公开(公告)号：US20060208094A1

公开(公告)日：2006-09-21

申请号：US11188346

申请日：2005-07-25

申请人： Naoki Ishikawa ,  Shunji Baba ,  Hidehiko Kira ,  Hiroshi Kobayashi ,  Shunichi Kikuchi

发明人： Naoki Ishikawa ,  Shunji Baba ,  Hidehiko Kira ,  Hiroshi Kobayashi ,  Shunichi Kikuchi

IPC分类号： G06K19/06

CPC分类号： G06K19/0775 ,  G06K19/07749 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05568 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05599

摘要： An RFID tag is provided which comprises: a first part which has a first base and a communication antenna formed on the first base by use of a paste of resin material mixed with metallic filler; and a second part disposed on the first part, which has a second base, a metallic patch disposed on the second base and electrically connected to the antenna on the first part, and a circuit chip connected onto the metallic patch via a bump, the circuit chip performing radio communication via the antenna.

摘要翻译： 提供一种RFID标签，其包括：第一部分，其具有通过使用与金属填料混合的树脂材料的浆料形成在第一基部上的第一基座和通信天线; 以及设置在第一部分上的第二部分，其具有第二基底，设置在第二基底上并与第一部分上的天线电连接的金属贴片，以及通过凸块连接到金属贴片上的电路芯片，该电路 芯片通过天线执行无线电通信。

公开(公告)号：US07431218B2

公开(公告)日：2008-10-07

申请号：US11188346

申请日：2005-07-25

申请人： Naoki Ishikawa ,  Shunji Baba ,  Hidehiko Kira ,  Hiroshi Kobayashi ,  Shunichi Kikuchi

发明人： Naoki Ishikawa ,  Shunji Baba ,  Hidehiko Kira ,  Hiroshi Kobayashi ,  Shunichi Kikuchi

IPC分类号： G06K19/06

CPC分类号： G06K19/0775 ,  G06K19/07749 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05568 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05599

摘要： An RFID tag including a first part which has a first base and a communication antenna formed on the first base by use of a paste of resin material mixed with metallic filler; and a second part disposed on the first part, which has a second base, a metallic patch disposed on the second base and electrically connected to the antenna on the first part, and a circuit chip connected onto the metallic patch via a bump, the circuit chip performing radio communication via the antenna.

摘要翻译： 一种RFID标签，包括：第一部分，其具有通过使用与金属填料混合的树脂材料的浆料形成在第一基底上的第一基底和通信天线; 以及设置在第一部分上的第二部分，其具有第二基底，设置在第二基底上并与第一部分上的天线电连接的金属贴片，以及通过凸块连接到金属贴片上的电路芯片，该电路 芯片通过天线执行无线电通信。

公开(公告)号：US20070020800A1

公开(公告)日：2007-01-25

申请号：US11319652

申请日：2005-12-29

申请人： Naoki Ishikawa ,  Shunji Baba ,  Hidehiko Kira ,  Hiroshi Kobayashi ,  Shunichi Kikuchi ,  Tatsuro Tsuneno

发明人： Naoki Ishikawa ,  Shunji Baba ,  Hidehiko Kira ,  Hiroshi Kobayashi ,  Shunichi Kikuchi ,  Tatsuro Tsuneno

IPC分类号： H01L21/00

CPC分类号： G06K19/07749 ,  H01L21/67132 ,  H01L21/67144 ,  H01L21/6835 ,  H01L21/6836 ,  H01L24/75 ,  H01L24/81 ,  H01L24/97 ,  H01L2221/68327 ,  H01L2221/68354 ,  H01L2223/6677 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/75314 ,  H01L2224/7565 ,  H01L2224/75745 ,  H01L2224/7598 ,  H01L2224/81001 ,  H01L2224/81005 ,  H01L2224/81121 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/81907 ,  H01L2224/83192 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2224/81

摘要： An IC chip mounting method which mounts two or more IC chips on a base, includes: preparing a wafer by mounting a tape on a face thereof, which is the reverse of the wafer having a mounting surface to be attached to the base, and by dividing the wafer into IC chips by dicing while leaving the tape; positioning the wafer to face the base in such a direction that the mounting surface to be attached to the base faces the base; sequentially pressing the IC chips on the wafer against the base and temporarily fixing the IC chips while the base is being fed in a prescribed one-dimensional direction along the wafer and while the wafer is being moved two-dimensionally along the base; and fixing the IC chips temporarily fixed on the base on the base by heating and pressurizing in a batch manner.

