    COMPONENT ASSEMBLY AND ALIGNMENT
    43.
    发明申请
    COMPONENT ASSEMBLY AND ALIGNMENT 失效
    组件装配和对准

    公开(公告)号:US20090079452A1

    公开(公告)日:2009-03-26

    申请号:US11861559

    申请日:2007-09-26

    IPC分类号: G01R1/073 G01R31/02 H01L21/68

    摘要: A method or an apparatus for aligning a plurality of structures can include applying a first force in a first plane to a first structure. The method can also include constraining in the first plane the first structure with respect to a second structure such that the first structure is in a position with respect to the second structure that aligns first features on the first structure with second features on the second structures. The second feature can be in a second plane that is generally parallel to the first plane. The first and second structures can be first and second electronic components, which can be components of a probe card assembly.

    摘要翻译: 用于对准多个结构的方法或设备可以包括将第一平面中的第一力施加到第一结构。 该方法还可以包括在第一平面中约束相对于第二结构的第一结构,使得第一结构相对于将第一结构上的第一特征与第二结构上的第二特征对准的第二结构处于相对位置。 第二特征可以在通常平行于第一平面的第二平面中。 第一和第二结构可以是第一和第二电子部件,其可以是探针卡组件的部件。

    Method and apparatus for adjusting a multi-substrate probe structure
    44.
    发明授权
    Method and apparatus for adjusting a multi-substrate probe structure 失效
    用于调整多基板探针结构的方法和装置

    公开(公告)号:US07471094B2

    公开(公告)日:2008-12-30

    申请号:US11165833

    申请日:2005-06-24

    IPC分类号: G01R31/02

    摘要: A probe card assembly comprises multiple probe substrates attached to a mounting assembly. Each probe substrate includes a set of probes, and together, the sets of probes on each probe substrate compose an array of probes for contacting a device to be tested. Adjustment mechanisms are configured to impart forces to each probe substrate to move individually each substrate with respect to the mounting assembly. The adjustment mechanisms may translate each probe substrate in an “x,” “y,” and/or “z” direction and may further rotate each probe substrate about any one or more of the forgoing directions. The adjustment mechanisms may further change a shape of one or more of the probe substrates. The probes can thus be aligned and/or planarized with respect to contacts on the device to be tested.

    摘要翻译: 探针卡组件包括附接到安装组件的多个探针基板。 每个探针衬底包括一组探针,并且每个探针衬底上的探针组合在一起组成一组探针,用于接触待测试的器件。 调整机构构造成赋予每个探针基板以相对于安装组件分别移动每个基板的力。 调节机构可以将每个探针基板转换成“x”,“y”和/或“z”方向,并且可以进一步围绕前述方向上的任何一个或多个旋转每个探针基板。 调节机构可以进一步改变一个或多个探针基板的形状。 因此,探针可以相对于要测试的装置上的触点对准和/或平坦化。

    ADJUSTMENT MECHANISM
    45.
    发明申请
    ADJUSTMENT MECHANISM 审中-公开
    调整机制

    公开(公告)号:US20080203268A1

    公开(公告)日:2008-08-28

    申请号:US12116032

    申请日:2008-05-06

    IPC分类号: G01R31/02 F16M13/00

    CPC分类号: G01R31/2891 G01R31/31905

    摘要: A probe card assembly can comprise a support structure to which a plurality of probes can be directly or indirectly attached. The probes can be disposed to contact an electronic device to be tested. The probe card assembly can further comprise actuators, which can be configured to change selectively an attitude of the support structure with respect to a reference structure. The probe card assembly can also comprise a plurality of lockable compliant structures. While unlocked, the lockable compliant structures can allow the support structure to move with respect to the reference structure. While locked, however, the compliant structures can provide mechanical resistance to movement of the support structure with respect to the reference structure.

    摘要翻译: 探针卡组件可以包括支撑结构,多个探针可以直接或间接附接到支撑结构。 可以将探针设置成接触要测试的电子设备。 探针卡组件还可以包括致动器,其可以被配置为相对于参考结构选择性地改变支撑结构的姿态。 探针卡组件还可以包括多个可锁定的柔顺结构。 当解锁时,可锁定的柔性结构可以允许支撑结构相对于参考结构移动。 然而,当锁定时,柔性结构可以提供对支撑结构相对于参考结构的移动的机械阻力。

    Wafer test cassette system
    46.
    发明授权
    Wafer test cassette system 有权
    晶圆测试盒系统

    公开(公告)号:US08872532B2

    公开(公告)日:2014-10-28

    申请号:US12979200

    申请日:2010-12-27

    IPC分类号: G01R31/00 G01R1/04 G01R31/302

    CPC分类号: G01R1/0491 G01R31/3025

    摘要: Wafer cassette systems and methods of using wafer cassette systems. A wafer cassette system can include a base and a probe card assembly. The base and the probe card assembly can each include complementary interlocking alignment elements. The alignment elements can constrain relative movement of the base and probe card assembly in directions parallel to a wafer receiving surface of the base, while permitting relative movement in a direction perpendicular to the receiving surface.

