Abstract:
A phase shifter includes a substrate; a signal line formed on a specific region in an upper surface of the substrate; and an air gap which is formed within the substrate and changes effective permittivity of the substrate to delay phase of a signal supplied to the signal line. The phase shifter delays a phase of a signal by controlling effective permittivity using an air gap, thereby having outstandingly low insertion loss as compared to existing phase shifters. Further, the phase shifter can be manufactured in a same length as a reference line so that the phase shifter can be in a compact size.
Abstract:
Provided is an H.264 Context Adaptive Variable Length Coding (CAVLC) decoding method based on an Application-Specific Instruction-set Processor (ASIP). The H.264 CAVLC decoding method includes determining a plurality of comparison bit strings on the basis of a table of a decoding coefficient, storing lengths of the comparison bit strings in a first register, storing code values of the comparison bit strings in a second register, comparing an input bit stream with the comparison bit strings based on the lengths and code values of the comparison bit strings, and determining value of the decoding coefficient according to a result of comparison between the input bit stream and the comparison bit strings. The method extracts a decoding coefficient using a register in an ASIP without accessing a memory and prevents a reduction in speed caused by memory access, thereby increasing the decoding speed of an H.264 decoder.
Abstract:
Disclosed is a high voltage generator comprising: a first voltage level detector for detecting a voltage level of the high voltage; a second voltage level detector for detecting difference between the high voltage and a power supply voltage; a high voltage pump for performing a pumping operation to generate a high voltage when one of output signals of the first voltage level detector and the second voltage level detector is enabled; and a controller for receiving the output signal of the second voltage level detector, and for connecting a terminal through which the high voltage is output with the power supply voltage when the high voltage is lower than the power supply voltage.
Abstract:
A power-up signal generator uses a deep power down power-up signal, which should be in a standby state in a deep power down entry, for an initialization of other semiconductor elements in a DRAM device that operates after an internal power supply voltage is generated. The generator also uses the power-up signal, which is disabled in the deep power down entry and enabled in a deep power down exit by the internal power supply voltage. The generator may include a power-up detector for generating a power-up detection signal, a deep power down power-up signal generator for generating a deep power down power-up signal, a power-up signal generator for generating a power-up signal and a power-up controller for determining whether or not to enable the power-up signal in the deep power down entry.
Abstract:
A circuit board configured to provide multiple interfaces is disclosed. The circuit board comprises a termination slot inserted with a termination module configured to modulate circuits by applying a termination resistance and a termination voltage. If the termination module is inserted into the termination slot, the circuit board operates as a series stub terminated transceiver logic (SSTL) interface. Otherwise, the board operates as a low voltage transistor logic (LVTTL) interface. Additionally, the board comprises a switch configured to selectively connect a termination resistance to a bus. If the switch connects the termination resistance to the bus, the board operates as an SSTL interface. Otherwise, the board operates as an LVTTL interface.
Abstract:
The present invention relates to an improved memory circuit with a divided bit-line, shared sense amplifier architecture. In a conventional divided bit-line, shared sense amplifier configuration, two adjacent memory sub-arrays are generally located between two banks of sense amplifiers and selected bit lines of the two adjacent memory sub-arrays are generally connected to metal lines with metal contacts to reduce capacitive loading. Under the present invention, some sense amplifiers from either banks of sense amplifiers are repositioned to the area between the two adjacent memory sub-arrays thereby permitting the repositioned sense amplifiers to be shared. As a result, any two adjacent memory sub-arrays share a bank of sense amplifiers. Furthermore, selected bit lines from the two adjacent memory sub-arrays are coupled to metal lines within the repositioned sense amplifiers. In addition, equilibration circuits are similarly relocated to the area between the two adjacent memory sub-arrays thereby permitting selected bit lines and metal lines to be precharged and equalized in a shorter period of time. By reducing the precharge time, faster memory access can be achieved.
Abstract:
Disclosed is a semiconductor package and a method for manufacturing the same. A planar or substantially planar die pad is disposed within a leadframe and is connected to the leadframe by a plurality of tie bars. An perimeter of an upper and lower surface of the die pad is half-etched to increase the moisture-permeation path of the finished package. A plurality of rectangular leads extends from the leadframe toward the die pad without contacting the die pad. A silver-plating layer may be formed on the upper surface of the leadframe. A semiconductor chip is mounted on the upper surface of the die pad in the leadframe. After deflashing, the package is treated with a sulfuric (H2SO4)-based solution to restore the internal leads to their original color. Prior to singulation, the externally exposed bottom surfaces of the leads are plated with copper, gold, solder, tin, nickel, palladium, or an alloy thereof to form a predetermined thickness of a plating layer. The singulation step comprises forming a burr at a peripheral side surface of the leads in the upward direction. The finished package may be marked with a recognition mark to enable a user to more easily identify the first lead.
Abstract:
The present invention relates to an improved memory circuit with a divided bit-line, shared sense amplifier architecture. In a conventional divided bit-line, shared sense amplifier configuration, two adjacent memory sub-arrays are generally located between two banks of sense amplifiers and selected bit lines of the two adjacent memory sub-arrays are generally connected to metal lines with metal contacts to reduce capacitive loading. Under the present invention, some sense amplifiers from either banks of sense amplifiers are repositioned to the area between the two adjacent memory sub-arrays thereby permitting the repositioned sense amplifiers to be shared. As a result, any two adjacent memory sub-arrays share a bank of sense amplifiers. Furthermore, selected bit lines from the two adjacent memory sub-arrays are coupled to metal lines within the repositioned sense amplifiers. In addition, equilibration circuits are similarly relocated to the area between the two adjacent memory sub-arrays thereby permitting selected bit lines and metal lines to be precharged and equalized in a shorter period of time. By reducing the precharge time, faster memory access can be achieved.
Abstract:
A stress test apparatus and method for a semiconductor memory device with a plurality of memory cell arrays. The stress test apparatus comprises a plurality of plate terminals connected to one another, each of the plate terminals being connected to a plurality of storage capacitors, first and second switching elements connected in common to the plate terminals, a plate voltage generator connected to the first switching element, a stress signal generator connected to the second switching element, and a switching control signal generator for generating a switching control signal to control the first and second switching elements. According to the present invention, a cell plate voltage is applied and varied to stress the storage capacitors without driving word lines. Therefore, the storage capacitor stressing operation is simply performed, the stress test time is reduced and the cost is cut down.
Abstract:
A pulse signal transfer unit employing post charge logic, comprising a buffering circuit for transferring data with a specified logic value through a data transfer line, a PMOS transistor for supplying a voltage from a voltage source to the data transfer line to initialize a signal on the data transfer line, and a feedback loop circuit for applying the signal on the data transfer line to the PMOS transistor for one of the first and second time periods in response to an external write drive signal to control the PMOS transistor, the second time period being longer than the first time period. According to the present invention, in the case of accessing read data with a relatively narrow pulse width and write data with a relatively wide pulse width, the pulse signal transfer unit initializes the read data at a relatively high speed and the write data at a relatively low speed to provide a signal with a wider pulse width. Therefore, the pulse signal transfer unit is capable of preventing the formation of a current path and enhancing the data processing speed.