公开(公告)号：US07214563B2

公开(公告)日：2007-05-08

申请号：US11319652

申请日：2005-12-29

申请人： Naoki Ishikawa ,  Shunji Baba ,  Hidehiko Kira ,  Hiroshi Kobayashi ,  Shunichi Kikuchi ,  Tatsuro Tsuneno

发明人： Naoki Ishikawa ,  Shunji Baba ,  Hidehiko Kira ,  Hiroshi Kobayashi ,  Shunichi Kikuchi ,  Tatsuro Tsuneno

IPC分类号： H01L21/44

CPC分类号： G06K19/07749 ,  H01L21/67132 ,  H01L21/67144 ,  H01L21/6835 ,  H01L21/6836 ,  H01L24/75 ,  H01L24/81 ,  H01L24/97 ,  H01L2221/68327 ,  H01L2221/68354 ,  H01L2223/6677 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/75314 ,  H01L2224/7565 ,  H01L2224/75745 ,  H01L2224/7598 ,  H01L2224/81001 ,  H01L2224/81005 ,  H01L2224/81121 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/81907 ,  H01L2224/83192 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2224/81

摘要： An IC chip mounting method which mounts two or more IC chips on a base, includes: preparing a wafer by mounting a tape on a face thereof, which is the reverse of the wafer having a mounting surface to be attached to the base, and by dividing the wafer into IC chips by dicing while leaving the tape; positioning the wafer to face the base in such a direction that the mounting surface to be attached to the base faces the base; sequentially pressing the IC chips on the wafer against the base and temporarily fixing the IC chips while the base is being fed in a prescribed one-dimensional direction along the wafer and while the wafer is being moved two-dimensionally along the base; and fixing the IC chips temporarily fixed on the base on the base by heating and pressurizing in a batch manner.

摘要翻译： 一种将两个或更多个IC芯片安装在基座上的IC芯片安装方法，包括：通过在其表面上安装带子，准备晶片，该晶片具有安装在基座上的安装表面，并且通过 在离开胶带的同时通过切割将晶片分成IC芯片; 将晶片定位成使得与基座相对的安装表面面向基座的方向面对基座; 在晶片沿着晶片沿指定的一维方向进给的同时沿着基座二维移动的同时，将晶片上的IC芯片依次按压在基板上并临时固定IC芯片; 并且通过间歇加热和加压将临时固定在基座上的IC芯片固定在基座上。

公开(公告)号：US07199718B2

公开(公告)日：2007-04-03

申请号：US11085491

申请日：2005-03-22

申请人： Shunichi Kikuchi ,  Masumi Suzuki ,  Michimasa Aoki

发明人： Shunichi Kikuchi ,  Masumi Suzuki ,  Michimasa Aoki

IPC分类号： G08B13/14

CPC分类号： G06K19/0773 ,  B31D1/028 ,  G06K19/07749 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/3025 ,  Y10T29/49117 ,  Y10T156/10 ,  Y10T156/1056 ,  Y10T156/1062 ,  H01L2224/0401

摘要： The present invention provides an RFID tag excellent in the diffusion of heat. The RFID tag includes a base, an antenna pattern that is provided on the base and forms a communication antenna, a circuit chip that is electrically connected to the antenna pattern and performs radio communication via the antenna, a cover that is provided in close contact with the base in such a manner as to cover the antenna pattern except a prescribed region including the circuit chip, and an insulating thermal diffusion material that covers the prescribed region and is in thermal contact with the circuit chip. The insulating thermal diffusion material has thermal conductivity higher than the thermal conductivity of the cover.

