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150 条记录 (耗时 0.032 秒)

    Method of quantifying protective ratio of hydroxyl groups of polymer compound
    41.
    发明授权
    Method of quantifying protective ratio of hydroxyl groups of polymer compound 失效
    定量聚合物化合物羟基保护率的方法

    公开(公告)号：US06624257B2

    公开(公告)日：2003-09-23

    申请号：US09931769

    申请日：2001-08-20

    申请人： Masami Yoshida ,  Isao Yoshida ,  Satoshi Yamaguchi

    发明人： Masami Yoshida ,  Isao Yoshida ,  Satoshi Yamaguchi

    IPC分类号： C08F800

    CPC分类号： C08F8/00 ,  C08F2800/10 ,  C08F2810/30 ,  C08F12/24

    摘要： A method of quantifying the protection ratio of a hydroxyl group of a polymer compound, comprising calculating the protection ratio of a hydroxyl group of a polymer compound using a multiple regression calibration curve obtained by regression-analyzing main components of near infrared absorption spectra of a plurality of standards samples, from near infrared absorption spectra of samples containing a polymer compound composed of the following first structural unit and second structural unit: first structural unit: a structural unit of a structure having a hydroxyl group, second structural unit: a structural unit of a structure obtained by introducing a protective group into a hydroxyl group in the first structural unit. By this method, the protection ratio of a hydroxyl group of the polymer compound contained in a sample can be quantified with high precision in a short period of time without isolating the polymer compound.

    摘要翻译： 一种量化高分子化合物的羟基的保护率的方法，包括使用多元回归校准曲线计算高分子化合物的羟基的保护比，该多元回归校准曲线通过回归分析多个红外线吸收光谱的主要成分 标准样品，来自包含由以下第一结构单元和第二结构单元组成的高分子化合物的样品的近红外吸收光谱：第一结构单元：具有羟基的结构的结构单元，第二结构单元： 通过在第一结构单元中将保护基引入羟基而获得的结构。 通过该方法，可以在不分离高分子化合物的情况下，在短时间内高精度地定量样品中所含的高分子化合物的羟基的保护率。

    High frequency power amplifying module and wireless communication apparatus
    42.
    发明授权
    High frequency power amplifying module and wireless communication apparatus 有权
    高频功率放大模块和无线通信设备

    公开(公告)号：US06492872B1

    公开(公告)日：2002-12-10

    申请号：US09657237

    申请日：2000-09-07

    申请人： Toru Fujioka ,  Yoshikuni Matsunaga ,  Isao Yoshida ,  Masatoshi Morikawa ,  Masao Hotta ,  Tetsuaki Adachi

    发明人： Toru Fujioka ,  Yoshikuni Matsunaga ,  Isao Yoshida ,  Masatoshi Morikawa ,  Masao Hotta ,  Tetsuaki Adachi

    IPC分类号： H03G310

    CPC分类号： H03F1/301 ,  H03G3/3042

    摘要： A high frequency power amplifier module is provided for improving output controllability. A wireless communication apparatus incorporates a high frequency power amplifier module in a multi-stage configuration including a plurality of cascaded MOSFETS. The power amplifier module comprises a bias circuit for generating a gate voltage in response to a power control voltage (vapc) generated based on a power control signal of the wireless communication apparatus. The gate voltage has a bias pattern which presents smaller fluctuations in output power in response to a control voltage (Vapc) in a region near a threshold voltage (Vth) of the MOSFETs in respective amplification stages. In this way, the controllability for the output power is improved. More specifically, the power amplifier module has a gate bias circuit for generating the gate voltage (Vg) which follows a gate voltage pattern. The gate voltage (Vg) supplied to a control terminal in response to the control voltage (Vapc) largely changes in a region where the gate voltage (Vg) is lower than the threshold voltage (Vth) of the respective MOSFETs, and slightly changes near the threshold voltage (Vth). Also, the gate voltage (Vg) presents desired characteristics from the vicinity of the threshold voltage (Vth) to a high Vapc voltage region.

    摘要翻译： 提供了一种用于提高输出可控性的高频功率放大器模块。 无线通信装置将包括多个级联MOSFET的多级配置的高频功率放大器模块结合在一起。 功率放大器模块包括用于响应于基于无线通信设备的功率控制信号产生的功率控制电压（vapc）产生栅极电压的偏置电路。 栅极电压具有偏置图案，其响应于在各个放大级中的MOSFET的阈值电压（Vth）附近的区域中的控制电压（Vapc），输出功率的波动较小。 以这种方式，提高了输出功率的可控性。 更具体地，功率放大器模块具有用于产生跟随栅极电压图案的栅极电压（Vg）的栅极偏置电路。 响应于控制电压（Vapc）而提供给控制端的栅极电压（Vg）在栅极电压（Vg）低于各个MOSFET的阈值电压（Vth）的区域内大大变化，并且稍微改变 阈值电压（Vth）。 此外，栅极电压（Vg）从阈值电压（Vth）附近到高Vapc电压区域呈现期望的特性。

