公开(公告)号：US20050225346A1

公开(公告)日：2005-10-13

申请号：US11148386

申请日：2005-06-09

申请人： Noboru Saito ,  Hiroyuki Takahashi ,  Noriyuki Igarashi ,  Keiichi Fukumoto ,  Hiroto Nakamura ,  Yutaka Watanabe ,  Kenichi Shimada

发明人： Noboru Saito ,  Hiroyuki Takahashi ,  Noriyuki Igarashi ,  Keiichi Fukumoto ,  Hiroto Nakamura ,  Yutaka Watanabe ,  Kenichi Shimada

IPC分类号： G01R31/26 ,  G01R1/04 ,  G01R31/00 ,  G01R31/01 ,  G01R31/02 ,  G01R31/28 ,  G01R31/303

CPC分类号： G01R31/01 ,  G01R1/0458 ,  G01R31/2806 ,  G01R31/2862 ,  G01R31/2863 ,  G01R31/2868 ,  G01R31/2877

摘要： A device testing apparatus including a connection terminal to which an electronic device under test is detachably attached, a pusher for pushing the electronic device in the direction of the connection terminal so as to connect the electronic device to the connection terminal, and a cooling unit for cooling the electronic device. As the cooling unit, an element cooling the device using electricity is for example used. The cooling unit includes a cooling medium blower for blowing a cooling medium around the electronic device and heat exchange projections or depressions for raising the cooling efficiency by blowing a cooling medium. In the device testing apparatus, even if the electronic device generates heat on its own during testing, the electronic device is cooled through the pusher, connection terminals, or socket, so the effect of the heat generated by the electronic device is canceled out and the electronic device can be tested at the predetermined temperature as prescribed in the specification.

摘要翻译： 一种装置测试装置，包括可拆卸地安装有被测试的电子设备的连接端子，用于沿着连接端子的方向推动电子设备以将电子设备连接到连接端子的推动器，以及用于 冷却电子设备。 作为冷却单元，例如使用电力冷却装置的元件。 冷却单元包括用于吹送电子设备周围的冷却介质的冷却介质鼓风机和通过吹送冷却介质而提高冷却效率的热交换突起或凹部。 在设备测试装置中，即使电子设备在测试期间自身产生热量，电子设备通过推动器，连接端子或插座被冷却，因此电子设备产生的热量的影响被消除，并且 电子设备可以按照说明书中规定的预定温度进行测试。

公开(公告)号：US06932635B2

公开(公告)日：2005-08-23

申请号：US10455800

申请日：2003-06-06

申请人： Takaji Ishikawa ,  Hiroto Nakamura

发明人： Takaji Ishikawa ,  Hiroto Nakamura

IPC分类号： G01R31/26 ,  G01R1/04 ,  G01R1/06 ,  G01R1/073 ,  G01R31/01 ,  G01R31/28 ,  H01R33/76 ,  H01R4/60

CPC分类号： G01R31/2863 ,  G01R1/0408 ,  G01R1/0458 ,  G01R31/01

摘要： To control the temperature of an electronic component testing socket without mixing any noise into a test signal to be applied to an electronic component and a respond signal to be read from the electronic component when conducting a test on the electronic component, a first space 67 in the electronic component testing socket base 6 and a socket body inside space 75 in the electronic component testing socket 7 are connected via a gas outlet 65 and a gas inlet 76, and a second space 68 in the electronic component testing socket base 6 and a socket body inside space 75 in the electronic component testing socket 7 are connected via a gas inlet 66 and a gas outlet 77.

