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55 条记录 (耗时 0.022 秒)

    Apparatus and method for determining residual stress
    41.
    发明授权
    Apparatus and method for determining residual stress 失效
    用于确定残余应力的装置和方法

    公开(公告)号：US06568250B1

    公开(公告)日：2003-05-27

    申请号：US09668781

    申请日：2000-09-22

    申请人： Arvind K. Sinha

    发明人： Arvind K. Sinha

    IPC分类号： G01N348

    CPC分类号： G01N3/44 ,  G01N2203/0069 ,  G01N2203/008 ,  G01N2203/0082 ,  G01N2203/0098 ,  G01N2203/0682

    摘要： An apparatus measures residual stress in a sample under test by measuring the penetration of an indenter on a unprocessed sample under test, and after processing of the sample under test, measuring again the penetration of the indenter on the processed sample under test, and deriving from the two penetration measurements the residual stress in a sample under test. The apparatus and method of the preferred embodiments are especially useful in determining residual stress in a printed wiring board. In this manner a direct measurement of residual stress is possible without destroying the printed wiring board.

    摘要翻译： 一种装置通过测量待测试的未加工样品上的压头的穿透度来测量待测试样品中的残余应力，并且在测试样品处理之后，再次测量压头在被测试样品上的渗透性，并从 两次穿透测量被测样品中的残余应力。 优选实施例的装置和方法在确定印刷线路板中的残余应力方面特别有用。 以这种方式，可以在不破坏印刷线路板的情况下直接测量残余应力。

    Duplex flexible heat exchanger
    42.
    发明授权
    Duplex flexible heat exchanger 有权
    双相柔性换热器

    公开(公告)号：US09170056B2

    公开(公告)日：2015-10-27

    申请号：US12959477

    申请日：2010-12-03

    申请人： Maurice F. Holahan ,  Eric V. Kline ,  Paul N. Krystek ,  Michael R. Rasmussen ,  Arvind K. Sinha ,  Stephen M. Zins

    发明人： Maurice F. Holahan ,  Eric V. Kline ,  Paul N. Krystek ,  Michael R. Rasmussen ,  Arvind K. Sinha ,  Stephen M. Zins

    IPC分类号： F04D13/02 ,  F04D13/04 ,  H05K7/20 ,  F28D15/00 ,  F04D29/58 ,  H01L23/473

    CPC分类号： F28D15/00 ,  F04D13/024 ,  F04D29/586 ,  F28F2250/08 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A method and system for cooling an electrical heat source is disclosed. A heat exchanger has two principal sub-assemblies. A closed-loop fluid flow is provided through a second sub-assembly, disposed next to a heat source. An open-loop fluid flow is provided though a first sub-assembly in communication with a second sub-assembly. Each of the first and second sub-assemblies has a rotational element. The fluid flow entering the first sub-assembly rotates the first rotational element, and magnetic communication between the rotational elements causes movement of the second rotational element, thereby achieving fluid movement within the second sub-assembly. Operationally, the closed-loop sub-assembly removes heat from the heat source and transfers it to the open-loop sub-assembly for subsequent heat transfer in a downstream fluid flow.

    摘要翻译： 公开了一种用于冷却电热源的方法和系统。 热交换器具有两个主要子组件。 通过设置在热源旁边的第二子组件提供闭环流体流。 通过与第二子组件连通的第一子组件提供开环流体流。 第一和第二子组件中的每一个具有旋转元件。 进入第一子组件的流体流使第一旋转元件旋转，并且旋转元件之间的磁连通引起第二旋转元件的移动，从而实现第二子组件内的流体运动。 操作上，闭环子组件从热源移除热量并将其传送到开环子组件，以便在下游流体流中进行随后的热传递。

    Plug and receptacle arrangement with connection sensor
    43.
    发明授权
    Plug and receptacle arrangement with connection sensor 失效
    插头和插座安装与连接传感器

    公开(公告)号：US08550840B2

    公开(公告)日：2013-10-08

    申请号：US13297659

    申请日：2011-11-16

    申请人： Phillip V. Mann ,  Mark D. Plucinski ,  Sandra J. Shirk/Heath ,  Arvind K. Sinha

    发明人： Phillip V. Mann ,  Mark D. Plucinski ,  Sandra J. Shirk/Heath ,  Arvind K. Sinha

    IPC分类号： H01R3/00

    CPC分类号： H01R13/03 ,  H01R13/7031

    摘要： An electrical connector monitoring system for a plug and receptacle assembly, that includes a plug connected to the plug assembly, a recess located within the plug, an electrically insulative layer disposed in the recess, a wear member disposed on the plug that at least partially traverses the insulated recess and in electrical contact with the plug, a contact member movably connected with a receptacle of the receptacle, and a signal device in electrical connection through a circuit with the plug, wear member, and contact member when the plug is fully seated within the receptacle.