    摘要翻译: 晶圆盒系统和使用晶片盒系统的方法。 晶片盒系统可以包括基座和探针卡组件。 基座和探针卡组件可以各自包括互补的互锁对准元件。 对准元件可以约束基部和探针卡组件在平行于基部的晶片接收表面的方向上的相对运动,同时允许在垂直于接收表面的方向上的相对运动。

    Thermocentric alignment of elements on parts of an apparatus
    47.
    发明授权
    Thermocentric alignment of elements on parts of an apparatus 有权
    设备部件上的元素的中心对准

    公开(公告)号:US08760187B2

    公开(公告)日:2014-06-24

    申请号:US12327576

    申请日:2008-12-03

    申请人: Eric D. Hobbs

    发明人: Eric D. Hobbs

    IPC分类号: G01R31/20

    CPC分类号: G01R31/2889

    摘要: A first device and a second device can include at least one alignment feature and at least one corresponding constraint. The alignment feature and the constraint can be configured to align the first device and the second device when the alignment feature is inserted into the constraint. The alignment feature and the constraint can be further configured to direct relative movement between the first device and the second device due to relative thermal expansion or contraction between the first device and the second device. The directed relative movement can keep the first device and the second device aligned over a predetermined temperature range.

    摘要翻译: 第一装置和第二装置可以包括至少一个对准特征和至少一个对应的约束。 对准特征和约束可以被配置为当对准特征被插入到约束中时,使第一设备和第二设备对齐。 对准特征和约束可以被进一步配置成由于第一装置和第二装置之间的相对热膨胀或收缩而引导第一装置和第二装置之间的相对运动。 定向相对运动可以使第一装置和第二装置保持在预定的温度范围内。

    Probe card stiffener with decoupling
    48.
    发明授权
    Probe card stiffener with decoupling 有权
    探头卡加强件与去耦

    公开(公告)号:US08736294B2

    公开(公告)日:2014-05-27

    申请号:US12967302

    申请日:2010-12-14

    IPC分类号: G01R31/00

    CPC分类号: G01R1/07378 G01R31/2891

    摘要: A stiffener for a probe card assembly can include decoupling mechanisms disposed within radial arms of the stiffener. The decoupling mechanisms can be compliant in a direction along a radial direction of said radial arm and rigid in a direction perpendicular to said radial arm. The decoupling mechanisms can decouple the stiffener from thermally induced differential radial contraction and expansion of the stiffener relative to the cardholder to which the stiffener is mounted. This can reduce thermally-induced vertical translation of the probe card assembly.

    摘要翻译: 用于探针卡组件的加强件可以包括设置在加强件的径向臂内的解耦机构。 去耦机构可以沿着所述径向臂的径向的方向并且在垂直于所述径向臂的方向上是刚性的。 解耦机构可以将加强件与加热元件相对于加强件安装到的卡座上的热引起的差分径向收缩和膨胀相分离。 这可以减少探针卡组件的热诱导垂直平移。

    Test systems and methods for testing electronic devices
    49.
    发明授权
    Test systems and methods for testing electronic devices 有权
    用于测试电子设备的测试系统和方法

    公开(公告)号:US08587331B2

    公开(公告)日:2013-11-19

    申请号:US12979159

    申请日:2010-12-27

    IPC分类号: G01R31/00

    CPC分类号: G01R31/2891

    摘要: Devices under test (DUTs) can be tested in a test system that includes an aligner and test cells. A DUT can be moved into and clamped in an aligned position on a carrier in the aligner. In the align position, electrically conductive terminals of the DUT can be in a predetermined position with respect to carrier alignment features of the carrier. The DUT/carrier combination can then be moved from the aligner into one of the test cells, where alignment features of the carrier are mechanically coupled with alignment features of a contactor in the test cell. The mechanical coupling automatically aligns terminals of the DUT with probes of the contactor. The probes thus contact and make electrical connections with the terminals of the DUT. The DUT is then tested. The aligner and each of the test cells can be separate and independent devices so that a DUT can be aligned in the aligner while other DUTs, having previously been aligned to a carrier in the aligner, are tested in a test cell.

    摘要翻译: 被测设备(DUT)可以在包括对准器和测试单元的测试系统中进行测试。 DUT可以被移动并被夹持在对准器中的载体上的对准位置。 在对准位置,DUT的导电端子可以相对于载体的载体对准特征处于预定位置。 然后可以将DUT /载体组合从对准器移动到测试单元之一中,其中载体的对准特征与测试单元中的接触器的对准特征机械耦合。 机械联轴器将DUT的端子自动对准接触器的探头。 探头因此与DUT的端子接触并进行电气连接。 然后测试DUT。 对准器和每个测试单元可以是分离和独立的器件,使得DUT可以在对准器中对准,而在测试单元中测试已经与对准器中的载体对准的其它DUT。