摘要翻译： 为了控制电子部件测试插座的温度，在对电子部件进行测试时，不会将任何噪声混入到要应用于电子部件的测试信号和从电子部件读取的响应信号，第一空间67 电子部件测试用插座基座6和电子部件测试用插座7内的空间75内的插座主体经由气体出口65和气体导入口76连接，电子部件测试用插座基座6的第二空间68与插座 电子部件测试插座7中的主体内部空间75经由气体入口66和气体出口77连接。

公开(公告)号：US06919734B2

公开(公告)日：2005-07-19

申请号：US10716613

申请日：2003-11-20

申请人： Noboru Saito ,  Hiroyuki Takahashi ,  Noriyuki Igarashi ,  Keiichi Fukumoto ,  Hiroto Nakamura ,  Yutaka Watanabe ,  Kenichi Shimada

发明人： Noboru Saito ,  Hiroyuki Takahashi ,  Noriyuki Igarashi ,  Keiichi Fukumoto ,  Hiroto Nakamura ,  Yutaka Watanabe ,  Kenichi Shimada

IPC分类号： G01R31/26 ,  G01R1/04 ,  G01R31/00 ,  G01R31/01 ,  G01R31/02 ,  G01R31/28 ,  G01R31/303

CPC分类号： G01R31/01 ,  G01R1/0458 ,  G01R31/2806 ,  G01R31/2862 ,  G01R31/2863 ,  G01R31/2868 ,  G01R31/2877

摘要： A device testing apparatus including a connection terminal to which an electronic device under test is detachably attached, a pusher for pushing the electronic device in the direction of the connection terminal so as to connect the electronic device to the connection terminal, and a cooling unit for cooling the electronic device. As the cooling unit, an element cooling the device using electricity is for example used. The cooling unit includes a cooling medium blower for blowing a cooling medium around the electronic device and heat exchange projections or depressions for raising the cooling efficiency by blowing a cooling medium. In the device testing apparatus, even if the electronic device generates heat on its own during testing, the electronic device is cooled through the pusher, connection terminals, or socket, so the effect of the heat generated by the electronic device is canceled out and the electronic device can be tested at the predetermined temperature as prescribed in the specification.

公开(公告)号：US06384593B1

公开(公告)日：2002-05-07

申请号：US09596062

申请日：2000-06-16

申请人： Yoshihito Kobayashi ,  Tsuyoshi Yamashita ,  Hiroto Nakamura ,  Shin Nemoto ,  Yoshiyuki Masuo ,  Akihiko Ito

发明人： Yoshihito Kobayashi ,  Tsuyoshi Yamashita ,  Hiroto Nakamura ,  Shin Nemoto ,  Yoshiyuki Masuo ,  Akihiko Ito

IPC分类号： G01R3128

CPC分类号： G01R31/2868

摘要： A semiconductor device testing apparatus having a reduced transverse width and compact in size is provided. Adjacent to a constant temperature chamber containing therein a vertical transport means is located a test chamber which is in turn adjoined by a temperature-stress removing chamber likewise containing therein a vertical transport means, so that the constant temperature chamber and the test chamber are arranged transversely in a line, while the temperature-stress removing chamber is located in front of the test chamber when viewed in front view of the apparatus. Further, a loader section is located in front of the constant temperature chamber, and an unloader section is located above the temperature-stress removing chamber. With this arrangement, the transverse width of the testing apparatus may be reduced to about two test tray lengths.

摘要翻译： 提供了具有减小的横向宽度并且尺寸紧凑的半导体器件测试装置。 在其中容纳有垂直输送装置的恒温室附近设有试验室，该试验室又由同样含有垂直输送装置的温度应力消除室邻接，使得恒温室和试验室横向布置 在该装置的正视图中观察时，温度应力消除室位于测试室的前方。 此外，装载部位于恒温室前方，卸载部位于温度应力消除室的上方。 通过这种布置，测试装置的横向宽度可以减小到大约两个测试托盘长度。

公开(公告)号：US06248967B1

公开(公告)日：2001-06-19

申请号：US09290400

申请日：1999-04-13

申请人： Hiroto Nakamura

发明人： Hiroto Nakamura

IPC分类号： B07C5344

CPC分类号： H01L21/67236 ,  G01R31/01 ,  G01R31/2851 ,  G01R31/2893 ,  H01L21/67333 ,  H01L21/67778 ,  Y10S209/909 ,  Y10S414/14

摘要： A tray transfer arm 205 for transferring one or more customer trays KST which hold semiconductor devices IC, comprises a pair of tray holders 205a, 205b which are provided substantially in the upper and lower direction.

