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1.
公开(公告)号:US11756844B2
公开(公告)日:2023-09-12
申请号:US17170120
申请日:2021-02-08
发明人: Wei Zhou , Bret K. Street , Mark E. Tuttle
IPC分类号: H01L23/532 , H01L23/10 , H01L25/065 , H01L23/00 , H01L23/04 , H01L25/00
CPC分类号: H01L23/10 , H01L23/04 , H01L24/17 , H01L24/67 , H01L24/70 , H01L24/73 , H01L24/81 , H01L24/89 , H01L25/0657 , H01L25/50 , H01L24/16 , H01L2224/0401 , H01L2224/05647 , H01L2224/131 , H01L2224/13025 , H01L2224/16145 , H01L2224/16146 , H01L2224/16227 , H01L2224/17181 , H01L2224/17517 , H01L2224/8109 , H01L2224/81075 , H01L2224/8182 , H01L2224/81122 , H01L2224/81815 , H01L2225/06513 , H01L2225/06517 , H01L2225/06527 , H01L2225/06541 , H01L2225/06575 , H01L2225/06593 , H01L2924/01029 , H01L2924/3025 , H01L2224/131 , H01L2924/014 , H01L2924/00014
摘要: A semiconductor device includes a substrate; a die attached over the substrate; and a metal enclosure continuously encircling a space and extending vertically between the substrate and the die.
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公开(公告)号:US20170365497A1
公开(公告)日:2017-12-21
申请号:US15596485
申请日:2017-05-16
申请人: Alan S. EDELSTEIN
IPC分类号: H01L21/68 , H01L23/00 , G01B11/27 , G01B21/24 , H01L21/66 , G01K7/02 , H01L25/00 , H01L25/065
CPC分类号: H01L21/681 , G01B11/272 , G01B21/24 , G01K7/02 , G01Q60/22 , G01Q80/00 , G05B19/402 , G05B2219/37387 , H01L22/20 , H01L24/16 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2224/16145 , H01L2224/16225 , H01L2224/81007 , H01L2224/81122 , H01L2224/8117 , H01L2224/8118 , H01L2224/81908 , H02N2/028
摘要: Method for positioning and orienting a first object relative to a second object. Method includes positioning a near field transducer having an aperture on the first object, and directing a laser light toward the aperture of the near field transducer on the first object to create an effervescent wave on the other side of the aperture. Positioning a sensor on the second object for detecting the effervescent wave from the near field transducer. Providing an algorithm, and using information obtained from the sensor on the second object in the algorithm to control a nanopositioning system to position one of the first and second objects in a desired position and orientation relative to the other one of the first and second objects. One or both of the first and second objects may be an interposer, such as a silicon or glass interposer.
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公开(公告)号:US20170358549A1
公开(公告)日:2017-12-14
申请号:US15543113
申请日:2016-01-13
IPC分类号: H01L23/00 , H01L25/065 , H01L25/00
CPC分类号: H01L24/27 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L25/0657 , H01L25/50 , H01L2224/11003 , H01L2224/111 , H01L2224/13078 , H01L2224/1308 , H01L2224/131 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13157 , H01L2224/13164 , H01L2224/1319 , H01L2224/133 , H01L2224/13686 , H01L2224/1369 , H01L2224/1403 , H01L2224/16058 , H01L2224/16059 , H01L2224/16146 , H01L2224/16147 , H01L2224/16227 , H01L2224/16235 , H01L2224/16237 , H01L2224/17107 , H01L2224/27003 , H01L2224/271 , H01L2224/27515 , H01L2224/29082 , H01L2224/2919 , H01L2224/2929 , H01L2224/29387 , H01L2224/32145 , H01L2224/32225 , H01L2224/73104 , H01L2224/81101 , H01L2224/81122 , H01L2224/81903 , H01L2224/83101 , H01L2224/83122 , H01L2224/83203 , H01L2224/83856 , H01L2224/9211 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06565 , H01L2225/06589 , H01L2924/00015 , H01L2924/3841 , H01L2224/83851 , H01L2224/81 , H01L2224/83 , H01L2924/00014 , H01L2924/014 , H01L2924/00012 , H01L2924/0635 , H01L2924/0665 , H01L2924/05442 , H01L2924/05432
摘要: Provided is a multilayer substrate including laminated semiconductor substrates each having a penetrating hole (hereinafter referred to as through hole) having a plated film formed in the inner surface. The multilayer substrate has excellent conduction characteristics and can be manufactured at low cost. Conductive particles are selectively present at a position where the through holes face each other as viewed in a plan view of the multilayer substrate. The multilayer substrate has a connection structure in which the facing through holes are connected by the conductive particles, and the semiconductor substrates each having the through hole are bonded by an insulating adhesive.
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公开(公告)号:US20170162613A1
公开(公告)日:2017-06-08
申请号:US15366016
申请日:2016-12-01
发明人: Yoram Karni , Inna Lukomsky , Eran Avnon
IPC分类号: H01L27/146
CPC分类号: H01L27/1469 , H01L23/544 , H01L23/562 , H01L24/06 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L27/14634 , H01L27/14636 , H01L2223/5442 , H01L2223/54426 , H01L2223/54473 , H01L2224/06131 , H01L2224/13109 , H01L2224/14131 , H01L2224/16105 , H01L2224/16108 , H01L2224/81048 , H01L2224/81122 , H01L2224/81129 , H01L2224/8113 , H01L2224/81132 , H01L2224/81194 , H01L2224/81815 , H01L2224/81948 , H01L2225/06513 , H01L2225/06593 , H01L2924/351 , H01L2924/381 , H01L2924/014
摘要: A photodetector-array and fabrication method thereof are disclosed. The photodetector-array includes a first and second semiconductor structures having respective active regions defining respective pluralities of active photodetectors and active readout integrated circuit pixels (RICPs) electronically connectable to one another respectively. The first and second semiconductor structures are made with different semiconductor materials/compositions having different first and second coefficients of thermal expansion (CTEs) respectively. The pitch distances of the active photodetectors and the pitch distances of the respective active RICPs are configured in accordance with the difference between the first and second CTEs, such that at high temperatures, at which electrical coupling between the first and second semiconductor structures is performed, the electric contacts of the active photodetectors and of their respective RICPs overlap. Accordingly, after the first and second semiconductor structures are bonded together, at least 99.5% of the active photodetector are electrically connected with their respective RICPs.
