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公开(公告)号：US20110068433A1
公开(公告)日：2011-03-24
申请号：US12566338
申请日：2009-09-24
申请人： Jonghae Kim , Brian M. Henderson , Matthew M. Nowak , Jiayu Xu
发明人： Jonghae Kim , Brian M. Henderson , Matthew M. Nowak , Jiayu Xu
CPC分类号： H01L23/552 , H01L23/645 , H01L2224/0401 , H01L2224/05567 , H01L2224/0557 , H01L2224/06181 , H01L2224/13025 , H01L2224/16 , H01L2224/16235 , H01L2224/16265 , H01L2224/17181 , H01L2924/01079 , H01L2924/09701 , H01L2924/10253 , H01L2924/1305 , H01L2924/13091 , H01L2924/15311 , H01L2924/19011 , H01L2924/19104 , H01L2924/3025 , H01L2924/00
摘要： Method of forming a radio frequency integrated circuit (RFIC) is provided. The RFIC comprises one or more electronic devices formed in a semiconductor substrate and one or more passive devices on a dielectric substrate, arranged in a stacking manner. Electrical shield structure is formed in between to shield electronic devices in the semiconductor substrate from the passive devices in the dielectric substrate. Vertical through-silicon-vias (TSVs) are formed to provide electrical connections between the passive devices in the dielectric substrate and the electronic devices in the semiconductor substrate.
摘要翻译： 提供了形成射频集成电路（RFIC）的方法。 RFIC包括形成在半导体衬底中的一个或多个电子器件和以堆叠方式布置的电介质衬底上的一个或多个无源器件。 在屏蔽结构之间形成有屏蔽半导体衬底中的电子器件与电介质衬底中的无源器件。 形成垂直通硅通孔（TSV）以提供电介质基板中的无源器件与半导体衬底中的电子器件之间的电连接。
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公开(公告)号：US07859825B2
公开(公告)日：2010-12-28
申请号：US12371756
申请日：2009-02-16
IPC分类号： H01G4/38 , H01G4/00 , H01L27/108 , H01L29/94
CPC分类号： H01L27/0811 , H01L23/5223 , H01L27/0688 , H01L27/0805 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： A capacitance circuit assembly mounted on a semiconductor chip, and methods for forming the same, are provided. A plurality of divergent capacitors is provided in a parallel circuit connection between first and second ports, the plurality providing at least one Metal Oxide Silicon Capacitor and at least one Vertical Native Capacitor or Metal-Insulator-Metal Capacitor. An assembly has a vertical orientation, a Metal Oxide Silicon capacitor located at the bottom and defining a footprint, with a middle Vertical Native Capacitor having a plurality of horizontal metal layers, including a plurality of parallel positive plates alternating with a plurality of parallel negative plates. In another aspect, vertically asymmetric orientations provide a reduced total parasitic capacitance.
摘要翻译： 设置安装在半导体芯片上的电容电路组件及其形成方法。 多个发散电容器设置在第一和第二端口之间的并联电路连接中，多个提供至少一个金属氧化物硅电容器和至少一个垂直本机电容器或金属绝缘体金属电容器。 组件具有垂直取向，金属氧化物硅电容器位于底部并限定占地面积，中间垂直本机电容器具有多个水平金属层，包括多个平行的正极板，与多个平行的负极板交替 。 在另一方面，垂直不对称取向提供减小的总寄生电容。
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公开(公告)号：US20100297825A1
公开(公告)日：2010-11-25
申请号：US12849086
申请日：2010-08-03
申请人： Anil K. Chinthakindi , Douglas D. Coolbaugh , Ebenezer E. Eshun , Zhong-Xiang He , Jeffrey B. Johnson , Jonghae Kim , Jean-Olivier Plouchart , Anthony K. Stamper
发明人： Anil K. Chinthakindi , Douglas D. Coolbaugh , Ebenezer E. Eshun , Zhong-Xiang He , Jeffrey B. Johnson , Jonghae Kim , Jean-Olivier Plouchart , Anthony K. Stamper
IPC分类号： H01L21/02
CPC分类号： H01L23/5228 , H01L23/5227 , H01L28/87 , H01L2924/0002 , H01L2924/00
摘要： Passive components are formed in the back end by using the same deposition process and materials as in the rest of the back end. Resistors are formed by connecting in series individual structures on the nth, (n+1)th, etc levels of the back end. Capacitors are formed by constructing a set of vertical capacitor plates from a plurality of levels in the back end, the plates being formed by connecting electrodes on two or more levels of the back end by vertical connection members.