摘要翻译： 用于传送一个或多个保持半导体器件IC的客户托盘KST的托盘传送臂205包括基本上设置在上下方向上的一对托盘保持件205a，205b。

公开(公告)号：US6114411A

公开(公告)日：2000-09-05

申请号：US726660

申请日：1996-10-07

申请人： Hiroto Nakamura ,  Michinari Tsukahara ,  Hideo Yamazaki ,  Hidehiko Komatsu ,  Yoshiyuki Ozawa ,  Kazutoshi Fujisawa ,  Kenichi Kanbayashi

发明人： Hiroto Nakamura ,  Michinari Tsukahara ,  Hideo Yamazaki ,  Hidehiko Komatsu ,  Yoshiyuki Ozawa ,  Kazutoshi Fujisawa ,  Kenichi Kanbayashi

IPC分类号： B41J2/045 ,  C09D11/00 ,  C09D5/00

CPC分类号： C09D11/322

摘要： An ink composition for ink jet recording is described comprising a pigment, a resin dispersant, a thermoplastic resin emulsion and water, wherein the weight ratio of the pigment to the resin dispersant is from 20:1 to 5:2. The foregoing ink composition is little susceptible to irregular bleeding on a recording medium, undergoes no change in physical properties and jettability and no precipitation of solid matter and exhibits an excellent redispersibility.

摘要翻译： 本发明描述了一种用于喷墨记录的油墨组合物，其包含颜料，树脂分散剂，热塑性树脂乳液和水，其中颜料与树脂分散剂的重量比为20:1至5:2。 上述油墨组合物几乎不易受记录介质上的不规则渗色的影响，物理性能和可喷射性没有变化，并且固体物质不析出，并表现出优异的再分散性。

公开(公告)号：US6075216A

公开(公告)日：2000-06-13

申请号：US888745

申请日：1997-07-07

申请人： Hiroto Nakamura ,  Yoshihito Kobayashi ,  Katsuhiko Suzuki

发明人： Hiroto Nakamura ,  Yoshihito Kobayashi ,  Katsuhiko Suzuki

IPC分类号： G01R31/01 ,  H01L21/00 ,  H05K13/02 ,  H05K13/08 ,  B07C5/344

CPC分类号： H01L21/67271 ,  G01R31/2893 ,  H05K13/022 ,  H05K13/08 ,  G01R31/01

摘要： An IC device transfer method for IC handler accommodates both a tray and a rod-shaped magazine. The tray installs a plurality of IC devices which transport in horizontal directions in the IC handler. The rod-shaped magazine installs a plurality of IC devices which transport in vertical directions in the IC handler. A device reinspection method in the IC test handler reinspects the IC devices stored in the tray or magazine without human intervention, sorts in accordance with the test results, and stores in either the rod-shaped magazine or the tray. For this purpose, a tray supply section transfers a user tray to a test tray, whereas a magazine supply section and a pick carrier section transfer a rod-shaped magazine to the test tray. An inspection setting sets the number of reinspection, the classification of inspection results, and the storage tray/magazine. The IC devices are loaded from the magazine and the user tray to the test tray and are tested. When a reinspection mode is effective, the IC devices to be reinspected are stored in the unloader section and transferred to the loader section by the tray transfer system to test the IC devices again. When the reinspection mode is completed, the IC device are sorted by categories and stored in the tray/magazine.

