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41.发明申请公开(公告)号：US20090115043A1
公开(公告)日：2009-05-07
申请号：US11934069
申请日：2007-11-01
申请人： Seng Guan Chow , Heap Hoe Kuan , Linda Pei Ee Chua
发明人： Seng Guan Chow , Heap Hoe Kuan , Linda Pei Ee Chua
IPC分类号： H01L23/488 , H01L21/56
CPC分类号： H01L25/0657 , H01L23/3128 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/03 , H01L2224/06135 , H01L2224/06136 , H01L2224/32145 , H01L2224/32225 , H01L2224/45139 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/73215 , H01L2224/73265 , H01L2225/0651 , H01L2924/00011 , H01L2924/00014 , H01L2924/01079 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/1815 , H01L2924/19107 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/01015
摘要： A mountable integrated circuit package system includes: mounting a first integrated circuit device over a carrier; mounting a substrate over the first integrated circuit device, the substrate having a mounting interconnect; connecting a first electrical interconnect between the carrier and the substrate; and forming a package encapsulation covering the carrier, the first integrated circuit device, the first electrical interconnect, and the substrate with the mounting interconnect partially exposed from and surrounded by the package encapsulation within a cavity of the package encapsulation.
摘要翻译： 一种可安装的集成电路封装系统，包括：将第一集成电路器件安装在载体上; 将衬底安装在所述第一集成电路器件上，所述衬底具有安装互连件; 连接载体和基底之间的第一电互连; 以及形成覆盖所述载体，所述第一集成电路器件，所述第一电互连和所述衬底的封装封装，所述安装互连部分地从所述封装封装的空腔内暴露并由所述封装封装围绕。
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42.发明申请公开(公告)号：US20090057863A1
公开(公告)日：2009-03-05
申请号：US11850197
申请日：2007-09-05
申请人： Seng Guan Chow , Heap Hoe Kuan , Linda Pei Ee Chua
发明人： Seng Guan Chow , Heap Hoe Kuan , Linda Pei Ee Chua
CPC分类号： H01L25/03 , H01L23/3128 , H01L24/73 , H01L25/105 , H01L2224/32225 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2225/1023 , H01L2225/1058 , H01L2225/1088 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/19107 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： An integrated circuit package-on-package system includes: mounting an integrated circuit package system having a mountable substrate over a package substrate; forming a package encapsulation having both a recess and an anti-mold flash feature over the package substrate and the integrated circuit package system including: forming the anti-mold flash feature having an extension width at the bottom of the recess, and partially exposing the mountable substrate in the recess with the anti-mold flash feature over mountable substrate; and mounting an integrated circuit device over the mountable substrate in the recess.
摘要翻译： 集成电路封装封装系统包括：在封装衬底上安装具有可安装衬底的集成电路封装系统; 形成在封装衬底和集成电路封装系统上具有凹陷和防霉闪光特征的封装封装，包括：形成具有在凹部底部的延伸宽度的防霉闪光特征，并且部分地暴露可安装 具有抗可塑性闪光特征的凹槽中的基底可安装在基底上; 以及将集成电路装置安装在可安装基板上的凹槽中。
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公开(公告)号：US07535086B2
公开(公告)日：2009-05-19
申请号：US11462320
申请日：2006-08-03
IPC分类号： H01L23/495 , H01L23/48 , H01L21/00
CPC分类号： H01L25/105 , H01L23/3128 , H01L23/49833 , H01L23/49861 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/16225 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/73204 , H01L2224/73265 , H01L2225/1005 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/00011 , H01L2924/00014 , H01L2924/01079 , H01L2924/078 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2924/00015 , H01L2224/05599 , H01L2224/0401
摘要： An integrated circuit package-on-package stacking system is provided including, forming a leadframe interposer including: forming a leadframe; forming a molded base on the leadframe; and singulating the leadframe interposer from the leadframe.