    Roofing tile having photovoltaic module to generate power
    43.
    发明授权
    Roofing tile having photovoltaic module to generate power 有权
    屋顶瓦具有光伏模块以发电

    公开(公告)号：US06453629B1

    公开(公告)日：2002-09-24

    申请号：US09620688

    申请日：2000-07-20

    申请人： Ichiro Nakazima ,  Teruki Hatsukaiwa ,  Fumihiro Tanigawa ,  Takuji Nomura ,  Isao Yoshida ,  Kazuhito Hirai

    发明人： Ichiro Nakazima ,  Teruki Hatsukaiwa ,  Fumihiro Tanigawa ,  Takuji Nomura ,  Isao Yoshida ,  Kazuhito Hirai

    IPC分类号： F24J236

    CPC分类号： H02S20/25 ,  F24S25/613 ,  F24S40/44 ,  Y02B10/12 ,  Y02B10/20 ,  Y02E10/47

    摘要： A roofing tile for performing solar-light power generation includes a roofing tile main body set tilted on a roof, and a photovoltaic module fixed to the main body. The roofing tile main body has a recess open upward. The photovoltaic module is stored and fixed in the recess. The roofing tile main body has an eaves-side edge portion. This edge portion has a plurality of drain ditches. Each drain ditch crosses the upper portion of the eaves-side edge portion and communicates with the recess. The level of the bottom surface of each drain ditch is equal to or lower than that of the bottom surface of the recess. With this construction, rainwater that has entered the recess is discharged through the drain ditches. Rainwater is drained by running the rainwater downward on the upper surface side of the eaves-side edge portion along the tilt direction of the roofing tile.

    摘要翻译： 用于执行太阳能发电的屋顶瓦包括倾斜在屋顶上的屋顶瓦主体和固定到主体的光伏模块。 屋顶瓦主体具有向上开口的凹部。 光伏模块被储存并固定在凹槽中。 屋顶瓦主体具有檐侧边缘部分。 该边缘部分具有多个排水沟。 每个排水沟跨越屋檐侧边缘部分的上部并与凹槽连通。 每个排水沟的底面水平等于或低于凹槽底面的水平面。 通过这种结构，进入凹槽的雨水通过排水沟排出。 通过沿屋顶瓦的倾斜方向在屋檐侧边缘部分的上表面侧向下运行雨水来排水雨水。

    Snow removal machine
    44.
    发明授权
    Snow removal machine 失效
    除雪机

    公开(公告)号：US06449882B2

    公开(公告)日：2002-09-17

    申请号：US09754644

    申请日：2001-01-04

    申请人： Masakatsu Kono ,  Isao Yoshida ,  Hiroshi Sueshige ,  Norikazu Shimizu

    发明人： Masakatsu Kono ,  Isao Yoshida ,  Hiroshi Sueshige ,  Norikazu Shimizu

    IPC分类号： E01H506

    CPC分类号： E01H5/04 ,  Y10T74/18832

    摘要： A walking-type snow removal machine comprises a snow removing member provided at a front part of a body frame for pushing snow forward, and crawler belts provided on right and left sides of the body frame. The body frame carries thereon an electric motor and a battery. The electric motor drives right and left drive wheels to drive the crawler belts. The electric motor generates little noise as compared with an engine, and contributes to downsizing of the snow removal machine. The battery supplies electrical power to the electric motor.

    摘要翻译： 行走式除雪机包括设置在车身前部用于向前推雪的除雪构件，以及设置在车架的右侧和左侧的履带。 车体框架上承载有电动马达和电池。 电动机驱动左右驱动轮驱动履带。 与发动机相比，电动马达产生的噪音小，有助于除雪机的小型化。 电池为电动机供电。

    Cephem compound, its production and its use for producing cephem antibiotics
    47.
    发明授权
    Cephem compound, its production and its use for producing cephem antibiotics 失效
    Cephem化合物，其生产及其用于生产头孢类抗生素的用途

    公开(公告)号：US5708165A

    公开(公告)日：1998-01-13

    申请号：US273912

    申请日：1994-07-12

    申请人： Mari Yuasa ,  Kazuyuki Yamagata ,  Hirokazu Murata ,  Masashi Komatsu ,  Isao Yoshida

    发明人： Mari Yuasa ,  Kazuyuki Yamagata ,  Hirokazu Murata ,  Masashi Komatsu ,  Isao Yoshida

