公开(公告)号：US5418801A

公开(公告)日：1995-05-23

申请号：US133370

申请日：1993-10-08

申请人： Hiroshi Saitoh

发明人： Hiroshi Saitoh

IPC分类号： H01S3/03 ,  H01S3/227 ,  H01S3/22

CPC分类号： H01S3/031 ,  H01S3/227

摘要： To a laser medium comprising vapor of metal atoms A is added vapor of metal atoms B such that the difference .DELTA.E(B) between the energy value E.sub.1 (B) at the upper laser level and the energy value at the lower laser level E.sub.2 (B) as the metastable state after laser transition or fluorescent transition is substantially equal to the energy level E.sub.2 (A) of the metal atoms A at the lower laser level. Secondary collision of the metal atoms A in the E.sub.2 (A) state and the metal atoms B in the E.sub.2 (B) state with one another causes energy transition, whereby the metal atoms A do a work of exciting the metal atoms B to a resonant excitation level to lose its own energy and undergo transition to a ground level E.sub.0 (A). Consequently, the excitation lifetime at the lower laser level in the laser transition is reduced to extend the inverse population time and also the laser output pulse width so as to increase the laser conversion efficiency.

摘要翻译： 对于包含金属原子A的蒸气的激光介质，加入金属原子B的蒸汽，使得上激光水平处的能量值E1（B）与较低激光等级E2的能量值（E）之间的差DELTA E（B） B）作为激光转变或荧光转变后的亚稳态基本上等于较低激光水平的金属原子A的能级E2（A）。 E2（A）状态的金属原子A与E2（B）状态的金属原子B的二次碰撞导致能量转变，由此金属原子A做一个将金属原子B激发成谐振的工作 激发水平失去自己的能量并经历过渡到地面水平E0（A）。 因此，激光转换中的较低激光水平的激发寿命减小，以延长反向插入时间以及激光输出脉冲宽度，从而提高激光转换效率。

公开(公告)号：US5065193A

公开(公告)日：1991-11-12

申请号：US525903

申请日：1990-05-18

申请人： Hiroshi Saitoh ,  Michio Nagatomo ,  Hideo Nagasaka

发明人： Hiroshi Saitoh ,  Michio Nagatomo ,  Hideo Nagasaka

IPC分类号： B23K26/00 ,  G03G15/20 ,  H05B3/00

CPC分类号： H05B3/0095 ,  G03G15/2053 ,  Y10T29/49544

摘要： A heat fixing roll for a copying machine includes an insulating layer formed on the surface of a hollow tube, a heating resistor layer formed on the surface of the insulating layer by uniformly thermal spray coating a resistor material, a screw-like heating resistor formed by forming a helical groove having a depth reaching the surface of the insulating layer by using a laser irradiation head connected to an electric resistance compensator, and an antisticking layer formed on the surface of the resistor and the groove by coating. The present invention also provides a method of producing the heat fixing roll and an electronic copying machine provided with the roll.

公开(公告)号：US4984087A

公开(公告)日：1991-01-08

申请号：US358299

申请日：1989-05-26

申请人： Katsunori Fujimura ,  Hiroshi Saitoh ,  Michio Matsumoto

发明人： Katsunori Fujimura ,  Hiroshi Saitoh ,  Michio Matsumoto

IPC分类号： H04N5/232 ,  H04R3/00

CPC分类号： H04R3/005 ,  H04N5/232 ,  H04R2410/05

摘要： A microphone apparatus for a video camera having a zoom lens, comprising: a superdirectional microphone fro generating a superdirectional microphone signal D; a stereo microphone for generating stereo microphone signals L and R; a zoom position sensor for generating a zoom position signal; first and second signal means for generating control signals Vc1 and Vc2 which can be changed according to the zoom position signal; a first amplifier for generating a first amplified signal K1.multidot.D (K1 is a value corresponding to Vc1); a second amplifier for generating a second amplified signal K2.multidot.L (K2 is a value corresponding to Vc2); a third amplifier for generating a third amplified signal K2.multidot.R; a first adder for generating a first sum signal (k1.multidot.D+K2.multidot.L); and a second adding means for generating a second sum signal (k1.multidot.D+K2.multidot.R). The directivity can be varied in accordance with the control of the zoom lens to suitably match images and sounds.

