Abstract:
A magnetic tunnel junction device with a compositionally modulated electrode and a method of fabricating a magnetic tunnel junction device with a compositionally modulated electrode are disclosed. An electrode in electrical communication with a data layer of the magnetic tunnel junction device includes a high resistivity region that has a higher resistivity than the electrode. As a result, a current flowing through the electrode generates joule heating in the high resistivity region and that joule heating increases a temperature of the data layer and reduces a coercivity of the data layer. Consequently, a magnitude of a switching field required to rotate an alterable orientation of magnetization of the data layer is reduced. The high resistivity region can be fabricated using a plasma oxidation, a plasma nitridation, a plasma carburization, or an alloying process.
Abstract:
The present invention provides a magnetic memory device that includes a magnetic memory cell switchable between two states by the application of a magnetic field wherein the magnetic field for such switching is dependent in part on a memory cell temperature. The device further includes at least one heater element proximate to the magnetic memory cell and series connected with the magnetic memory cell for heating of the magnetic memory cell. The device also includes a circuit for selectively applying the electrical current through the at least one heater element so as to heat the cell and facilitate cell state-switching.
Abstract:
A method of making a magnetic tunnel junction device is disclosed. The magnetic tunnel junction device includes a magnetic tunnel junction stack and an electrically non-conductive spacer in contact with a portion of the magnetic tunnel junction stack. The spacer electrically insulates a portion of the magnetic tunnel junction stack from an electrically conductive material used for a via that is in contact with the magnetic tunnel junction stack and a top conductor. The spacer can also prevent an electrical short between a bottom conductor and the top conductor. The spacer can prevent electrical shorts when the magnetic tunnel junction stack and a self-aligned via are not aligned with each other.
Abstract:
A method of fabricating an imprint stamp is disclosed. The imprint stamp includes a plurality of layers of material that are deposited in a deposition order. After deposition, each layer is patterned and then etched to form a portion of an application specific imprint pattern. The portion includes variations in a topography of the layer. The application specific imprint pattern comprises a plurality of features that are defined by the variations in the topographies of all of the layers of material that were deposited, patterned, and etched. The imprint stamp can be used in a soft-lithography process by pressing the application specific imprint pattern into a mask layer in which the application specific imprint pattern is replicated.
Abstract:
A storage device includes a first semiconducting layer having a p-dopant and a second semiconducting layer having an n-dopant, disposed on the first semiconducting layer forming a junction between the first and the second semiconducting layers. The storage device also includes a charge trapping structure disposed on the second semiconducting layer and a conductive gate, wherein the conductive gate and the charge trapping structure move relative to the other, wherein an electric field applied across the second semiconducting layer and the conductive gate traps charge in the charge trapping structure.
Abstract:
A method of fabricating a magnetic random access memory (MRAM) device is disclosed. The method reduces the number of mask steps and processing steps required to fabricate the MRAM device. A first conductive layer and a sense layer are patterned in a first mask step. A subsequent etching step forms a bottom electrode and a sense layer that are continuous with each other in a first direction. A second conductive layer and a plurality of layers of material required to form a magnetic tunnel junction stack are patterned in a second mask step. A subsequent etching step forms a top electrode and a plurality of layers of material that are continuous with each other in a second direction, and a plurality of discrete sense layers. The discrete sense layers and the plurality of layers of material define a plurality of magnetic tunnel junction devices.
Abstract:
Ultra-high-density data-storage media employing indium chalcogenide, gallium chalcogenide, and indium-gallium chalcogenide films to form bit-storage regions that act as photoconductive, photovoltaic, or photoluminescent semiconductor devices that produce electrical signals when exposed to electromagnetic radiation, or to form bit-storage regions that act as cathodoconductive, cathodovoltaic, or cathodoluminescent semiconductor devices that produce electrical signals when exposed to electron beams. Two values of a bit are represented by two solid phases of the data-storage medium, a crystalline phase and an amorphous phase, with transition between the two phases effected by heating the bit storage region.
Abstract:
A storage device includes a first semiconducting layer having a p-dopant and a second semiconducting layer having an n-dopant, disposed on the first semiconducting layer forming a junction between the first and the second semiconducting layers. The storage device also includes a charge trapping structure disposed on the second semiconducting layer and a conductive gate, wherein the conductive gate and the charge trapping structure move relative to the other, wherein an electric field applied across the second semiconducting layer and the conductive gate traps charge in the charge trapping structure.
Abstract:
An area-efficient stack capacitor for use in an integrated circuit comprises, in one embodiment, a layer of elemental platinum (Pt) as a bottom electrode, a layer of hemispherical grained poly Si on top of the Pt bottom electrode, a second layer of Pt deposited over the layer of hemispherical grained poly Si, a layer of dielectric deposited over the second layer of Pt, and a third layer of Pt deposited over the dielectric layer, where the third layer of Pt acts as upper electrode.
Abstract:
Methods for fabricating a semiconductor device are disclosed. Parallel gate structures are formed on a substrate with spaces between the gate structures. A blanket depositing of a conductive material is performed to fill the spaces and cover the gate structures such that contact with the substrate is made by the conductive material. A mask is patterned to remain over active area regions. The mask remains over the spaces. The conductive material is removed in accordance with the mask to provide contacts formed from the conductive material which fills the spaces over the active areas. A dielectric layer is deposited over the gate structures and over the contacts. Holes down to the contacts are formed, and a conductive region is connected to the contacts through the holes.