Abstract:
A small-sized low-loss dielectric resonator, dielectric filter, and dielectric duplexer, and a communication device using such an element. Through-holes are formed in a dielectric block. The inner surface of each through-hole is covered with a thin-film multilayer electrode consisting of an outermost conductive layer and a multilayer region including thin-film conductive layers and thin-film dielectric layers. An outer conductor having a similar thin-film multilayer electrode structure is formed on the outer surface of the dielectric block. An outer conductor in the form of a single-layer electrode is formed on a short-circuited end face of the dielectric block thereby connecting together the thin-film conductive layers of the inner and outer conductors.
Abstract:
The invention provides a filtering device of the transmission-reception switched type which can be constructed in a form with a reduced size at a low cost without having to use circuit elements such as a capacitor, a coil, and a transmission line forming a phase shift circuit which are not essential to the filtering device. Inner conductors serving as distributed-parameter resonance lines are formed in a dielectric block. There is provided a coupling line coupled with particular inner conductors. The open-circuited ends of these particular inner conductors are connected to an outer conductor via corresponding diode switches so that transmission and reception filters are switched from each other when either diode switch is selectively turned on.
Abstract:
A semiconductor optical device includes a semiconductor laser region for producing laser light and having a first optical waveguide mesa structure including a first active layer and a diffraction grating, and first current blocking layers adjacent to opposite sides; a light modulator region for modulating the laser light and having a second optical waveguide mesa structure continuous with the first optical waveguide mesa structure and including a second active layer, and second current blocking layers adjacent to opposite sides; and a window region for propagating the laser light modulated by the light modulator region and having a mesa-shaped window structure continuous with the second optical waveguide mesa structure, the mesa width of the window structure being larger than the mesa width of the second optical waveguide mesa structure. The light is prevented from leaking from the window and reaching the interface of the window structure and a burying layer adjacent to the window structure. The laser light is not reflected at the interface of the window structure and the buried layer. The shape of the beam of laser light emitted from the window structure is not distorted, resulting in a satisfactory connection to an optical system.
Abstract:
A dielectric filter is formed by a plurality of resonator holes which are formed in a single dielectric block in such a manner that they extend in a direction between an open-circuited end surface and a short-circuited end surface of the dielectric block. The resonator holes are opened only at the short-circuited end surface. An inner conductor is formed on an inner surface of each of the resonator holes. An outer conductor is formed on an outer surface of the dielectric block. Capacitor electrodes respectively corresponding to the resonator holes are formed on the open-circuited end surface of the dielectric block. Input/output electrodes electrically connected to the capacitor electrodes are formed in such a manner that they extend on both the open-circuited end surface and a bottom surface of the dielectric block. In this structure, since all the capacitive components constituting the filter can be obtained by either the capacitances formed between the capacitor electrodes and the inner conductors, or the capacitances formed in a gap between the capacitor electrodes, the dielectric filter can be constructed in the form of a single block.
Abstract:
Dielectric resonator wherein an internal conductor non-formed portion is provided near one open face of the internal conductor formed holes, and signal input, output electrodes are provided on one portion of the external conductor, whereby electromagnetic field leakage is restrained, because the open face is not formed, and individual parts such as signal input, output pins and so on are not required.
Abstract:
A method of fabricating a semiconductor laser includes successively epitaxially growing on a first conductivity type semiconductor substrate, a first conductivity type lower cladding layer, an active layer, a second conductivity type first upper cladding layer having a relatively high etching rate in an etchant, a second conductivity type etch stopping layer having a relatively low etching rate in the etchant, a second conductivity type second upper cladding layer, and a second conductivity type first contact layer; forming a stripe-shaped mask on the first contact layer; removing portions of the first contact layer and the second upper cladding layer in a first wet etching step to expose the etch stopping layer; removing portions of the second upper cladding layer in a second wet etching step to form a stripe-shaped ridge structure having a reverse mesa cross section without an intermediate construction; growing a first conductivity type current blocking layer contacting both sides of the ridge structure; and after removal of the mask, growing a second conductivity type second contact layer on the current blocking layer and on the first contact layer. The angle between the side wall of the ridge and the etch stopping layer is an acute angle so the stripe-shaped ridge structure has a perfect reverse mesa cross section and is narrowest proximate the active layer.
Abstract:
A single-stage dielectric band elimination filter has a dielectric block with its outer surfaces mostly covered by an outer conductor and two mutually coupled resonant lines formed therein. Each resonant line has an open end insulated from the outer conductor and a shorted end connected thereto, the open and shorted ends of the two resonant lines being oppositely oriented. A multi-stage dielectric filter has a plurality of such single-stage band elimination filters formed inside a dielectric block, each mutually adjacent pair of the single-stage band elimination filters being interdigitally coupled or combline-coupled to each other with phase shift of II/2 therebetween. The open end of a resonant line may be formed at one of the end surfaces of the dielectric block, being connected to an electrode insulated from the outer conductor, or at an annular conductor-free area formed on the inner surface of the corresponding throughhole. The resonant lines for forming the plurality of single-stage band elimination filters may be arranged horizontally or vertically with respect to each other. Screening electrodes may be inserted between mutually adjacent resonant lines.
Abstract:
In a semiconductor laser module wherein a semiconductor laser chip having a light emitting facet and an optical fiber having a fiber facet are mounted on a module substrate so that the light emitting facet faces the fiber facet, the semiconductor laser chip includes semiconductor layers disposed on a semiconductor substrate and including a light emitting region, and the semiconductor substrate has a portion protruding beyond the light emitting facet. The optical fiber includes a core extending in the optical waveguide direction and a cladding part surrounding the core. In this module, positioning of the optical fiber in the optical axis direction is performed by abutting a portion of the cladding part at the fiber facet against the protruding portion of the substrate of the semiconductor laser chip. Therefore, alignment of the optical fiber with the laser chip in the optical axis direction is performed easily and accurately with a desired spacing between them, without contacting the light emitting facet of the laser chip to the fiber facet, whereby coupling efficiency between the laser chip and the optical fiber is significantly improved.
Abstract:
A method of fabricating an integrated semiconductor laser device includes preparing a polygonal heat sink having side surfaces, and die-bonding semiconductor laser chips to the side surfaces of the heat sink. Therefore, the semiconductor laser chips are accurately arranged at such positions that laser beams emitted from these laser chips are parallel to each other and partially overlap each other. In addition, the semiconductor laser chips are integrated without unwanted contact of a conductive material used for the die-bonding to an active layer exposed at a facet of each laser chip. Further, since the complicated process of die-bonding a laser chip on another laser chip is dispensed with, the fabricating method is easily automated.
Abstract:
A method for fabricating a semiconductor laser includes forming a double heterojunction structure on a first conductivity type semiconductor substrate; forming the double heterojunction structure into a stripe mesa shape by selective etching; successively growing a first conductivity type layer, a second conductivity type current blocking layer, and a first conductivity type current blocking layer on opposite sides of the mesa to embed the mesa; and adding an impurity from a surface of the first conductivity type current blocking layer to form impurity doped regions that electrically separate the second conductivity type current blocking layer from an upper part of the mesa at opposite sides of the mesa.