摘要翻译： 通过使用与后端的其余部分相同的沉积工艺和材料在后端形成被动部件。 电阻器通过连接在后端的第n（n + 1）等级上的串联单独结构而形成。 电容器通过从后端的多个层构造一组垂直电容器板而形成，该板通过垂直连接构件在后端的两层或更多层上连接电极而形成。
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公开(公告)号：US20100295156A1
公开(公告)日：2010-11-25
申请号：US12851814
申请日：2010-08-06
IPC分类号： H01L29/92
CPC分类号： H01L29/94 , H01L23/5223 , H01L27/0805 , H01L2924/0002 , H01L2924/00
摘要： Capacitance circuits are provided disposing a lower vertical-native capacitor metal layer above a planar front-end-of-line semiconductor base substrate, planar metal bottom plates spaced a bottom plate distance from the base and top plates above the bottom plates spaced a top plate distance from the base defining metal-insulator-metal capacitors, top plate footprints disposed above the base substrate smaller than bottom plate footprints and exposing bottom plate remainder upper lateral connector surfaces; disposing parallel positive port and negative port upper vertical-native capacitor metal layers over and each connected to top plate and bottom plate upper remainder lateral connector surface. Moreover, electrical connecting of the first top plate and the second bottom plate to the positive port metal layer and of the second top plate and the first bottom to the negative port metal layer impart equal total negative port and positive port metal-insulator-metal capacitor extrinsic capacitance.
摘要翻译： 提供电容电路，其设置在平面前端半导体基底基板上方的下垂直电容器金属层，与底板间隔开的底板距离的平面金属底板和位于底板上方的顶板，间隔开顶板 距离限定金属 - 绝缘体 - 金属电容器的基底的距离，设置在基底基板之上的顶板印迹小于底板印迹并且暴露底板剩余的上横向连接器表面; 将平行的正端口和负端口上垂直电容器金属层布置在每个顶板和底板的上部剩余侧面连接器表面上。 此外，第一顶板和第二底板与正端口金属层以及第二顶板和第一底部到负极金属层的电连接赋予相等的总负端口和正端口金属 - 绝缘体 - 金属电容器 外在电容。
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公开(公告)号：US07838384B2
公开(公告)日：2010-11-23
申请号：US11970665
申请日：2008-01-08
IPC分类号： H01L21/20
CPC分类号： H01L29/94 , H01L23/5223 , H01L27/0805 , H01L2924/0002 , H01L2924/00
摘要： Methods, articles and design structures for capacitance circuits are provided disposing a lower vertical-native capacitor metal layer above a planar front-end-of-line semiconductor base substrate, planar metal bottom plates spaced a bottom plate distance from the base and top plates above the bottom plates spaced a top plate distance from the base defining metal-insulator-metal capacitors, top plate footprints disposed above the base substrate smaller than bottom plate footprints and exposing bottom plate remainder upper lateral connector surfaces; disposing parallel positive port and negative port upper vertical-native capacitor metal layers over and each connected to top plate and bottom plate upper remainder lateral connector surface. Moreover, electrical connecting of the first top plate and the second bottom plate to the positive port metal layer and of the second top plate and the first bottom to the negative port metal layer impart equal total negative port and positive port metal-insulator-metal capacitor extrinsic capacitance.
