摘要:
In a manufacturing method of a thin and small RFID tag, an antenna metal pattern is formed on a substrate, going once around a dielectric plate, and a recess is formed on the substrate to house an IC chip. A strap on which the IC chip is mounted is connected and fastened to the substrate in the position and orientation in which the IC chip is housed in the recess.
摘要:
There is provided a control device of an industrial vehicle and an industrial vehicle loaded with this device, capable of reliably detecting operator absence, thereby avoiding the danger of an accident occurring during this absence. In a control device 10 which performs the control of actuating a parking brake 7 during operator's absence in an industrial vehicle including a seat switch 1, a vehicle speed sensor 2, and the parking brake 7 controlled by a parking brake solenoid 6, the control device includes a counter 11 which counts the elapsed time after the seat switch 1 detects the operator's absence, and sets the time corresponding to the time until the operator leaves the vehicle after the operator leaves his/hear seat as a preset absence time. When the seat switch 1 has detected absence, a control signal which validates the parking brake 7 is output to the parking brake solenoid 6, thereby actuating the parking brake 7 if the vehicle speed shows a vehicle stopped state, and the elapsed time becomes equal to or more than the set absence time.
摘要:
An image forming system which is capable of preventing paper jam from occurring in a sheet processing apparatus to thereby maintain the stability of the system. An alignment plates of an alignment unit movable in a lateral direction each sheet are brought into abutment with opposite side edges of sheets stacked on the sheet stack unit to laterally align the sheets. A lateral registration sensor unit detects a lateral position of the sheet being conveyed. When the detected lateral position of the sheet is beyond a predetermined position, the CPU of the apparatus changes the standby positions of the alignment plates such that spacing therebetween in the lateral direction the sheet is widened by a predetermined amount, and extends the conveying interval of sheets in the image forming apparatus by a predetermined time period.
摘要:
The present invention is an electrode material comprising at least, a silver powder, a glass frit, and an organic vehicle, wherein a rate of Ag content of the electrode material is 75 wt % to 95 wt %, and a ratio of contents of Ag grains having an average grain diameter of 0.5 μm to 3 μm and Ag grains having an average grain diameter of 4 μm to 8 μm in the electrode material is (the Ag grains having an average grain diameter of 0.5 μm to 3 μm):(the Ag grains having an average grain diameter of 4 μm to 8 μm)=20-80 wt %:80-20 wt %, and a solar cell comprising an electrode formed by using the electrode material. Thereby, an electrode material that can be stably filled in an electrode groove formed on a semiconductor device and that an electrode with narrow line width and small resistance loss can be easily formed by, and a solar cell with high power having an electrode formed by using the electrode material are provided.
摘要:
The present invention is directed to a semiconductor substrate having an electrode formed thereon, the electrode including at least silver and glass frit, the electrode including: a multi-layered structure constituted of a first electrode layer joined directly to the semiconductor substrate, and an upper electrode layer formed of at least one layer and disposed on the first electrode layer; wherein the upper electrode layer is formed by firing a conductive paste having a total silver content of 75 wt % or more and 95 wt % or less, the content of silver particles having an average particle diameter of 4 μm or greater and 8 μm or smaller with respect to the total silver content in the upper electrode layer being higher than that in the first electrode layer. As a consequence, it is possible to form the electrode, which has the high aspect ratio and hardly suffers an inconvenience such as a break, on the semiconductor substrate by a simple method.
摘要:
A method of assembling a carriage assembly is capable of suppressing deformation of spacer portions when suspensions are attached to carriage arms. The method of assembling a carriage assembly aligns fitting holes provided in front end portions of carriage arms and spacer holes provided in spacer portions of suspensions and places the suspensions onto the carriage arms, and then presses a ball with a diameter equal to or greater than an inner diameter of the spacer holes with a pressure-applying member to pass the ball through the spacer holes, thereby crimping spacer hole edge portions of the spacer portions and attaching the suspensions to the front end portions of the carriage arms. By applying ultrasonic vibration from two axial directions to the pressure-applying member, the pressure-applying member is caused to vibrate on a two-dimensional movement path on a predetermined plane and passes the ball through the spacer holes while causing the ball to rotate.
摘要:
The present invention is a method for manufacturing a solar cell by forming a p-n junction in a semiconductor substrate having a first conductivity type, wherein, at least: a first coating material containing a dopant and an agent for preventing a dopant from scattering, and a second coating material containing a dopant, are coated on the semiconductor substrate having the first conductivity type so that the second coating material may be brought into contact with at least the first coating material; and, a first diffusion layer formed by coating the first coating material, and a second diffusion layer formed by coating the second coating material the second diffusion layer having a conductivity is lower than that of the first diffusion layer are simultaneously formed by a diffusion heat treatment; a solar cell manufactured by the method; and a method for manufacturing a semiconductor device. It is therefore possible to provide the method for manufacturing the solar cell, which can manufacture the solar cell whose photoelectric conversion efficiency is improved at low cost and with a simple and easy method by suppressing surface recombination in a portion other than an electrode of a light-receiving surface and recombination within an emitter while obtaining ohmic contact; the solar cell manufactured by the method; and the method for manufacturing the semiconductor device.
摘要:
A radio-frequency-identification tag antenna includes a film base, a plurality of antenna patterns for transmission and reception, which is formed in parallel on the film base, and a cut line that is formed on the film base between adjacent antenna patterns along the antenna patterns from an inside to an outer edge of the film base. A part of the film base on which the antenna patterns are formed is folded or bent in a predetermined direction using the cut line.
摘要:
A sheet processing apparatus includes a stack tray, a stapler, a stapler moving device, and an aligning member. When a stapling process is performed at least two staple positions of the sheet bundle stacked on the stack tray using the stapler, the stapler is moved to the next staple position by relative movement in which the stapler and the sheet bundle are moved in the opposite directions by the stapler moving device and the aligning member respectively. When the number of sheets in the sheet bundle or a weight of the sheet bundle is lower than a predetermined value, a moving speed of the sheet bundle is set faster than a moving speed of the sheet bundle at which the number of sheets in the sheet bundle is not lower than the predetermined value or the weight of the sheet bundle is not lower than the predetermined value.
摘要:
An RFID tag including a first part which has a first base and a communication antenna formed on the first base by use of a paste of resin material mixed with metallic filler; and a second part disposed on the first part, which has a second base, a metallic patch disposed on the second base and electrically connected to the antenna on the first part, and a circuit chip connected onto the metallic patch via a bump, the circuit chip performing radio communication via the antenna.