摘要翻译： 本发明提供了热扩散性优异的RFID标签。 RFID标签包括：基座，设置在基座上并形成通信天线的天线图案，与天线图形电连接并通过天线进行无线通信的电路芯片，与所述天线图案紧密接触地设置的盖 该基底以覆盖包括电路芯片的规定区域以外的天线图案，以及覆盖规定区域并与电路芯片热接触的绝缘热扩散材料。 绝缘热扩散材料的导热系数高于盖的热导率。

公开(公告)号：US4783721A

公开(公告)日：1988-11-08

申请号：US79877

申请日：1987-07-30

申请人： Haruhiko Yamamoto ,  Masahiro Suzuki ,  Yoshiaki Udagawa ,  Mitsuhiko Nakata ,  Koji Katsuyama ,  Izumi Ono ,  Shunichi Kikuchi

发明人： Haruhiko Yamamoto ,  Masahiro Suzuki ,  Yoshiaki Udagawa ,  Mitsuhiko Nakata ,  Koji Katsuyama ,  Izumi Ono ,  Shunichi Kikuchi

IPC分类号： G02F1/00 ,  G11B5/64 ,  G11B11/105 ,  H01L23/433 ,  H01L23/473 ,  H05K7/20

CPC分类号： H01L23/4735 ,  G02F1/0036 ,  G11B11/10591 ,  G11B5/64 ,  H01L23/4332 ,  H01L2224/48091

摘要： A cooling system including a cooling module which has a heat transfer plate that is exposed to a flow of coolant and is elastically biased toward a circuit component on a printed circuit board for transferring heat dissipated by the component to the coolant, and means for guiding and preventing improper alignment of the transfer plate as the same is resiliently biased toward the circuit component. The coolant module may include a solder or low-melting-point metal for establishing thermal contact between the transfer plate and the circuit component.

摘要翻译： 一种冷却系统，包括：冷却模块，其具有暴露于冷却剂流的传热板，并且朝向印刷电路板上的电路部件弹性偏置，用于将由所述部件散发的热传递到所述冷却剂;以及用于引导和 防止转印板的不正确对准，因为它们朝向电路部件弹性偏压。 冷却剂模块可以包括用于在转印板和电路部件之间建立热接触的焊料或低熔点金属。

公开(公告)号：US06787711B2

公开(公告)日：2004-09-07

申请号：US10195547

申请日：2002-07-16

申请人： Shunichi Kikuchi ,  Mitsutaka Yamada ,  Kenji Iketaki

发明人： Shunichi Kikuchi ,  Mitsutaka Yamada ,  Kenji Iketaki

IPC分类号： H05K111

CPC分类号： H05K1/0209 ,  H05K1/0201 ,  H05K3/3494 ,  H05K2201/066 ,  H05K2201/09781 ,  H05K2201/10204 ,  H05K2203/1121 ,  H05K2203/304 ,  Y10T29/4913 ,  Y10T29/49144

摘要： A printed wiring board device includes circuit parts which are mounted on a wiring board and constitute parts of a circuit in the printed wiring board device. Pads are provided on the wiring board in the circumference of the circuit parts, and the pads being electrically isolated from the circuit. Heat-absorbing dummy parts are mounted on the pads, and the dummy parts absorb heat from the circuit parts through the pads during reflow soldering.

摘要翻译： 印刷电路板装置包括安装在布线板上并构成印刷线路板装置中的电路的一部分的电路部分。 在电路部分的圆周上的布线板上设置有焊盘，并且焊盘与电路电隔离。 吸热虚拟部件安装在焊盘上，并且虚拟部件在回流焊接期间通过焊盘吸收来自电路部件的热量。

公开(公告)号：US20060161787A1

公开(公告)日：2006-07-20

申请号：US11117751

申请日：2005-04-29

申请人： Shunichi Kikuchi

发明人： Shunichi Kikuchi

IPC分类号： H04K1/00

CPC分类号： G07C9/00111

摘要： An article that is worn or carried by a living being includes an authentication key for identifying the living being or acquiring information about the living being. The authentication key is formed on a surface of the article by processing the article. An authenticating apparatus performs authentication whether an authority to make access to information is present, and includes an authentication key information reading unit and authenticating unit. The authentication key information reading unit reads authentication key information stored in the authentication key. The authenticating unit performs the authentication to check whether an authority to make access to the information about the living being is present based on the read authentication key information.