摘要翻译： 提供了用于电容电路的方法，制品和设计结构，其在平面前端半导体基底基板上方设置较低的垂直电容器金属层，平板金属底板与底座和顶板间隔开底板 底板与限定金属 - 绝缘体 - 金属电容器的基板间隔开顶板距离，顶板脚印设置在基底基板之上，小于底板印迹，并露出底板剩余的上横向连接器表面; 将平行的正端口和负端口上垂直电容器金属层布置在每个顶板和底板的上部剩余侧面连接器表面上。 此外，第一顶板和第二底板与正端口金属层以及第二顶板和第一底部到负极金属层的电连接赋予相等的总负端口和正端口金属 - 绝缘体 - 金属电容器 外在电容。
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公开(公告)号：US20090132082A1
公开(公告)日：2009-05-21
申请号：US12362877
申请日：2009-01-30
申请人： Choongyeun Cho , Daeik Kim , Jonghae Kim , Moon J. Kim , Jean-Olivier Plouchart , Robert E. Trzcinski
发明人： Choongyeun Cho , Daeik Kim , Jonghae Kim , Moon J. Kim , Jean-Olivier Plouchart , Robert E. Trzcinski
CPC分类号： H01L28/10 , H01F17/0013 , H01F2017/0073 , H01L23/5227 , H01L27/0203 , H01L2924/0002 , H01L2924/00
摘要： Sub-100 nanometer semiconductor devices and methods and program products for manufacturing devices are provided, in particular inductors comprising a plurality of spaced parallel metal lines disposed on a dielectric surface and each having width, heights, spacing and cross-sectional areas determined as a function of Design Rule Check rules. For one planarization process rule a metal density ratio of 80% metal to 20% dielectric surface is determined and produced. In one example a sum of metal line spacing gaps is less than a sum of metal line interior sidewall heights. In one aspect at least one of line height, width and line spacing dimensions is selected to optimize one or more chip yield, chip performance, chip manufacturability and inductor Q factor parameters.
摘要翻译： 提供了用于制造器件的亚100纳米半导体器件和方法和程序产品，特别是电感器，其包括设置在电介质表面上的多个间隔开的平行金属线，并且每个具有确定为功能的宽度，高度，间隔和横截面面积 的设计规则检查规则。 对于一个平面化工艺规则，确定并生产了80％金属至20％电介质表面的金属密度比。 在一个示例中，金属线间距的总和小于金属线内侧壁高度的总和。 在一个方面，选择线高度，宽度和线间距尺寸中的至少一个以优化一个或多个芯片产量，芯片性能，芯片制造性和电感器Q因子参数。
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公开(公告)号：US20080136697A1
公开(公告)日：2008-06-12
申请号：US11608264
申请日：2006-12-08
申请人： Choongyeun Cho , Dae Ik Kim , Jonghae Kim , Moon J. Kim
发明人： Choongyeun Cho , Dae Ik Kim , Jonghae Kim , Moon J. Kim
IPC分类号： G06F7/58
CPC分类号： G06F7/588
摘要： In a random number generator, a first converter converts a first analog noise signal into a random digital clock signal and a second converter samples a second analog noise signal asynchronous to the first analog noise signal in response to the random digital clock signal and generates a random digital number stream. In one aspect, a random number generator output block samples the second converter random digital number stream in response to the random digital clock signal and generates a random number generator block output. In another aspect a pseudo noise source state machine generates the random digital clock signal in response to a first seed generated from the first analog noise signal, a second seed from process variation digital amplifier, and a past machine state.
摘要翻译： 在随机数发生器中，第一转换器将第一模拟噪声信号转换成随机数字时钟信号，并且第二转换器响应于随机数字时钟信号对与第一模拟噪声信号异步的第二模拟噪声信号进行采样，并产生随机数 数字数字流。 一方面，随机数发生器输出块响应于随机数字时钟信号对第二转换器随机数字数字流进行采样，并产生随机数发生器块输出。 在另一方面，伪噪声源状态机响应于从第一模拟噪声信号产生的第一种子，来自过程变化数字放大器的第二种子和过去的机器状态，产生随机数字时钟信号。
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公开(公告)号：US20080109770A1
公开(公告)日：2008-05-08
申请号：US11550818
申请日：2006-10-19
IPC分类号： G06F17/50
CPC分类号： G06F17/5068 , G06F17/5036
摘要： A fast FET and a method and system for designing the fast FET. The method includes: selecting a reference design for a field effect transistor, the field effect transistor including a source, a drain, a channel between the source and drain, a gate electrode over the channel, at least one source contact to the source and at least one contact to the drain, the at least one source contact spaced a first distance from the gate electrode and the at least one drain contact spaced a second distance from the gate electrode; and adjusting the first distance and the second distance to maximize a performance parameter of the field effect transistor to create a fast design for the field effect transistor.