    IPC分类号： C07D501/16 ,  C07D501/00 ,  C07D501/04 ,  C07D501/18 ,  C07D501/20 ,  C07D501/22 ,  C07D501/24 ,  C07D501/56 ,  C07D501/46

    CPC分类号： C07D501/00 ,  Y02P20/55

    摘要： A 3-�(E)-1-propenyl!cephem compound represented by formula (I): ##STR1## wherein R represents hydrogen, a protective group for an amino group, or the group shown by formula (II): ##STR2## in which R.sup.3 is a protective group for an amino group, R.sup.4 is a protective group for a hydroxyl group, and W is --CH.dbd. or --N.dbd.; R.sup.2 represents a protective group for a carboxyl group; and X represents hydrogen or chlorine. The compound is useful as an intermediate for producing cephem antibiotics and is prepared by isomerizing the corresponding 3-�(Z)-1-propenyl!cephem compound in an inert organic solvent in the presence of an aromatic thiol. The compound of formula (I) wherein X is chlorine can be converted into a 3-�(E)-3-ammonio-1-propenyl!cephem derivative through the reaction with a tertiary amine.

    摘要翻译： 由式（I）表示的3 - [（E）-1-丙烯基]头孢烯化合物：其中R表示氢，氨基保护基或式（II）所示的基团： （II）其中R3是氨基的保护基，R4是羟基的保护基，W是-CH =或-N =; R2表示羧基的保护基; X表示氢或氯。 该化合物可用作生产头孢类抗生素的中间体，并且通过在惰性有机溶剂中在芳族硫醇存在下使相应的3 - [（Z）-1-丙烯基]头孢烯化合物异构化而制备。 其中X为氯的式（I）化合物可通过与叔胺的反应转化为3 - [（E）-3-氨基-1-丙烯基]头孢烯衍生物。

    Packaged semiconductor device having heat dissipation/electrical connection bumps and method of manufacturing same
    49.
    发明授权
    Packaged semiconductor device having heat dissipation/electrical connection bumps and method of manufacturing same 失效
    具有散热/电连接凸块的封装半导体器件及其制造方法

    公开(公告)号：US5299091A

    公开(公告)日：1994-03-29

    申请号：US854028

    申请日：1992-03-19

    申请人： Akio Hoshi ,  Yukihiro Sato ,  Toyomasa Koda ,  Isao Yoshida ,  Kouzou Sakamoto

    发明人： Akio Hoshi ,  Yukihiro Sato ,  Toyomasa Koda ,  Isao Yoshida ,  Kouzou Sakamoto

    IPC分类号： H01L23/34 ,  H01L23/36 ,  H01L23/433 ,  H01L23/495 ,  H05K1/02 ,  H05K1/11 ,  H05K3/34 ,  H05K7/20

    CPC分类号： H01L23/36 ,  H01L23/4334 ,  H01L23/4951 ,  H01L23/49568 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2924/01014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/3011 ,  H05K1/0201 ,  H05K1/111 ,  H05K3/3421 ,  Y10T29/49121

    摘要： A packaged semiconductor device has, according to one embodiment of the present invention, a semiconductor pellet having an electronic circuit therein and electrode pads formed on a principal surface of the pellet, a plurality of electrical connection bumps provided on the electrode pads, a plurality of heat dissipation bumps provided at the principal surface of the pellet and electrically insulated from the electronic circuit and the electrode pads, electrical connection leads for the electronic circuit, heat dissipators for the electronic circuit and a packaging material for sealing pellet, the electrical connection bumps, the heat dissipation bumps and parts of the electrical connection leads and the heat dissipator. One or more of the heat dissipation bumps are arranged relatively nearer to the electronic circuit than the electrical connection bumps for thermal coupling to the electronic circuit. One or more of the electrical connection leads may be engaged with the electrical connection bumps and the heat dissipation bumps and/or one or more of the dissipators may be engaged with the heat dissipation bumps and the electrical connection bumps, thereby serving to effect electrical connection to and heat dissipation for the electronic circuit.

    摘要翻译： 根据本发明的一个实施例，封装的半导体器件具有其中具有电子电路的半导体芯片和形成在芯片的主表面上的电极焊盘，设置在电极焊盘上的多个电连接凸块，多个 提供在颗粒主表面上的散热凸块与电子电路和电极焊盘电绝缘，用于电子电路的电气连接引线，用于电子电路的散热器和用于密封颗粒的包装材料，电连接凸块， 散热凸块和电气连接引线和散热器的部件。 一个或多个散热凸块被布置成比用于热耦合到电子电路的电连接凸块相对更靠近电子电路。 一个或多个电连接引线可以与电连接凸块接合，并且散热凸块和/或一个或多个散热器可以与散热凸块和电连接凸块接合，从而用于实现电连接 电子电路的散热和散热。