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    Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates
    41.
    发明授权
    Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates 有权

    公开(公告)号：US10676836B2

    公开(公告)日：2020-06-09

    申请号：US16118267

    申请日：2018-08-30

    Applicant: Microfabrica Inc.

    Inventor： Adam L. Cohen ,  Michael S. Lockard ,  Kieun Kim ,  Qui T. Le ,  Gang Zhang ,  Uri Frodis ,  Dale S. McPherson ,  Dennis R. Smalley

    IPC: C25D5/02 ,  B81C1/00 ,  C25D1/00 ,  C23C18/16

    Abstract: Some embodiments are directed to techniques for building single layer or multi-layer structures on dielectric or partially dielectric substrates. Certain embodiments deposit seed layer material directly onto substrate materials while others use an intervening adhesion layer material. Some embodiments use different seed layer and/or adhesion layer materials for sacrificial and structural conductive building materials. Some embodiments apply seed layer and/or adhesion layer materials in what are effectively selective manners while others apply the materials in blanket fashion. Some embodiments remove extraneous material via planarization operations while other embodiments remove the extraneous material via etching operations. Other embodiments are directed to the electrochemical fabrication of multilayer mesoscale or microscale structures which are formed using at least one conductive structural material, at least one conductive sacrificial material, and at least one dielectric material. In some embodiments the dielectric material is a UV-curable photopolymer.

    Cantilever microprobes for contacting electronic components
    42.
    发明授权
    Cantilever microprobes for contacting electronic components 有权

    公开(公告)号：US10416192B2

    公开(公告)日：2019-09-17

    申请号：US14927350

    申请日：2015-10-29

    Applicant: Microfabrica Inc.

    Inventor： Richard T. Chen ,  Ezekiel J. J. Kruglick ,  Christopher A. Bang ,  Dennis R. Smalley ,  Pavel B. Lembrikov

    IPC: G01R1/067 ,  G01R31/00

    Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such probe or cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.

    Cantilever Microprobes For Contacting Electronic Components
    43.
    发明申请
    Cantilever Microprobes For Contacting Electronic Components 审中-公开

    公开(公告)号：US20190227099A1

    公开(公告)日：2019-07-25

    申请号：US16373500

    申请日：2019-04-02

    Applicant: Microfabrica Inc.

    Inventor： Richard T. Chen ,  Ezekiel J. J. Kruglick ,  Christopher A. Bang ,  Dennis R. Smalley ,  Pavel B. Lembrikov

    IPC: G01R1/067

    Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such probe or cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.

    Cantilever Microprobes For Contacting Electronic Components
    46.
    发明申请
    Cantilever Microprobes For Contacting Electronic Components 审中-公开
    用于接触电子元件的悬臂式微机

    公开(公告)号：US20160109481A1

    公开(公告)日：2016-04-21

    申请号：US14927350

    申请日：2015-10-29

    Applicant: Microfabrica Inc.

    Inventor： Richard T. Chen ,  Ezekiel J. J. Kruglick ,  Christopher A. Bang ,  Dennis R. Smalley ,  Pavel B. Lembrikov

    IPC: G01R1/067 ,  G01R31/28

    Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such probe or cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.

    Abstract translation: 本文公开的实施例涉及用于与电子电路等进行临时或永久接触的柔性探针结构。 具体地，实施例涉及悬臂式探针结构的各种设计。 一些实施例涉及制造这种探针或悬臂结构的方法。 在一些实施例中，例如，悬臂探头具有延伸的基部结构，在安装结构中滑动，多光束配置，偏移粘合位置，以允许相邻探针，具有张力构型的柔顺元件，改善的行程，改善的顺应性，改进的擦洗 能力和/或类似物。

    Methods and Apparatus for Forming Multi-Layer Structures Using Adhered Masks
    47.
    发明申请
    Methods and Apparatus for Forming Multi-Layer Structures Using Adhered Masks 审中-公开
    使用粘附掩模形成多层结构的方法和装置

    公开(公告)号：US20140326607A1

    公开(公告)日：2014-11-06

    申请号：US14203409

    申请日：2014-03-10

    Applicant: Microfabrica Inc.

    Inventor： Adam L. Cohen ,  Jill R. Thomassian ,  Michael S. Lockard ,  Marvin M. Kilgo, III ,  Uri Frodis ,  Dennis R. Smalley

    IPC: C25D5/02

    CPC classification number: C25D1/003 ,  C25D1/00 ,  C25D1/20 ,  C25D5/02 ,  C25D5/022 ,  C25D5/10 ,  C25D5/14 ,  C25D5/48 ,  C25D5/50

    Abstract: Numerous electrochemical fabrication methods and apparatus are provided for producing multi-layer structures (e.g. having meso-scale or micro-scale features) from a plurality of layers of deposited materials using adhered masks (e.g. formed from liquid photoresist or dry film), where two or more materials may be provided per layer where at least one of the materials is a structural material and one or more of any other materials may be a sacrificial material which will be removed after formation of the structure. Materials may comprise conductive materials that are electrodeposited or deposited in an electroless manner. In some embodiments special care is undertaken to ensure alignment between patterns formed on successive layers.

    Abstract translation: 提供了多种电化学制造方法和装置，用于使用粘附的掩模（例如由液体光致抗蚀剂或干膜形成）从多层沉积材料制备多层结构（例如具有中尺度或微尺度特征），其中两个 或者可以在每层中提供更多的材料，其中至少一种材料是结构材料，并且任何其它材料中的一种或多种可以是在形成结构之后被去除的牺牲材料。 材料可以包括以无电解方式电沉积或沉积的导电材料。 在一些实施例中，特别注意确保在连续层上形成的图案之间的对准。

    Probe Arrays and Improved Methods for Making and Using Longitudinal Deformation of Probe Preforms
    49.
    发明公开
    Probe Arrays and Improved Methods for Making and Using Longitudinal Deformation of Probe Preforms 审中-公开

    公开(公告)号：US20240094261A1

    公开(公告)日：2024-03-21

    申请号：US17401252

    申请日：2021-08-12

    Applicant: Microfabrica Inc.

    Inventor： Michael S. Lockard ,  Uri Frodis ,  Dennis R. Smalley

    IPC: G01R3/00 ,  G01R1/067

    CPC classification number: G01R3/00 ,  G01R1/06722 ,  G01R1/06761

    Abstract: Probes for testing (e.g. wafer level testing or socket level testing) of electronic devices (e.g. semiconductor devices) and more particularly, arrays of such probes are provided. Probes are formed by initially fabricating probe preforms in batch with bases and/or ends located in array patterns, directly or indirectly on one or more build substrates with the arrayed preforms being in a longitudinally compressed state and whereafter the preforms are longitudinally plastically deformed to yield probes or partially formed probes with extended longitudinal lengths. Probes may be formed with deformable spring elements formed from one or more single layers which are joined by vertical elements located on other layers or they may be formed by spring elements that are formed as multi-layer structures. Arrays may include probe preforms with laterally overlapping or interlaced structures (but longitudinally displaced) which may remain laterally overlapping or become laterally displaced upon plastic deformation.

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