摘要翻译： 一种用于具有变焦透镜的摄像机的麦克风装置，包括：产生超向麦克风信号D的超向麦克风; 用于产生立体声麦克风信号L和R的立体声麦克风; 变焦位置传感器，用于产生变焦位置信号; 第一和第二信号装置，用于产生可根据变焦位置信号改变的控制信号Vc1和Vc2; 用于产生第一放大信号K1xD的第一放大器（K1是对应于Vc1的值）; 用于产生第二放大信号K2xL的第二放大器（K2是对应于Vc2的值）; 用于产生第三放大信号K2xR的第三放大器; 用于产生第一和信号（k1xD + K2xL）的第一加法器; 以及用于产生第二和信号（k1xD + K2xR）的第二加法装置。 方向性可以根据变焦镜头的控制而变化，以适当地匹配图像和声音。

公开(公告)号：US4485162A

公开(公告)日：1984-11-27

申请号：US464929

申请日：1983-02-08

申请人： Kenji Imamura ,  Hiroshi Saitoh ,  Katsuhisa Kakizaki ,  Motohiko Makino

发明人： Kenji Imamura ,  Hiroshi Saitoh ,  Katsuhisa Kakizaki ,  Motohiko Makino

IPC分类号： G03G9/107 ,  H01F1/36 ,  G03G9/14

CPC分类号： G03G9/107 ,  H01F1/36

摘要： A magnetic carrier powder composed essentially of particles of a ferrite having a composition represented by the formula(MO).sub.100-x (Fe.sub.2 O.sub.3).sub.xwhere M is Mg, Mn, Zn, Ni, a combination of Mg in an atomic ratio of at least 0.05 with at least one metal selected from the group consisting of Zn, Cu, Mn and Co, a combination of Mn in an atomic ratio of at least 0.05 with at least one metal selected from the group consisting of Zn, Cu, Mg and Co, or a combination of Ni in an atomic ratio of at least 0.05 with at least one metal selected from the group consisting of Zn, Mg, Mn, Cu and Co, and x is greater than 53 molar %.

摘要翻译： 基本上由具有由式（MO）100-x（Fe 2 O 3）x表示的组成的铁氧体的颗粒组成的磁性载体粉末，其中M是Mg，Mn，Zn，Ni，原子比至少为Mg的组合 0.05，选自Zn，Cu，Mn和Co中的至少一种金属，原子比为至少0.05的Mn与选自Zn，Cu，Mg和Co中的至少一种金属的组合 ，或Ni至少为0.05的Ni与选自Zn，Mg，Mn，Cu和Co中的至少一种金属的组合，x大于53摩尔％。

公开(公告)号：US4377603A

公开(公告)日：1983-03-22

申请号：US90395

申请日：1979-11-01

申请人： Tsutomu Itoh ,  Nobuo Furuya ,  Kenji Ouchi ,  Takeo Shimizu ,  Hiroshi Saitoh

发明人： Tsutomu Itoh ,  Nobuo Furuya ,  Kenji Ouchi ,  Takeo Shimizu ,  Hiroshi Saitoh

IPC分类号： B05B5/03 ,  B05B5/08 ,  B05D1/04 ,  B05D1/06

CPC分类号： B05D1/045 ,  B05B5/032 ,  B05B5/087 ,  B05D2203/35 ,  B05D2401/32 ,  C03C2218/31

摘要： A workpiece which may be made of a highly electrically insulating material is held in a spaced opposing relationship with respect to a silent discharge plate electrode to which an a.c. voltage is applied. A d.c. voltage is applied across the workpiece and the silent discharge plate electrode to form a driving electric field therebetween. Powder particles suspended in air are charged in the same polarity as that of the silent discharge plate electrode and then injected into the region between the silent discharge plate electrode and the workpiece where the electric field drives the charged particles toward the workpiece to coat it. The a.c. voltage is sufficient to repel the electrode surface confronting the workpiece and to maintain the silent discharge at a reduced level and effectively precluding deposit of powder particles on the mentioned surface. An apparatus for the electrostatic coating is also disclosed.

摘要翻译： 可以由高电绝缘材料制成的工件相对于静音放电板电极保持间隔开的相对关系。 施加电压。 一个d.c. 在工件和无声放电板电极之间施加电压，以在它们之间形成驱动电场。 悬浮在空气中的粉末颗粒以与无声放电板电极相同的极性充电，然后注入静电放电板电极和工件之间的区域，在该区域中电场驱动带电粒子朝向工件涂覆。 a.c. 电压足以排斥面对工件的电极表面，并将静音放电维持在降低的水平，并有效地排除粉末颗粒沉积在所述表面上。 还公开了一种用于静电涂覆的装置。

公开(公告)号：US4157391A

公开(公告)日：1979-06-05

申请号：US804239

申请日：1977-06-07

申请人： Fumio Kitame ,  Hiroshi Saitoh ,  Nakao Ishida

发明人： Fumio Kitame ,  Hiroshi Saitoh ,  Nakao Ishida

IPC分类号： A61K31/575 ,  C07J9/00 ,  A61K31/56

CPC分类号： C07J9/00 ,  A61K31/575

摘要： 7-Hydroxycholesterol and 7-ketocholesterol can be used as a medicament having a pharmacodynamic action on the bio-protective mechanisms, and thus they are useful as an immunoregulatory agent or antiphlogistic agent.

