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公开(公告)号：US20110248411A1
公开(公告)日：2011-10-13
申请号：US13166417
申请日：2011-06-22
IPC分类号： H01L23/48
CPC分类号： H01L25/105 , H01L24/73 , H01L2224/32245 , H01L2224/45124 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2225/1029 , H01L2225/107 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/3511 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： An integrated circuit package in package system includes: a base integrated circuit package with a base lead substantially coplanar with a base die paddle and having a portion with a substantially planar base surface; an extended-lead integrated circuit package with an extended lead having a portion with a substantially planar lead-end surface; a package-stacking layer over the base integrated circuit package; and the extended-lead integrated circuit package over the base integrated circuit package including: an end portion of the extended lead, directly on the package-stacking layer, and the extended lead exposed by and extending away from the bottom of the side of an extended-lead encapsulation and bending downwards toward the direction of the package stacking layer with the substantially planar lead-end surface coplanar with the substantially planar base surface.
摘要翻译： 封装系统中的集成电路封装包括：基本集成电路封装，其具有基本共面的基极引线，并且具有基本平坦的基底表面的部分; 具有延伸引线的延伸引线集成电路封装，其具有基本平坦的前端表面的部分; 基底集成电路封装上的封装堆叠层; 以及在基底集成电路封装上的延伸引线集成电路封装，包括：延伸引线的端部，直接在封装堆叠层上，以及延伸的引线，其从延伸的侧面的底部暴露并远离其底部 包装并朝向包装堆叠层的方向向下弯曲，其中基本上平面的前端表面与基本平坦的基面共面。
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公开(公告)号：US07741707B2
公开(公告)日：2010-06-22
申请号：US11307906
申请日：2006-02-27
IPC分类号： H01L23/02
CPC分类号： H01L24/73 , H01L24/91 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2224/73207 , H01L2224/73265 , H01L2225/0651 , H01L2225/0652 , H01L2225/06586 , H01L2225/06596 , H01L2225/1035 , H01L2225/1058 , H01L2924/01015 , H01L2924/01027 , H01L2924/01082 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/00014 , H01L2924/00012 , H01L2224/32225 , H01L2924/00
摘要： A stackable integrated circuit package system is provided placing a first integrated circuit die having an interconnect provided thereon in a substrate having a cavity, encapsulating the first integrated circuit die, having the interconnect exposed, in the cavity and along a first side of the substrate, mounting a second integrated circuit die to the first integrated circuit die, and encapsulating the second integrated circuit die along a second side of the substrate.
摘要翻译： 提供了一种可堆叠的集成电路封装系统，其将具有设置在其上的互连的第一集成电路管芯放置在具有空腔的衬底中，所述衬底具有空腔，将具有互连的第一集成电路管芯在空腔中并沿着衬底的第一侧封装， 将第二集成电路管芯安装到第一集成电路管芯上，并沿着衬底的第二侧封装第二集成电路管芯。
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3.发明授权Stackable integrated circuit package system with multiple interconnect interface 有权具有多个互连接口的可堆叠集成电路封装系统公开(公告)号：US08232658B2
公开(公告)日：2012-07-31
申请号：US12113888
申请日：2008-05-01
IPC分类号： H01L23/31
CPC分类号： H01L21/561 , H01L21/568 , H01L23/3107 , H01L23/3128 , H01L23/3135 , H01L23/49551 , H01L24/14 , H01L24/17 , H01L24/48 , H01L24/73 , H01L25/03 , H01L25/105 , H01L2224/13099 , H01L2224/1403 , H01L2224/141 , H01L2224/16245 , H01L2224/274 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/73204 , H01L2224/73265 , H01L2225/06558 , H01L2225/1029 , H01L2225/1058 , H01L2924/00014 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A stackable integrated circuit package system includes: forming a first integrated circuit die having a small interconnect and a large interconnect provided thereon; forming an external interconnect, having an upper tip and a lower tip, from a lead frame; mounting the first integrated circuit die on the external interconnect with the small interconnect on the lower tip and below the upper tip; and encapsulating around the small interconnect and around the large interconnect with an exposed surface.