    摘要翻译： 一种用于插头和插座组件的电连接器监视系统，其包括连接到插头组件的插头，位于插头内的凹部，设置在凹部中的电绝缘层，设置在插头上的耐磨构件，该耐磨构件至少部分地穿过 所述绝缘凹槽与所述插塞电接触，所述接触构件与所述插座的插座可移动地连接，以及当所述插头完全安置在内部时，通过电路与插头，耐磨构件和接触构件电连接的信号装置 容器

    METHOD AND SYSTEM FOR ALIGNMENT OF GRAPHITE NANOFIBERS FOR ENHANCED THERMAL INTERFACE MATERIAL PERFORMANCE
    44.
    发明申请
    METHOD AND SYSTEM FOR ALIGNMENT OF GRAPHITE NANOFIBERS FOR ENHANCED THERMAL INTERFACE MATERIAL PERFORMANCE 有权
    石墨纳米纤维对准加强热界面材料性能的方法和系统

    公开(公告)号：US20120018666A1

    公开(公告)日：2012-01-26

    申请号：US12842200

    申请日：2010-07-23

    申请人： Joseph Kuczynski ,  Arvind K. Sinha ,  Kevin A. Splittstoesser ,  Timothy J. Tofil

    发明人： Joseph Kuczynski ,  Arvind K. Sinha ,  Kevin A. Splittstoesser ,  Timothy J. Tofil

    IPC分类号： B29C39/42 ,  C09K5/14

    CPC分类号： B82Y40/00 ,  B82Y30/00 ,  C01B32/15 ,  C01B32/20 ,  H01L23/373 ,  H01L23/3733 ,  H01L2924/0002 ,  H01L2924/00

    摘要： The exemplary embodiments of the present invention provide a method and system for aligning graphite nanofibers in a thermal interface material to enhance the thermal interface material performance. The method includes preparing the graphite nanofibers in a herringbone configuration, and dispersing the graphite nanofibers in the herringbone configuration into the thermal interface material. The method further includes applying a magnetic field of sufficient intensity to align the graphite nanofibers in the thermal interface material. The system includes the graphite nanofibers configured in a herringbone configuration and a means for dispersing the graphite nanofibers in the herringbone configuration into the thermal interface material. The system further includes a means for applying a magnetic field of sufficient intensity to align the graphite nanofibers in the thermal interface material.

    摘要翻译： 本发明的示例性实施例提供了一种用于在石墨纳米纤维中对准热界面材料以提高热界面材料性能的方法和系统。 该方法包括以人字形配置制备石墨纳米纤维，并将石英纳米纤维以人字形构型分散到热界面材料中。 该方法还包括施加足够强度的磁场以使石墨纳米纤维在热界面材料中对准。 该系统包括以人字形配置的石墨纳米纤维和用于将人字形配置中的石墨纳米纤维分散到热界面材料中的装置。 该系统还包括用于施加足够强度的磁场以对准热界面材料中的石墨纳米纤维的装置。

    REWORK PROCESS AND METHOD FOR LEAD-FREE CAPPED MULTI-CORE MODULES WITH ORGANIC SUBSTRATES
    46.
    发明申请
    REWORK PROCESS AND METHOD FOR LEAD-FREE CAPPED MULTI-CORE MODULES WITH ORGANIC SUBSTRATES 审中-公开
    具有有机基板的无铅封装多核模块的研究工艺和方法

    公开(公告)号：US20080265402A1

    公开(公告)日：2008-10-30

    申请号：US11741840

    申请日：2007-04-30

    申请人： Arvind K. Sinha

    发明人： Arvind K. Sinha

    IPC分类号： H01L23/10 ,  H01L21/54

    CPC分类号： H01L23/10 ,  H01L21/56 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A system and method for utilizing lead-free multi-core modules with organic substrates,including a base portion configured to attach a semiconductor chip;and a cap portion further comprising: a bottom portion configured to be sealed to the base portion;and a vacuum port;wherein when a vacuum is drawn at the vacuum port,a re-workable seal between the base portion and the cap portion is provided to enable rework.

