Magnetoresistive element and method of manufacturing the same
    41.
    发明授权
    Magnetoresistive element and method of manufacturing the same 有权
    磁阻元件及其制造方法

    公开(公告)号:US08884389B2

    公开(公告)日:2014-11-11

    申请号:US13618780

    申请日:2012-09-14

    摘要: According to one embodiment, a magnetoresistive element comprises a first magnetic layer having a magnetization direction invariable and perpendicular to a film surface, a tunnel barrier layer formed on the first magnetic layer, and a second magnetic layer formed on the tunnel barrier layer and having a magnetization direction variable and perpendicular to the film surface. The first magnetic layer includes an interface layer formed on an upper side in contact with a lower portion of the tunnel barrier layer, and a main body layer formed on a lower side and serving as an origin of perpendicular magnetic anisotropy. The interface layer includes a first area provided on an inner side and having magnetization, and a second area provided on an outer side to surround the first area and having magnetization smaller than the magnetization of the first area or no magnetization.

    摘要翻译: 根据一个实施例,磁阻元件包括具有不变且垂直于膜表面的磁化方向的第一磁性层,形成在第一磁性层上的隧道势垒层,以及形成在隧道势垒层上的第二磁性层,并且具有 磁化方向可变并垂直于膜表面。 第一磁性层包括形成在与隧道势垒层的下部相接触的上侧的界面层,以及形成在下侧并用作垂直磁各向异性的原点的主体层。 界面层包括设置在内侧并具有磁化的第一区域和设置在外侧以围绕第一区域并且具有小于第一区域的磁化或不具有磁化的磁化的第二区域。

    NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
    43.
    发明申请
    NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF 有权
    非易失性半导体存储器件及其制造方法

    公开(公告)号:US20110284947A1

    公开(公告)日:2011-11-24

    申请号:US13198359

    申请日:2011-08-04

    IPC分类号: H01L29/792

    摘要: A nonvolatile semiconductor memory device that have a new structure are provided, in which memory cells are laminated in a three dimensional state so that the chip area may be reduced. The nonvolatile semiconductor memory device of the present invention is a nonvolatile semiconductor memory device that has a plurality of the memory strings, in which a plurality of electrically programmable memory cells is connected in series. The memory strings comprise a pillar shaped semiconductor; a first insulation film formed around the pillar shaped semiconductor; a charge storage layer formed around the first insulation film; the second insulation film formed around the charge storage layer; and first or nth electrodes formed around the second insulation film (n is natural number more than 1). The first or nth electrodes of the memory strings and the other first or nth electrodes of the memory strings are respectively the first or nth conductor layers that are spread in a two dimensional state.

    摘要翻译: 提供了具有新结构的非易失性半导体存储器件,其中以三维状态层叠存储单元,从而可以减小芯片面积。 本发明的非易失性半导体存储装置是具有串联连接有多个电可编程存储单元的多个存储串的非易失性半导体存储装置。 存储器串包括柱形半导体; 形成在柱状半导体周围的第一绝缘膜; 形成在所述第一绝缘膜周围的电荷存储层; 形成在电荷存储层周围的第二绝缘膜; 并且形成在第二绝缘膜周围的第一或第n电极(n是大于1的自然数)。 存储器串的第一或第n电极和存储器串的其它第一或第n电极分别是以二维状态扩展的第一或第n导体层。

    SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
    45.
    发明申请
    SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF 有权
    半导体存储器件及其制造方法

    公开(公告)号:US20100019304A1

    公开(公告)日:2010-01-28

    申请号:US12497010

    申请日:2009-07-02

    IPC分类号: H01L27/06 H01L21/8249

    摘要: A semiconductor memory device includes bodies electrically floating; sources; drains; gate electrodes, each of which is adjacent to one side surface of the one of the bodies via a gate dielectric film; plates, each of which is adjacent to the other side surface of the one of the bodies via a plate dielectric film; first bit lines on the drains, the first bit lines including a semiconductor with a same conductivity type as that of the drains; and emitters on the semiconductor of the first bit lines, the emitters including a semiconductor with an opposite conductivity type to that of the semiconductor of the first bit lines, wherein the emitters are stacked above the bodies and the drains.