摘要翻译： 一种可堆叠的集成电路封装系统，包括：形成具有小互连的第一集成电路管芯和设置在其上的大的互连; 从引线框架形成具有上端和下端的外部互连件; 将第一集成电路管芯安装在外部互连上，并在下部尖端上方和上部尖端上方具有小互连; 并且围绕小互连并围绕具有暴露表面的大互连围绕。
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公开(公告)号：US07986043B2
公开(公告)日：2011-07-26
申请号：US11276646
申请日：2006-03-08
IPC分类号： H01L23/48
CPC分类号： H01L23/3128 , H01L23/3135 , H01L24/45 , H01L24/48 , H01L25/0657 , H01L25/105 , H01L2224/16145 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/73207 , H01L2224/73265 , H01L2225/0651 , H01L2225/06513 , H01L2225/06568 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01067 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19104 , H01L2924/00015 , H01L2224/05599 , H01L2924/00 , H01L2924/00012
摘要： An integrated circuit package on package system including forming an interconnect integrated circuit package and attaching an extended-lead integrated circuit package on the interconnect integrated circuit package wherein a mold cap of the extended-lead integrated circuit package faces a mold cap of the interconnect integrated circuit package.
摘要翻译： 一种集成电路封装在封装系统上，包括形成互连集成电路封装并将互连集成电路封装上的扩展引线集成电路封装，其中延伸引线集成电路封装的模帽面向互连集成电路的模具盖 包。
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5.发明授权Stackable integrated circuit package system with multiple interconnect interface 有权具有多个互连接口的可堆叠集成电路封装系统公开(公告)号：US07385299B2
公开(公告)日：2008-06-10
申请号：US11307862
申请日：2006-02-25
IPC分类号： H01L23/2817
CPC分类号： H01L21/561 , H01L21/568 , H01L23/3107 , H01L23/3128 , H01L23/3135 , H01L23/49551 , H01L24/14 , H01L24/17 , H01L24/48 , H01L24/73 , H01L25/03 , H01L25/105 , H01L2224/13099 , H01L2224/1403 , H01L2224/141 , H01L2224/16245 , H01L2224/274 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/73204 , H01L2224/73265 , H01L2225/06558 , H01L2225/1029 , H01L2225/1058 , H01L2924/00014 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A stackable integrated circuit package system is provided forming a first integrated circuit die having an interconnect provided thereon, forming an external interconnect, having an upper tip and a lower tip, from a lead frame, mounting the first integrated circuit die on the external interconnect with the interconnect on the lower tip and below the upper tip, and encapsulating around the interconnect with an exposed surface.
摘要翻译： 提供一种可堆叠的集成电路封装系统，其形成具有设置在其上的互连的第一集成电路管芯，从引线框架形成具有上端和下端的外部互连件，将第一集成电路管芯安装在外部互连上， 在下端部和下端部之间的互连，并且在互连件周围用暴露的表面封装。
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公开(公告)号：US08106500B2
公开(公告)日：2012-01-31
申请号：US12777023
申请日：2010-05-10
IPC分类号： H01L23/02
CPC分类号： H01L24/73 , H01L24/91 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2224/73207 , H01L2224/73265 , H01L2225/0651 , H01L2225/0652 , H01L2225/06586 , H01L2225/06596 , H01L2225/1035 , H01L2225/1058 , H01L2924/01015 , H01L2924/01027 , H01L2924/01082 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/00014 , H01L2924/00012 , H01L2224/32225 , H01L2924/00
摘要： A stackable integrated circuit package system includes: a substrate having a first side and a second side opposite the first side, the substrate having a cavity provided therein; a first integrated circuit die in the cavity with a first interconnect extending out from the cavity without connection and a second interconnect connected to the first side; a first mold compound to cover the first integrated circuit die, the second interconnect, and a portion of the first interconnect; a second integrated circuit die mounted to the first integrated circuit die with a third interconnect connected to the second side; a second mold compound to cover the second integrated circuit die and the third interconnect; and external interconnects, not encapsulated by the second encapsulant, mounted on the second side.
摘要翻译： 一种可堆叠集成电路封装系统，包括：具有第一侧和与第一侧相对的第二侧的衬底，所述衬底具有设置在其中的空腔; 空腔中的第一集成电路裸片，具有从所述空腔延伸而不连接的第一互连和连接到所述第一侧的第二互连; 覆盖第一集成电路管芯，第二互连件和第一互连部分的第一模具化合物; 第二集成电路管芯，其安装到第一集成电路管芯，第三互连件连接到第二侧; 覆盖第二集成电路管芯和第三互连的第二模具化合物; 以及安装在第二侧上的未被第二密封剂封装的外部互连。
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公开(公告)号：US07981702B2
公开(公告)日：2011-07-19
申请号：US11276647
申请日：2006-03-08
CPC分类号： H01L25/105 , H01L24/73 , H01L2224/32245 , H01L2224/45124 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2225/1029 , H01L2225/107 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/3511 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： An integrated circuit package in package system including forming a base integrated circuit package with a base lead having a portion with a substantially planar base surface, forming an extended-lead integrated circuit package with an extended lead having a portion with a substantially planar lead-end surface, and stacking the extended-lead integrated circuit package over the base integrated circuit package with the substantially planar lead-end surface coplanar with the substantially planar base surface.
