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    HERMETICALLY-SEALED PACKAGES INCLUDING FEEDTHROUGH ASSEMBLIES
    41.
    发明申请
    HERMETICALLY-SEALED PACKAGES INCLUDING FEEDTHROUGH ASSEMBLIES 有权

    公开(公告)号：US20210051812A1

    公开(公告)日：2021-02-18

    申请号：US17074171

    申请日：2020-10-19

    Applicant: Medtronic, Inc.

    Inventor： David A. Ruben

    IPC: H05K5/06 ,  A61N1/375 ,  H05K3/38 ,  H05K7/06

    Abstract: Various embodiments of a hermetically-sealed package and methods of forming such packages are disclosed. In one or more embodiments, the hermetically-sealed package can include a housing and a feedthrough assembly that forms a part of the housing. The feedthrough assembly can include a non-conductive substrate and a feedthrough. The feedthrough can include a via from an outer surface to an inner surface of the non-conductive substrate, a conductive material disposed in the via, and an external contact disposed over the via on the outer surface of the non-conductive substrate. The external contact can be electrically coupled to the conductive material disposed in the via. Further, the external contact can be hermetically sealed to the outer surface of the non-conductive substrate by a laser bond surrounding the via.

    Sealed package and method of forming same
    42.
    发明授权
    Sealed package and method of forming same 有权

    公开(公告)号：US10765372B2

    公开(公告)日：2020-09-08

    申请号：US16580657

    申请日：2019-09-24

    Applicant: Medtronic, Inc.

    Inventor： David A. Ruben ,  Craig L. Schmidt

    IPC: H05K5/06 ,  H05K5/02 ,  A61B5/00 ,  A61N1/375 ,  A61N1/372 ,  A61B5/0245 ,  A61N1/05 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/32 ,  H05K3/40 ,  H05K5/03

    Abstract: Various embodiments of a sealed package and a method of forming such package are disclosed. The package can include a non-conductive substrate that includes a cavity disposed in a first major surface. A cover layer can be disposed over the cavity and attached to the first major surface of the non-conductive substrate to form a sealed enclosure. The sealed package can also include a feedthrough that includes a via between a recessed surface of the cavity and a second major surface of the substrate, and a conductive material disposed in the via. An external contact can be disposed over the via on the second major surface of the non-conductive substrate, where the external contact is electrically connected to the conductive material disposed in the via. The sealed package can also include an electronic device disposed within the sealed enclosure that is electrically connected to the external contact.

    SEALED IMPLANTABLE MEDICAL DEVICE AND METHOD OF FORMING SAME
    43.
    发明申请
    SEALED IMPLANTABLE MEDICAL DEVICE AND METHOD OF FORMING SAME 审中-公开

    公开(公告)号：US20190255335A1

    公开(公告)日：2019-08-22

    申请号：US16405032

    申请日：2019-05-07

    Applicant: Medtronic, Inc.

    Inventor： Michael W. Barror ,  John K. Day ,  David A. Ruben ,  James D. Bradley

    IPC: A61N1/375 ,  A61N1/372 ,  A61N1/378 ,  A61N1/05 ,  A61N1/08

    Abstract: Various embodiments of a sealed package and a method of forming the package are disclosed. The package can include a housing extending along a housing axis between a first end and a second end, and an electronic device disposed within the housing that includes a device contact. The package can also include an external contact hermetically sealed to the housing at the first end of the housing, and a conductive member electrically connected to the external contact and the device contact such that the conductive member electrically connects the electronic device to the external contact. The conductive member is compressed between the external contact and the device contact.

    FEEDTHROUGH ASSEMBLIES AND METHODS OF FORMING SAME
    46.
    发明申请
    FEEDTHROUGH ASSEMBLIES AND METHODS OF FORMING SAME 有权
    有意义的组装及其形成方法

    公开(公告)号：US20160190052A1

    公开(公告)日：2016-06-30

    申请号：US14966101

    申请日：2015-12-11

    Applicant: Medtronic, Inc.

    Inventor： David A. Ruben ,  Michael S. Sandlin

    IPC: H01L23/498 ,  H01L21/48

    CPC classification number: H01L23/49827 ,  A61N1/3754 ,  H01L21/4853 ,  H01L21/486 ,  H01L23/49838 ,  H01L23/49866 ,  H01L23/49894 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: Various embodiments of a feedthrough assembly and methods of forming such assemblies are disclosed. In one or more embodiments, the feedthrough assembly can include a non-conductive substrate and a feedthrough. The feedthrough can include a via from an outer surface to an inner surface of the non-conductive substrate, a conductive material disposed in the via, and an external contact disposed over the via on the outer surface of the non-conductive substrate. The external contact can be electrically coupled to the conductive material disposed in the via. And the external contact can be hermetically sealed to the outer surface of the non-conductive substrate by a bond surrounding the via. In one or more embodiments, the bond can be a laser bond.

    Abstract translation: 公开了馈通组件的各种实施例和形成这种组件的方法。 在一个或多个实施例中，馈通组件可以包括非导电衬底和馈通。 馈通可以包括从非导电衬底的外表面到内表面的通孔，设置在通孔中的导电材料和设置在非导电衬底的外表面上的通孔上的外部触点。 外部接触件可以电耦合到布置在通孔中的导电材料。 并且外部接触可以通过围绕通孔的键气密密封到非导电衬底的外表面。 在一个或多个实施方案中，该键可以是激光键。

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