    摘要翻译: 半导体存储器件包括电漂浮体; 来源 下水道 栅电极,其每一个经由栅极电介质膜与所述一个主体的一个侧表面相邻; 板,其每一个经由板电介质膜与所述一个主体的另一侧表面相邻; 排水口上的第一位线,第一位线包括与排水管相同导电类型的半导体; 和在第一位线的半导体上的发射极,发射器包括与第一位线的半导体的导电类型相反的导电类型的半导体,其中发射体堆叠在主体和漏极之上。

    SEMICONDUCTOR MEMORY DEVICE
    46.
    发明申请
    SEMICONDUCTOR MEMORY DEVICE 有权
    半导体存储器件

    公开(公告)号:US20080237695A1

    公开(公告)日:2008-10-02

    申请号:US11860956

    申请日:2007-09-25

    IPC分类号: H01L29/792

    摘要: This disclosure concerns a memory comprising a charge trapping film; a gate insulating film; a back gate on the charge trapping film; a front gate on the gate insulating film; and a body region provided between a drain and a source, wherein the memory includes a first storage state for storing data depending on the number of majority carriers in the body region and a second storage state for storing data depending on the amount of charges in the charge trapping film, and the memory is shifted from the first storage state to the second storage state by converting the number of majority carriers in the body region into the amount of charges in the charge trapping film or from the second storage state to the first storage state by converting the amount of charges in the charge trapping film into the number of majority carriers in the body region.

    摘要翻译: 本公开涉及包含电荷捕获膜的存储器; 栅极绝缘膜; 电荷捕获膜上的后门; 栅极绝缘膜上的前门; 以及设置在漏极和源极之间的体区,其中所述存储器包括用于根据所述身体区域中的多数载体的数量存储数据的第一存储状态和用于根据所述体内区域中的电荷量存储数据的第二存储状态 通过将身体区域中的多数载体的数量转换为电荷俘获膜中的电荷量或从第二存储状态到第一存储器,将存储器从第一存储状态转移到第二存储状态 通过将电荷俘获膜中的电荷量转换成体区中的多数载体的数量来进行状态。

    Nonvolatile semiconductor memory device and manufacturing method thereof
    48.
    发明申请
    Nonvolatile semiconductor memory device and manufacturing method thereof 有权
    非易失性半导体存储器件及其制造方法

    公开(公告)号:US20070252201A1

    公开(公告)日:2007-11-01

    申请号:US11654551

    申请日:2007-01-18

    IPC分类号: H01L29/76

    摘要: A nonvolatile semiconductor memory device that have a new structure are provided, in which memory cells are laminated in a three dimensional state so that the chip area may be reduced. The nonvolatile semiconductor memory device of the present invention is a nonvolatile semiconductor memory device that has a plurality of the memory strings, in which a plurality of electrically programmable memory cells is connected in series. The memory strings comprise a pillar shaped semiconductor; a first insulation film formed around the pillar shaped semiconductor; a charge storage layer formed around the first insulation film; the second insulation film formed around the charge storage layer; and first or nth electrodes formed around the second insulation film (n is natural number more than 1). The first or nth electrodes of the memory strings and the other first or nth electrodes of the memory strings are respectively the first or nth conductor layers that are spread in a two dimensional state.

    摘要翻译: 提供了具有新结构的非易失性半导体存储器件,其中以三维状态层叠存储单元,从而可以减小芯片面积。 本发明的非易失性半导体存储装置是具有串联连接有多个电可编程存储单元的多个存储串的非易失性半导体存储装置。 存储器串包括柱形半导体; 形成在柱状半导体周围的第一绝缘膜; 形成在所述第一绝缘膜周围的电荷存储层; 形成在电荷存储层周围的第二绝缘膜; 并且形成在第二绝缘膜周围的第一或第n电极(n是大于1的自然数)。 存储器串的第一或第n电极和存储器串的其它第一或第n电极分别是以二维状态扩展的第一或第n导体层。

    MOS-type semiconductor integrated circuit device
    50.
    发明授权
    MOS-type semiconductor integrated circuit device 失效
    MOS型半导体集成电路器件

    公开(公告)号:US5258635A

    公开(公告)日:1993-11-02

    申请号:US754191

    申请日:1991-08-28

    摘要: A MOS-type semiconductor integrated circuit device is provided in which MOS transistors are formed in a vertical configuration. The MOS transistors are constituted by pillar layers formed on the substrate. The outer circumferential surfaces of the pillar layers are utilized to form the gates of the MOS transistors. Thus, large gate widths thereof can be obtained within a small area. As a result, the total chip area of the MOS transistors can be significantly reduced while maintaining a prescribed current-carrying capacity.

    摘要翻译: 提供了一种MOS型半导体集成电路器件,其中MOS晶体管形成为垂直配置。 MOS晶体管由形成在基板上的柱层构成。 柱层的外周面用于形成MOS晶体管的栅极。 因此,可以在小的区域内获得其大的栅极宽度。 结果,可以在保持规定的载流能力的同时显着地减小MOS晶体管的总芯片面积。