摘要翻译： 提供了一种集成电路封装堆叠堆叠系统，包括：形成引线框架中介层，包括：形成引线框架; 在引线框架上形成模制基座; 并从引线框架中分离引线框架插入器。
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44.发明授权Stackable integrated circuit package system with multiple interconnect interface 有权具有多个互连接口的可堆叠集成电路封装系统公开(公告)号：US08232658B2
公开(公告)日：2012-07-31
申请号：US12113888
申请日：2008-05-01
IPC分类号： H01L23/31
CPC分类号： H01L21/561 , H01L21/568 , H01L23/3107 , H01L23/3128 , H01L23/3135 , H01L23/49551 , H01L24/14 , H01L24/17 , H01L24/48 , H01L24/73 , H01L25/03 , H01L25/105 , H01L2224/13099 , H01L2224/1403 , H01L2224/141 , H01L2224/16245 , H01L2224/274 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/73204 , H01L2224/73265 , H01L2225/06558 , H01L2225/1029 , H01L2225/1058 , H01L2924/00014 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A stackable integrated circuit package system includes: forming a first integrated circuit die having a small interconnect and a large interconnect provided thereon; forming an external interconnect, having an upper tip and a lower tip, from a lead frame; mounting the first integrated circuit die on the external interconnect with the small interconnect on the lower tip and below the upper tip; and encapsulating around the small interconnect and around the large interconnect with an exposed surface.
摘要翻译： 一种可堆叠的集成电路封装系统，包括：形成具有小互连的第一集成电路管芯和设置在其上的大的互连; 从引线框架形成具有上端和下端的外部互连件; 将第一集成电路管芯安装在外部互连上，并在下部尖端上方和上部尖端上方具有小互连; 并且围绕小互连并围绕具有暴露表面的大互连围绕。
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公开(公告)号：US07986043B2
公开(公告)日：2011-07-26
申请号：US11276646
申请日：2006-03-08
IPC分类号： H01L23/48
CPC分类号： H01L23/3128 , H01L23/3135 , H01L24/45 , H01L24/48 , H01L25/0657 , H01L25/105 , H01L2224/16145 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/73207 , H01L2224/73265 , H01L2225/0651 , H01L2225/06513 , H01L2225/06568 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01067 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19104 , H01L2924/00015 , H01L2224/05599 , H01L2924/00 , H01L2924/00012
摘要： An integrated circuit package on package system including forming an interconnect integrated circuit package and attaching an extended-lead integrated circuit package on the interconnect integrated circuit package wherein a mold cap of the extended-lead integrated circuit package faces a mold cap of the interconnect integrated circuit package.
摘要翻译： 一种集成电路封装在封装系统上，包括形成互连集成电路封装并将互连集成电路封装上的扩展引线集成电路封装，其中延伸引线集成电路封装的模帽面向互连集成电路的模具盖 包。
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公开(公告)号：US07868434B2
公开(公告)日：2011-01-11
申请号：US12730171
申请日：2010-03-23
IPC分类号： H01L23/495
CPC分类号： H01L25/105 , H01L23/3128 , H01L23/49833 , H01L23/49861 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/16225 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/73204 , H01L2224/73265 , H01L2225/1005 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/00011 , H01L2924/00014 , H01L2924/01079 , H01L2924/078 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2924/00015 , H01L2224/05599 , H01L2224/0401
摘要： An integrated circuit package-on-package stacking system includes a leadframe interposer including: a leadframe having a lead; a molded base on a portion of the lead for only supporting the lead; and the leadframe interposer singulated from the leadframe, wherein the lead is bent to support a stack-up height.
摘要翻译： 一种集成电路封装堆叠堆叠系统，包括引线框架插入器，其包括：具有引线的引线框架; 在引线的一部分上仅用于支撑引线的模制基座; 并且引线框架插入器从引线框架分离，其中引线被弯曲以支撑堆叠高度。
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47.发明授权Stackable integrated circuit package system with multiple interconnect interface 有权具有多个互连接口的可堆叠集成电路封装系统公开(公告)号：US07385299B2
公开(公告)日：2008-06-10
申请号：US11307862
申请日：2006-02-25
IPC分类号： H01L23/2817
CPC分类号： H01L21/561 , H01L21/568 , H01L23/3107 , H01L23/3128 , H01L23/3135 , H01L23/49551 , H01L24/14 , H01L24/17 , H01L24/48 , H01L24/73 , H01L25/03 , H01L25/105 , H01L2224/13099 , H01L2224/1403 , H01L2224/141 , H01L2224/16245 , H01L2224/274 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/73204 , H01L2224/73265 , H01L2225/06558 , H01L2225/1029 , H01L2225/1058 , H01L2924/00014 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A stackable integrated circuit package system is provided forming a first integrated circuit die having an interconnect provided thereon, forming an external interconnect, having an upper tip and a lower tip, from a lead frame, mounting the first integrated circuit die on the external interconnect with the interconnect on the lower tip and below the upper tip, and encapsulating around the interconnect with an exposed surface.