摘要翻译： 7-羟基胆固醇和7-酮胆固醇可用作对生物保护机理具有药效作用的药物，因此它们可用作免疫调节剂或消炎剂。

公开(公告)号：US08577274B2

公开(公告)日：2013-11-05

申请号：US12929675

申请日：2011-02-08

申请人： Takaaki Tawada ,  Hiroshi Saitoh ,  Kaoru Yoshino ,  Akira Fujimori ,  Kensuke Sasaki

发明人： Takaaki Tawada ,  Hiroshi Saitoh ,  Kaoru Yoshino ,  Akira Fujimori ,  Kensuke Sasaki

IPC分类号： G03G21/00

CPC分类号： G03G21/0094 ,  G03G21/0011

摘要： An image forming apparatus includes an image carrier, a cleaning device having a cleaning member that comes into contact with a surface of the image carrier, and a lubricant applying device provided on the downstream side of the cleaning member. The lubricant applying device includes a solid lubricant, a lubricant supply roller, and a trailing type lubricant smoothing blade that is provided on the downstream side of the lubricant supply roller, and comes into belly contact with the surface of the image carrier. After image carrier is stopped, constantly or under a predetermined condition, the surface of the image carrier is moved in a direction opposite to an image forming direction. The opposite movement distance is equal to or more than the shortest distance between a contact point between the lubricant supply roller and the image carrier and a contact point between the lubricant smoothing blade and the image carrier.

摘要翻译： 图像形成装置包括图像载体，具有与图像载体的表面接触的清洁部件的清洁装置，以及设置在清洁部件的下游侧的润滑剂涂布装置。 润滑剂涂布装置包括固体润滑剂，润滑剂供应辊和拖尾型润滑剂平滑刮刀，其设置在润滑剂供应辊的下游侧，并与图像载体的表面进行腹部接触。 在图像载体停止之后，不断地或在预定条件下，图像载体的表面在与图像形成方向相反的方向上移动。 相反的移动距离等于或大于润滑剂供给辊和图像载体之间的接触点与润滑剂平滑叶片和图像载体之间的接触点之间的最短距离。

公开(公告)号：US07830011B2

公开(公告)日：2010-11-09

申请号：US11076055

申请日：2005-03-10

申请人： Kentaro Nomoto ,  Yuki Igawa ,  Hiroshi Saitoh ,  Takashi Sato ,  Toshio Ohashi ,  Yoshihiro Ohkura

发明人： Kentaro Nomoto ,  Yuki Igawa ,  Hiroshi Saitoh ,  Takashi Sato ,  Toshio Ohashi ,  Yoshihiro Ohkura

IPC分类号： H01L23/48

CPC分类号： H01L24/17 ,  H01L23/12 ,  H01L23/34 ,  H01L23/48 ,  H01L23/50 ,  H01L23/52 ,  H01L2224/02377 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05548 ,  H01L2224/05556 ,  H01L2224/05559 ,  H01L2224/05569 ,  H01L2224/05571 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/13 ,  H01L2224/13022 ,  H01L2224/13023 ,  H01L2224/131 ,  H01L2224/14132 ,  H01L2224/16238 ,  H01L2224/81122 ,  H01L2224/8113 ,  H01L2224/81132 ,  H01L2924/00011 ,  H01L2924/01066 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/01322 ,  H01L2924/10158 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2224/81805 ,  H01L2924/00014

摘要： A semiconductor device, encapsulated in a wafer level chip size package (WLCSP), includes a plurality of pad electrodes formed on the surface of a semiconductor chip, wherein a first insulating layer is formed on the surface of the semiconductor chip except the pad electrodes; a plurality of connection electrodes and at least one heat-dissipation electrode are formed on the surface of the first insulating layer; the pad electrodes and the connection electrodes are mutually connected via a first wiring portion; the heat-dissipation electrode is connected with a second wiring portion; and a second insulating layer is formed to enclose the electrodes and wiring portions, wherein the second wiring portion is arranged in proximity to a heating portion of the semiconductor chip and is formed on the surface of the first insulating layer except the prescribed region corresponding to the first wiring portion.