摘要翻译： 由生活穿着或携带的物品包括用于识别生活的认证密钥或获得有关生活的信息。 认证密钥通过处理物品形成在物品的表面上。 验证装置执行认证是否存在访问信息的权限，并且包括认证密钥信息读取单元和认证单元。 认证密钥信息读取单元读取认证密钥中存储的认证密钥信息。 认证单元基于读取的认证密钥信息来执行认证以检查是否存在访问有关生活的信息的权限。

公开(公告)号：US06891247B2

公开(公告)日：2005-05-10

申请号：US10177672

申请日：2002-06-24

申请人： Shunichi Kikuchi ,  Misao Umematsu

发明人： Shunichi Kikuchi ,  Misao Umematsu

IPC分类号： H01L23/48 ,  H01L23/50 ,  H01L23/64 ,  H01L29/00

CPC分类号： H01L23/642 ,  H01L23/481 ,  H01L23/50 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/17181 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/3011 ,  Y10S257/924 ,  H01L2924/00 ,  H01L2224/05599

摘要： A semiconductor device includes a semiconductor bare chip and an electrically-insulative board member with a thin-film structure capacitor. The semiconductor bare chip has a power supply terminal and a grounding terminal on the back surface thereof. The semiconductor bare chip is mounted on a circuit board by flip-chip bonding. The board member includes a board and a thin-film structure capacitor provided on the board. The capacitor has terminals corresponding to the power supply terminal and the grounding terminal of the semiconductor bare chip thereon. The side of the board member where the capacitor is provided is bonded to the back surface of the semiconductor bare chip. The terminals of the capacitor are electrically connected to the power supply terminal and the grounding terminal of the semiconductor bare chip.

摘要翻译： 半导体器件包括半导体裸芯片和具有薄膜结构电容器的电绝缘板部件。 半导体裸芯片的背面具有电源端子和接地端子。 半导体裸芯片通过倒装芯片接合安装在电路板上。 板构件包括板和设置在板上的薄膜结构电容器。 电容器具有对应于其上的半导体裸芯片的电源端子和接地端子的端子。 提供电容器的电路板部件的一侧与半导体裸芯片的背面接合。 电容器的端子电连接到半导体裸芯片的电源端子和接地端子。

公开(公告)号：US06465085B1

公开(公告)日：2002-10-15

申请号：US09699569

申请日：2000-10-31

申请人： Zhiyi Song ,  Kiyokazu Moriizumi ,  Takami Sasahara ,  Norikazu Ozaki ,  Manabu Watanabe ,  Misao Umematsu ,  Shunichi Kikuchi

发明人： Zhiyi Song ,  Kiyokazu Moriizumi ,  Takami Sasahara ,  Norikazu Ozaki ,  Manabu Watanabe ,  Misao Umematsu ,  Shunichi Kikuchi

IPC分类号： B32B300

CPC分类号： H05K3/4605 ,  H01L23/5383 ,  H01L23/5386 ,  H01L24/11 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15312 ,  H01L2924/15787 ,  H01L2924/16152 ,  H05K1/0306 ,  H05K3/225 ,  H05K3/243 ,  H05K3/388 ,  H05K3/4647 ,  H05K3/467 ,  H05K2201/09781 ,  H05K2203/025 ,  H05K2203/072 ,  H05K2203/0733 ,  Y10T428/24917 ,  Y10T428/24926 ,  H01L2924/00 ,  H01L2224/0401

摘要： A dummy pad is formed through a polyimide insulating layer so as to be provided opposite to a via connecting pad formed on the surface of a ceramic substrate. A defect occurring in the via connecting pad is filled with a protrusion when the dummy pad is formed. Accordingly, the influence of the defect upon a layer above the dummy pad is prevented. Further, in a method for manufacturing a thin film wiring board obtained by forming a thin film layer on a base substrate having a via that allows interlayer electric conduction, a void defect existing in the via is filled with a conductive material having corrosion resistance against an etchant, and then the thin film layer is formed on the base substrate.

摘要翻译： 通过聚酰亚胺绝缘层形成虚拟焊盘，以与形成在陶瓷基板的表面上的通孔连接焊盘相对设置。 当形成虚拟焊盘时，在通孔连接焊盘中出现的缺陷被填充有突起。 因此，防止缺陷对虚拟垫上方的层的影响。 此外，在通过在具有允许层间导电的通孔的基底基板上形成薄膜层而获得的薄膜布线基板的制造方法中，存在于通孔中的空隙缺陷填充有耐腐蚀性的导电材料 蚀刻剂，然后在基底基板上形成薄膜层。