摘要翻译： 用于IC处理器的IC器件传送方法同时容纳托盘和棒状盒。 托盘安装在IC处理器中沿水平方向传送的多个IC器件。 棒状盒安装在IC处理器中沿垂直方向传送的多个IC器件。 IC测试处理器中的器件重新检测方法重新考虑存储在托盘或杂志中的IC器件，而无需人为干预，根据测试结果进行排序，并存储在棒状盒或托盘中。 为此，托盘供应部分将用户托盘传送到测试托盘，而料盒供应部分和拾取托架部分将棒状托盘传送到测试托盘。 检查设置设置重新检查的次数，检验结果的分类和存储托盘/杂志。 IC器件从盒子和用户托盘装载到测试托盘并进行测试。 重新检查模式有效时，要重新检查的IC设备存储在卸载器部分，并通过托盘传输系统传输到装载器部分，以再次测试IC器件。 当重新检查模式完成后，IC设备按类别进行分类并存储在托盘/杂志中。

公开(公告)号：US5269401A

公开(公告)日：1993-12-14

申请号：US923514

申请日：1992-08-03

申请人： Akihiko Ito ,  Hiroto Nakamura

发明人： Akihiko Ito ,  Hiroto Nakamura

IPC分类号： B65G11/16 ,  B65G11/02 ,  B65G21/20 ,  H01L21/677 ,  H05K13/02 ,  B65G11/10

CPC分类号： H05K13/022 ,  B65G11/023

摘要： Both side walls of a channel groove for guiding integrated circuits with J-shaped leads are formed at an angle greater than 90 degrees to the bottom of the channel groove.

摘要翻译： 用于引导具有J形引线的集成电路的通道槽的两个侧壁形成为与沟槽的底部成大于90度的角度。

公开(公告)号：US4143293A

公开(公告)日：1979-03-06

申请号：US856085

申请日：1977-11-30

申请人： Kakuichiro Hosokoshi ,  Hiroto Nakamura ,  Takami Okamoto

发明人： Kakuichiro Hosokoshi ,  Hiroto Nakamura ,  Takami Okamoto

IPC分类号： H01J29/51 ,  H01J29/50 ,  H01J29/56

CPC分类号： H01J29/51

摘要： A color television tube assembly in which the aperture of a control grid of each electron gun is made in the form of an ellipse with its major axis in line with the vertical direction, and the lengths of the vertical and horizontal axes of the aperture of action space of an electron lens electrode are selected different from each other, whereby the beam spot at the center of the screen may become in the form of a vertically elongated ellipse while the beam spots at the horizontal and vertical edges of the screen are in the form of a horizontally elongated ellipse.

公开(公告)号：US20090278926A1

公开(公告)日：2009-11-12

申请号：US12305075

申请日：2006-12-11

申请人： Aritomo Kikuchi ,  Hiroto Nakamura ,  Jinji Tokita ,  katsuhiko Ikeda

发明人： Aritomo Kikuchi ,  Hiroto Nakamura ,  Jinji Tokita ,  katsuhiko Ikeda

IPC分类号： H04N7/18 ,  G01R31/02

CPC分类号： G01R31/2891 ,  G01R35/005

摘要： In an electronic device test apparatus using image processing technology to position an IC device relative to a socket, a calibration method of an electronic device test apparatus of calibrating a relative position of a device camera with respect to a socket, the method comprising: calculating an offset amount of a socket guide with respect to the socket on the basis of a relative position of the socket camera with respect to the socket guide and a relative position of a socket camera with respect to the socket; and adding this offset amount to the relative position of the device camera with respect to the socket guide so as to calculate the relative position of the device camera with respect to the socket.

摘要翻译： 在使用图像处理技术将IC器件相对于插座定位的电子设备测试装置中，一种用于校准相机相对于插座的相对位置的电子设备测试设备的校准方法，所述方法包括： 基于插座照相机相对于插座引导件的相对位置和插座相机相对于插座的相对位置，插座引导件相对于插座的偏移量; 并将该偏移量加到装置照相机相对于插座引导件的相对位置，以便计算装置相机相对于插座的相对位置。