摘要翻译： 封装在晶片级芯片尺寸封装（WLCSP）中的半导体器件包括形成在半导体芯片的表面上的多个焊盘电极，其中在除了焊盘电极之外的半导体芯片的表面上形成第一绝缘层; 多个连接电极和至少一个散热电极形成在第一绝缘层的表面上; 焊盘电极和连接电极经由第一布线部分相互连接; 所述散热电极与第二配线部连接， 并且形成第二绝缘层以包围所述电极和布线部分，其中所述第二布线部分布置在所述半导体芯片的加热部分附近，并且形成在除了对应于所述半导体芯片的规定区域之外的所述第一绝缘层的表面上 第一接线部。

公开(公告)号：US07754130B2

公开(公告)日：2010-07-13

申请号：US11696949

申请日：2007-04-05

申请人： Kenichi Shirasaka ,  Hiroshi Saitoh

发明人： Kenichi Shirasaka ,  Hiroshi Saitoh

IPC分类号： H01L21/00 ,  H01L21/02

CPC分类号： H01L23/49575 ,  G01R33/00 ,  H01L23/49503 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method for manufacturing a physical quantity sensor includes the steps of: preparing a lead frame comprising a rectangular frame portion, a plurality of leads protruding out from this rectangular frame portion in the inward direction, and a stage portion that is connected to the rectangular frame portion by connecting leads; fixing a physical quantity sensor chip to the stage portion; inclining the stage portion and the physical quantity sensor chip with respect to the rectangular frame portion; and integrating the inclined physical quantity sensor chip and the leads within a metallic mold using a resin. The method further comprises the steps of providing a pressing member of a separate body to the stage portion on the back face of the stage portion in order to incline the stage portion and the physical quantity sensor chip with respect to the rectangular frame portion, and inclining the stage portion and the physical quantity sensor chip by pressing of the back face of the stage portion by the pressing member.

摘要翻译： 一种用于制造物理量传感器的方法，包括以下步骤：制备包括矩形框架部分的引线框架，从该矩形框架部分沿向内方向突出的多个引线以及与矩形框架连接的台架部分 引线连接部分; 将物理量传感器芯片固定到台架部分; 使台部和物理量传感器芯片相对于矩形框架部分倾斜; 并使用树脂将倾斜的物理量传感器芯片和引线集成在金属模具内。 该方法还包括以下步骤：为了使台架部分和物理量传感器芯片相对于矩形框架部分倾斜，并将倾斜部分倾斜地设置在舞台部分的背面上的舞台部分上的分离主体的按压部件 舞台部分和物理量传感器芯片，通过按压部件按压舞台部分的背面。

公开(公告)号：US07728445B2

公开(公告)日：2010-06-01

申请号：US11375212

申请日：2006-03-15

申请人： Taketoshi Nakamura ,  Hiroshi Saitoh

发明人： Taketoshi Nakamura ,  Hiroshi Saitoh

IPC分类号： H01L23/29

CPC分类号： H01L23/36 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3114 ,  H01L23/3135 ,  H01L23/3142 ,  H01L23/525 ,  H01L24/10 ,  H01L24/13 ,  H01L24/27 ,  H01L24/96 ,  H01L24/97 ,  H01L2221/68331 ,  H01L2224/04105 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05569 ,  H01L2224/056 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/136 ,  H01L2224/13644 ,  H01L2224/16 ,  H01L2224/274 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/05099

摘要： A semiconductor device production method which includes steps of: preparing a wafer on which multiple integrated circuits are formed on a principal face; forming a rewiring which is electrically connected to the integrated circuits via a pad electrode; and dicing the wafer after forming an electrode terminal on the rewiring, including steps of: forming a first resin layer by sealing at least the rewiring and the electrode terminal formed on the principal face of the wafer with a first resin; processing a first dicing from a back face of the wafer to the principal face of the wafer or halfway to the first resin layer when the first resin layer is formed; forming a second resin layer by sealing a cut line outlined upon the first dicing and the back face of the wafer continuously with a first resin; and processing a second dicing while leaving the second resin layer which covers a side face outlined upon the first dicing.

摘要翻译： 一种半导体器件制造方法，包括以下步骤：准备在主面上形成多个集成电路的晶片; 形成通过焊盘电极电连接到集成电路的重新布线; 以及在重新布线后形成电极端子之后对晶片进行切割，包括以下步骤：通过用第一树脂密封至少重新布线和形成在晶片的主面上的电极端子来形成第一树脂层; 当形成所述第一树脂层时，将晶片的背面的第一切割处理到所述晶片的主面或者到所述第一树脂层的中间; 通过用第一树脂连续地密封所述晶片的第一切割和所述背面上的切割线来形成第二树脂层; 以及处理第二切割，同时留下覆盖第一切割时所概述的侧面的第二树脂层。