摘要翻译： 提供一种可堆叠的集成电路封装系统，其形成具有设置在其上的互连的第一集成电路管芯，从引线框架形成具有上端和下端的外部互连件，将第一集成电路管芯安装在外部互连上， 在下端部和下端部之间的互连，并且在互连件周围用暴露的表面封装。
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公开(公告)号：US20110248411A1
公开(公告)日：2011-10-13
申请号：US13166417
申请日：2011-06-22
IPC分类号： H01L23/48
CPC分类号： H01L25/105 , H01L24/73 , H01L2224/32245 , H01L2224/45124 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2225/1029 , H01L2225/107 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/3511 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： An integrated circuit package in package system includes: a base integrated circuit package with a base lead substantially coplanar with a base die paddle and having a portion with a substantially planar base surface; an extended-lead integrated circuit package with an extended lead having a portion with a substantially planar lead-end surface; a package-stacking layer over the base integrated circuit package; and the extended-lead integrated circuit package over the base integrated circuit package including: an end portion of the extended lead, directly on the package-stacking layer, and the extended lead exposed by and extending away from the bottom of the side of an extended-lead encapsulation and bending downwards toward the direction of the package stacking layer with the substantially planar lead-end surface coplanar with the substantially planar base surface.
摘要翻译： 封装系统中的集成电路封装包括：基本集成电路封装，其具有基本共面的基极引线，并且具有基本平坦的基底表面的部分; 具有延伸引线的延伸引线集成电路封装，其具有基本平坦的前端表面的部分; 基底集成电路封装上的封装堆叠层; 以及在基底集成电路封装上的延伸引线集成电路封装，包括：延伸引线的端部，直接在封装堆叠层上，以及延伸的引线，其从延伸的侧面的底部暴露并远离其底部 包装并朝向包装堆叠层的方向向下弯曲，其中基本上平面的前端表面与基本平坦的基面共面。
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公开(公告)号：US20100176497A1
公开(公告)日：2010-07-15
申请号：US12730171
申请日：2010-03-23
IPC分类号： H01L23/495
CPC分类号： H01L25/105 , H01L23/3128 , H01L23/49833 , H01L23/49861 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/16225 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/73204 , H01L2224/73265 , H01L2225/1005 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/00011 , H01L2924/00014 , H01L2924/01079 , H01L2924/078 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2924/00015 , H01L2224/05599 , H01L2224/0401
摘要： An integrated circuit package-on-package stacking system includes a leadframe interposer including: a leadframe having a lead; a molded base on a portion of the lead for only supporting the lead; and the leadframe interposer singulated from the leadframe, wherein the lead is bent to support a stack-up height.
摘要翻译： 一种集成电路封装堆叠堆叠系统，包括引线框架插入器，其包括：具有引线的引线框架; 在引线的一部分上仅用于支撑引线的模制基座; 并且引线框架插入器从引线框架分离，其中引线被弯曲以支撑堆叠高度。
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公开(公告)号：US07741707B2
公开(公告)日：2010-06-22
申请号：US11307906
申请日：2006-02-27
IPC分类号： H01L23/02
CPC分类号： H01L24/73 , H01L24/91 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2224/73207 , H01L2224/73265 , H01L2225/0651 , H01L2225/0652 , H01L2225/06586 , H01L2225/06596 , H01L2225/1035 , H01L2225/1058 , H01L2924/01015 , H01L2924/01027 , H01L2924/01082 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/00014 , H01L2924/00012 , H01L2224/32225 , H01L2924/00
摘要： A stackable integrated circuit package system is provided placing a first integrated circuit die having an interconnect provided thereon in a substrate having a cavity, encapsulating the first integrated circuit die, having the interconnect exposed, in the cavity and along a first side of the substrate, mounting a second integrated circuit die to the first integrated circuit die, and encapsulating the second integrated circuit die along a second side of the substrate.
摘要翻译： 提供了一种可堆叠的集成电路封装系统，其将具有设置在其上的互连的第一集成电路管芯放置在具有空腔的衬底中，所述衬底具有空腔，将具有互连的第一集成电路管芯在空腔中并沿着衬底的第一侧封装， 将第二集成电路管芯安装到第一集成电路管芯上，并沿着衬底的第二侧封装第二集成电路管芯。
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