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295 条记录 (耗时 0.041 秒)

    Surface acoustic wave device package
    41.
    发明申请
    Surface acoustic wave device package 审中-公开
    声表面波器件封装

    公开(公告)号：US20060250049A1

    公开(公告)日：2006-11-09

    申请号：US11259199

    申请日：2005-10-27

    申请人： Doo Park ,  Young Lee ,  Seung Lee ,  Joo Park ,  Sang Park ,  Nam Kim

    发明人： Doo Park ,  Young Lee ,  Seung Lee ,  Joo Park ,  Sang Park ,  Nam Kim

    IPC分类号： H01L41/053

    CPC分类号： H03H9/1085 ,  H01L2224/16225 ,  H03H9/059

    摘要： The present invention provides a SAW device package used in filters, duplexers, etc., in particular, which simplifies sealing process for protecting the active area of a SAW device. The SAW device package comprises a wiring substrate, as a package base having connection patterns, having bare chip attaching means. A bare chip is flip-bonded and attached to the attaching means on the wiring substrate while maintaining the airtight condition. A resin molding part covers the top of the bare chip to seal the device. The invention facilitates maintaining an airtight condition of the active area which affects the operational characteristics of the device, and simplifies the manufacturing processes. Furthermore, the improved structure of the wiring substrate blocks the external moisture permeation, thereby enabling the device to better withstand the external changes.

    摘要翻译： 本发明提供了一种特别用于滤波器，双工器等中的SAW器件封装，其简化了用于保护SAW器件的有源区域的密封工艺。 SAW器件封装包括布线衬底，作为具有连接图案的封装基座，具有裸芯片附接装置。 在保持气密状态的同时，将裸芯片翻转接合并附接到布线基板上的附接装置。 树脂成型部分覆盖裸芯片的顶部以密封装置。 本发明有助于维持影响装置的操作特性的活性区域的气密状态，并且简化了制造过程。 此外，布线基板的改进的结构阻止外部水分渗透，从而使得该装置能够更好地承受外部变化。

    Fabrication method of light emitting diode package
    43.
    发明申请
    Fabrication method of light emitting diode package 有权
    发光二极管封装的制造方法

    公开(公告)号：US20060246617A1

    公开(公告)日：2006-11-02

    申请号：US11314003

    申请日：2005-12-22

    申请人： Young Lee ,  Seog Choi ,  Yong Kim ,  Sang Shin

    发明人： Young Lee ,  Seog Choi ,  Yong Kim ,  Sang Shin

    IPC分类号： H01L21/00

    CPC分类号： H01L33/647 ,  H01L24/97 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/16245 ,  H01L2224/48247 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2933/0075 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

    摘要： The invention provides a fabrication method of an LED package for easily fabricating LED packages of excellent heat radiation characteristics. In the method, a metallic package substrate having a recess and a reflecting surface formed in the recess is prepared, and the package substrate is selectively anodized and divided into two package electrode parts divided from each other. Then, an light emitting device is mounted on the bottom of the recess. Preferably, the package substrate is a metal substrate made of Al or Al-based metal.

    摘要翻译： 本发明提供一种用于容易地制造具有优异散热特性的LED封装的LED封装的制造方法。 在该方法中，制备具有形成在凹部中的凹部和反射表面的金属封装基板，并且将封装基板选择性地阳极氧化并分成彼此分开的两个封装电极部分。 然后，将发光装置安装在凹部的底部。 优选地，封装衬底是由Al或Al基金属制成的金属衬底。

    High-throughput HDP-CVD processes for advanced gapfill applications
    46.
    发明申请
    High-throughput HDP-CVD processes for advanced gapfill applications 审中-公开