摘要翻译： 一种封装系统中的集成电路封装，包括形成具有基部引线的基极集成电路封装，所述基极引线具有基本平坦的基面的部分，形成具有延伸引线的延伸引线集成电路封装，所述延伸引线具有基本平坦的引线端 表面，并且在基本集成电路封装上堆叠延伸引线集成电路封装，其中基本平坦的引出端表面与基本平坦的基面共面。
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公开(公告)号：US20100219523A1
公开(公告)日：2010-09-02
申请号：US12777023
申请日：2010-05-10
IPC分类号： H01L25/065 , H01L23/52
CPC分类号： H01L24/73 , H01L24/91 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2224/73207 , H01L2224/73265 , H01L2225/0651 , H01L2225/0652 , H01L2225/06586 , H01L2225/06596 , H01L2225/1035 , H01L2225/1058 , H01L2924/01015 , H01L2924/01027 , H01L2924/01082 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/00014 , H01L2924/00012 , H01L2224/32225 , H01L2924/00
摘要： A stackable integrated circuit package system includes: a substrate having a first side and a second side opposite the first side, the substrate having a cavity provided therein; a first integrated circuit die in the cavity with a first interconnect extending out from the cavity without connection and a second interconnect connected to the first side; a first mold compound to cover the first integrated circuit die, the second interconnect, and a portion of the first interconnect; a second integrated circuit die mounted to the first integrated circuit die with a third interconnect connected to the second side; a second mold compound to cover the second integrated circuit die and the third interconnect; and external interconnects, not encapsulated by the second encapsulant, mounted on the second side.
摘要翻译： 一种可堆叠集成电路封装系统，包括：具有第一侧和与第一侧相对的第二侧的衬底，所述衬底具有设置在其中的空腔; 空腔中的第一集成电路裸片，具有从所述空腔延伸而不连接的第一互连和连接到所述第一侧的第二互连; 覆盖第一集成电路管芯，第二互连件和第一互连部分的第一模具化合物; 第二集成电路管芯，其安装到第一集成电路管芯，第三互连件连接到第二侧; 覆盖第二集成电路管芯和第三互连的第二模具化合物; 以及安装在第二侧上的未被第二密封剂封装的外部互连。
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公开(公告)号：US20090152706A1
公开(公告)日：2009-06-18
申请号：US11954607
申请日：2007-12-12
CPC分类号： H01L23/3128 , H01L21/565 , H01L23/50 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/85 , H01L24/97 , H01L25/03 , H01L25/16 , H01L27/14618 , H01L2224/32225 , H01L2224/45014 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/8592 , H01L2224/97 , H01L2225/1023 , H01L2225/1041 , H01L2924/01013 , H01L2924/01015 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/19107 , H01L2924/00014 , H01L2224/85 , H01L2224/83 , H01L2924/00012 , H01L2924/00
摘要： An integrated circuit package system includes: mounting a device structure over a package carrier; connecting an internal interconnect between the device structure and the package carrier; forming an interconnect lock over the internal interconnect over the device structure with interconnect lock exposing the device structure; and forming a package encapsulation adjacent to the interconnect lock and over the package carrier.
摘要翻译： 集成电路封装系统包括：将器件结构安装在封装载体上; 连接器件结构和封装载体之间的内部互连; 在所述设备结构上的所述内部互连上形成互连锁，其中互连锁暴露所述设备结构; 以及在所述互连锁附近和所述封装载体上形成封装封装。
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公开(公告)号：US07535086B2
公开(公告)日：2009-05-19
申请号：US11462320
申请日：2006-08-03
IPC分类号： H01L23/495 , H01L23/48 , H01L21/00
CPC分类号： H01L25/105 , H01L23/3128 , H01L23/49833 , H01L23/49861 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/16225 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/73204 , H01L2224/73265 , H01L2225/1005 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/00011 , H01L2924/00014 , H01L2924/01079 , H01L2924/078 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2924/00015 , H01L2224/05599 , H01L2224/0401
摘要： An integrated circuit package-on-package stacking system is provided including, forming a leadframe interposer including: forming a leadframe; forming a molded base on the leadframe; and singulating the leadframe interposer from the leadframe.
摘要翻译： 提供了一种集成电路封装堆叠堆叠系统，包括：形成引线框架中介层，包括：形成引线框架; 在引线框架上形成模制基座; 并从引线框架中分离引线框架插入器。
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