摘要翻译： 一种快速FET，以及用于设计快速FET的方法和系统。 该方法包括：选择场效应晶体管的参考设计，场效应晶体管包括源极，漏极，源极和漏极之间的沟道，沟道上的栅电极，至少一个源极和源极 所述至少一个源极接触件与所述栅电极隔开第一距离，所述至少一个漏极接触件与所述栅电极间隔开第二距离; 并且调整第一距离和第二距离以最大化场效应晶体管的性能参数以产生用于场效应晶体管的快速设计。
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公开(公告)号：US20080079114A1
公开(公告)日：2008-04-03
申请号：US11536896
申请日：2006-09-29
申请人： Choongyeun Cho , Daeik Kim , Jonghae Kim , Moon J. Kim , Jean-Olivier Plouchart , Robert E. Trzcinski
发明人： Choongyeun Cho , Daeik Kim , Jonghae Kim , Moon J. Kim , Jean-Olivier Plouchart , Robert E. Trzcinski
IPC分类号： H01L29/00
CPC分类号： H01L28/10 , H01F17/0013 , H01F2017/0073 , H01L23/5227 , H01L27/0203 , H01L2924/0002 , H01L2924/00
摘要： Sub-100 nanometer semiconductor devices and methods and program products for manufacturing devices are provided, in particular inductors comprising a plurality of spaced parallel metal lines disposed on a dielectric surface and each having width, heights, spacing and cross-sectional areas determined as a function of Design Rule Check rules. For one planarization process rule a metal density ratio of 80% metal to 20% dielectric surface is determined and produced. In one example a sum of metal line spacing gaps is less than a sum of metal line interior sidewall heights. In one aspect at least one of line height, width and line spacing dimensions is selected to optimize one or more chip yield, chip performance, chip manufacturability and inductor Q factor parameters.
摘要翻译： 提供了用于制造器件的亚100纳米半导体器件和方法和程序产品，特别是电感器，其包括设置在电介质表面上的多个间隔开的平行金属线，并且每个具有确定为功能的宽度，高度，间隔和横截面面积 的设计规则检查规则。 对于一个平面化工艺规则，确定并生产了80％金属至20％电介质表面的金属密度比。 在一个示例中，金属线间距的总和小于金属线内侧壁高度的总和。 在一个方面，选择线高度，宽度和线间距尺寸中的至少一个以优化一个或多个芯片产量，芯片性能，芯片制造性和电感器Q因子参数。
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公开(公告)号：US09008602B2
公开(公告)日：2015-04-14
申请号：US13464092
申请日：2012-05-04
申请人： Chengjie Zuo , Changhan Yun , Chi Shun Lo , Mario F. Velez , Jonghae Kim
发明人： Chengjie Zuo , Changhan Yun , Chi Shun Lo , Mario F. Velez , Jonghae Kim
CPC分类号： H04B7/0805 , H04B1/005 , H04B1/16 , H04B1/18 , H04B7/0825
摘要： A diversity receiver switch includes at least one second stage switch configured to communicate with a transceiver. The diversity receiver switch may also include at least one first stage switch coupled between a diversity receiver antenna and the second stage switch(es). The first stage switch(es) may be configured to handle a different amount of power than the second stage switch(es). The diversity receiver switch may include a bank of second stage switches configured to communicate with a transceiver. A first stage switch may be configured to handle more power than each switch in the bank of second stage switches. Alternatively, the diversity receiver switch include a bank of first stage switches coupled between the diversity receiver antenna and a second stage switch. The second stage switch may be configured to handle more power than each of the first stage switches.
摘要翻译： 分集接收机交换机包括被配置为与收发机通信的至少一个第二级交换机。 分集接收机交换机还可以包括耦合在分集接收机天线和第二级交换机之间的至少一个第一级交换机。 第一级开关可以被配置为处理与第二级开关不同的功率量。 分集接收器开关可以包括被配置为与收发器通信的一组第二级交换机。 第一级开关可以被配置为处理比第二级开关组中的每个开关更多的功率。 或者，分集接收器开关包括耦合在分集接收器天线和第二级开关之间的一组第一级开关。 第二级开关可以被配置为处理比每个第一级开关更多的功率。
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