    公开(公告)号：US20060154494A1

    公开(公告)日：2006-07-13

    申请号：US11031926

    申请日：2005-01-08

    申请人： Bo Qi ,  Young Lee

    发明人： Bo Qi ,  Young Lee

    IPC分类号： H01L21/469

    CPC分类号： H01L21/02164 ,  C23C16/045 ,  C23C16/401 ,  C23C16/45523 ,  H01L21/02274 ,  H01L21/31612

    摘要： Methods are provided of depositing a silicon oxide film on a substrate disposed in a substrate processing chamber. The substrate has a gap formed between adjacent raised surfaces. A silicon-containing gas, an oxygen-containing gas, and a fluent gas are flowed into the substrate processing chamber. The fluent gas has an average molecular weight less than 5 amu. A first high-density plasma is formed from the silicon-containing gas, the oxygen-containing gas, and the fluent gas to deposit a first portion of the silicon oxide film over the substrate and within the gap with a first deposition process that has simultaneous deposition and sputtering components having relative contributions defined by a first deposition/sputter ratio. A second high-density plasma is formed from the silicon-containing gas, the oxygen-containing gas, and the fluent gas to deposit a second portion of the silicon oxide film over the substrate and within the gap with a second deposition process that has simultaneous deposition and sputtering components having relative contributions defined by a second deposition/sputter ratio. The second deposition/sputter ratio is less than the first deposition/sputter ratio. Each of the first and second deposition/sputter ratios is defined as a ratio of a sum of a net deposition rate and a blanket sputtering rate to the blanket sputtering rate.

    Electroactive solid-state actuator and method of manufacturing the same
    48.
    发明申请
    Electroactive solid-state actuator and method of manufacturing the same 失效
    电活性固态致动器及其制造方法

    公开(公告)号：US20060086596A1

    公开(公告)日：2006-04-27

    申请号：US11080294

    申请日：2005-03-15

    申请人： Kwi Lee ,  Young Lee ,  Jae Nam ,  Hyouk Choi ,  Mi Cho ,  Ja Koo

    发明人： Kwi Lee ,  Young Lee ,  Jae Nam ,  Hyouk Choi ,  Mi Cho ,  Ja Koo

    IPC分类号： H01H57/00

    CPC分类号： F03G7/00 ,  Y10S310/80 ,  Y10T29/42

    摘要： The present invention provides an electroactive solid-state actuator, including a solid polymer electrolyte film having first and second main surfaces facing each other, and first and second conductive polymer layers infiltrated into the first and second main surfaces of the solid polymer electrolyte film. Further, a method of manufacturing the electroactive solid-state actuator is provided, the method including preparing a solid polymer film having first and second main surfaces facing each other, infiltrating a monomer of a conductive polymer into the first and second main surfaces of the solid polymer film, followed by polymerization, to form first and second conductive polymer layers, and immersing the solid polymer film into an ionic liquid or liquid electrolyte to be converted to an electrically conductive polymer.

    摘要翻译： 本发明提供了一种电活性固态致动器，其包括具有彼此面对的第一和第二主表面的固体聚合物电解质膜以及浸入固体聚合物电解质膜的第一和第二主表面中的第一和第二导电聚合物层。 此外，提供了一种制造电活性固态致动器的方法，该方法包括制备具有彼此相对的第一和第二主表面的固体聚合物膜，将导电聚合物的单体浸入固体的第一和第二主表面 聚合物膜，然后聚合，以形成第一和第二导电聚合物层，并将固体聚合物膜浸入离子液体或液体电解质中以转化为导电聚合物。

    Notification of control information in wireless communication system
    49.
    发明申请
    Notification of control information in wireless communication system 有权
    在无线通信系统中通知控制信息

    公开(公告)号：US20050286483A1

    公开(公告)日：2005-12-29

    申请号：US11150317

    申请日：2005-06-10

    申请人： Young Lee ,  Sung Chun ,  Seung Yi

    发明人： Young Lee ,  Sung Chun ,  Seung Yi

    IPC分类号： H04B7/26 ,  H04J3/00 ,  H04W4/06 ,  H04W48/12 ,  H04W72/00 ,  H04W72/12

    CPC分类号： H04W72/005 ,  H04W48/12

    摘要： The present invention relates to notifying updated control information of a point-to-multipoint service in a wireless communications system. An indication about whether control channel information has been updated is transmitted and received during a time interval where data of the point-to multipoint service is not transmitted between a network and a mobile terminal. Furthermore, and indication about whether the control channel information has been updated is transmitted and received via a physical channel, to which a traffic channel is mapped. This allows the mobile terminal, which receives data of a specific point-to-multipoint service discontinuously, to effectively recognize whether the control channel information has been updated.

    摘要翻译： 本发明涉及在无线通信系统中通知点对多点业务的更新控制信息。 在网络和移动终端之间不发送点对多点服务的数据的时间间隔期间，发送和接收关于控制信道信息是否被更新的指示。 此外，通过物理信道来发送和接收关于控制信道信息是否被更新的指示，物理信道被映射到业务信道。 这允许不连续地接收特定点对多点服务的数据的移动终端有效地识别控制信道信息是否已被更新。