    摘要翻译： 一种用于利用有机衬底的无铅多芯模块的系统和方法，包括配置成附接半导体芯片的基座部分;以及帽部分，还包括：底部，被配置为密封到所述基座部分;以及真空 端口;其中当在所述真空端口处抽真空时，提供所述基座部分和所述盖部分之间的可重新加工的密封以实现返工。

    Method and system for measuring anisotropic material properties
    48.
    发明授权
    Method and system for measuring anisotropic material properties 有权
    测量各向异性材料性能的方法和系统

    公开(公告)号：US06427536B1

    公开(公告)日：2002-08-06

    申请号：US09459810

    申请日：1999-12-13

    申请人： Arvind K. Sinha

    发明人： Arvind K. Sinha

    IPC分类号： G01N2904

    CPC分类号： G01N29/38 ,  G01N29/07 ,  G01N29/46 ,  G01N2291/015 ,  G01N2291/0231 ,  G01N2291/102

    摘要： A method and system for determining material properties of a cross-section of an anisotropic sample material. An ultrasonic signal is applied to the surface of the anisotropic sample material, which comprises multiple constituent material layers, such that a characteristic medium wave is induced within each of the constituent materials. Each of these characteristic medium waves is sampled over a time interval to obtain a test waveform. This resultant test waveform is then spectrum analyzed utilizing cepstrum noise filtration, such that the material properties of said anisotropic sample material may be determined.

    摘要翻译： 用于确定各向异性样品材料的横截面的材料性质的方法和系统。 超声波信号被施加到包含多个构成材料层的各向异性样品材料的表面，使得在每个构成材料内诱发特征介质波。 每个这些特征的中波在时间间隔内进行采样以获得测试波形。 然后使用倒谱噪声过滤对所得到的测试波形进行频谱分析，从而可以确定所述各向异性样品材料的材料性质。

    Implementing enhanced thermal conductivity in stacked modules
    50.
    发明授权
    Implementing enhanced thermal conductivity in stacked modules 失效
    在堆叠模块中实现增强的导热性

    公开(公告)号：US08779585B2

    公开(公告)日：2014-07-15

    申请号：US13198895

    申请日：2011-08-05

    申请人： Kevin M. O'Connell ,  Arvind K. Sinha ,  Kory W. Weckman, II

    发明人： Kevin M. O'Connell ,  Arvind K. Sinha ,  Kory W. Weckman, II

    IPC分类号： H01L23/12 ,  H01L21/44

    CPC分类号： H01L23/10 ,  H01L23/36 ,  H01L25/0657 ,  H01L2225/06589 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A method and structures are provided for implementing enhanced thermal conductivity between a lid and heat sink for stacked modules. A chip lid and lateral heat distributor includes cooperating features for implementing enhanced thermal conductivity. The chip lid includes a groove along an inner side wall including a flat wall surface and a curved edge surface. The lateral heat distributor includes a mating edge portion received within the groove. The mating edge portion includes a bent arm for engaging the curved edge surface groove and a flat portion. The lateral heat distributor is assembled into place with the chip lid, the mating edge portion of the lateral heat distributor bends and snaps into the groove of the chip lid. The bent arm portion presses on the curved surface of the groove, and provides an upward force to push the flat portion against the flat wall surface of the groove.

    摘要翻译： 提供了一种方法和结构，用于在堆叠模块的盖和散热器之间实现增强的导热性。 芯片盖和侧向热分布器包括用于实现增强导热性的协同特征。 芯片盖包括沿着包括平坦壁表面和弯曲边缘表面的内侧壁的凹槽。 横向热分布器包括容纳在槽内的配合边缘部分。 配合边缘部分包括用于接合弯曲边缘表面槽的弯曲臂和平坦部分。 横向热分布器与芯片盖组装就位，侧向热分布器的配合边缘部分弯曲并卡入芯片盖的凹槽中。 弯曲的臂部分压在槽的弯曲表面上，并提供向上的力以将平坦部分推靠在槽的平坦壁表面上。