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公开(公告)号:US20150333033A1
公开(公告)日:2015-11-19
申请号:US14811466
申请日:2015-07-28
发明人: Chien Ling Hwang , Ying-Jui Huang , Yi-Li Hsiao
CPC分类号: H01L24/97 , B23K1/0016 , B23K1/203 , B23K3/047 , B23K3/082 , H01L21/67144 , H01L24/75 , H01L24/81 , H01L24/95 , H01L2224/16225 , H01L2224/16227 , H01L2224/75183 , H01L2224/7565 , H01L2224/75702 , H01L2224/75753 , H01L2224/759 , H01L2224/7598 , H01L2224/81024 , H01L2224/81122 , H01L2224/81169 , H01L2224/81801 , H01L2924/00014 , H01L2924/15311 , H01L2224/0401
摘要: A method includes moving a first bond head along a first guide apparatus for a first loop. The first guide apparatus is configured in a ring shape. The method also includes picking up a first die using the first bond head during the first loop, and aligning the first die with a first package substrate. The aligning the first die with the first package substrate includes moving the first package substrate in a first direction and a second direction. The first direction and the second direction are contained in a first plane parallel to the first loop. The method further includes placing the first die over the first package substrate during the first loop.
摘要翻译: 一种方法包括沿第一引导装置移动第一结合头用于第一回路。 第一引导装置被构造成环形。 该方法还包括在第一回路期间使用第一接合头拾取第一管芯,并将第一管芯与第一封装衬底对准。 将第一管芯与第一封装衬底对准包括在第一方向和第二方向上移动第一封装衬底。 第一方向和第二方向包含在与第一回路平行的第一平面中。 该方法还包括在第一回路期间将第一管芯放置在第一封装衬底上。
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公开(公告)号:US07830011B2
公开(公告)日:2010-11-09
申请号:US11076055
申请日:2005-03-10
申请人: Kentaro Nomoto , Yuki Igawa , Hiroshi Saitoh , Takashi Sato , Toshio Ohashi , Yoshihiro Ohkura
发明人: Kentaro Nomoto , Yuki Igawa , Hiroshi Saitoh , Takashi Sato , Toshio Ohashi , Yoshihiro Ohkura
IPC分类号: H01L23/48
CPC分类号: H01L24/17 , H01L23/12 , H01L23/34 , H01L23/48 , H01L23/50 , H01L23/52 , H01L2224/02377 , H01L2224/0401 , H01L2224/05124 , H01L2224/05147 , H01L2224/05166 , H01L2224/05171 , H01L2224/05548 , H01L2224/05556 , H01L2224/05559 , H01L2224/05569 , H01L2224/05571 , H01L2224/05624 , H01L2224/05647 , H01L2224/13 , H01L2224/13022 , H01L2224/13023 , H01L2224/131 , H01L2224/14132 , H01L2224/16238 , H01L2224/81122 , H01L2224/8113 , H01L2224/81132 , H01L2924/00011 , H01L2924/01066 , H01L2924/01067 , H01L2924/01068 , H01L2924/01322 , H01L2924/10158 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/351 , H01L2924/00 , H01L2924/014 , H01L2924/00012 , H01L2224/81805 , H01L2924/00014
摘要: A semiconductor device, encapsulated in a wafer level chip size package (WLCSP), includes a plurality of pad electrodes formed on the surface of a semiconductor chip, wherein a first insulating layer is formed on the surface of the semiconductor chip except the pad electrodes; a plurality of connection electrodes and at least one heat-dissipation electrode are formed on the surface of the first insulating layer; the pad electrodes and the connection electrodes are mutually connected via a first wiring portion; the heat-dissipation electrode is connected with a second wiring portion; and a second insulating layer is formed to enclose the electrodes and wiring portions, wherein the second wiring portion is arranged in proximity to a heating portion of the semiconductor chip and is formed on the surface of the first insulating layer except the prescribed region corresponding to the first wiring portion.
摘要翻译: 封装在晶片级芯片尺寸封装(WLCSP)中的半导体器件包括形成在半导体芯片的表面上的多个焊盘电极,其中在除了焊盘电极之外的半导体芯片的表面上形成第一绝缘层; 多个连接电极和至少一个散热电极形成在第一绝缘层的表面上; 焊盘电极和连接电极经由第一布线部分相互连接; 所述散热电极与第二配线部连接, 并且形成第二绝缘层以包围所述电极和布线部分,其中所述第二布线部分布置在所述半导体芯片的加热部分附近,并且形成在除了对应于所述半导体芯片的规定区域之外的所述第一绝缘层的表面上 第一接线部。
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7.
公开(公告)号:US5986348A
公开(公告)日:1999-11-16
申请号:US268770
申请日:1999-03-15
申请人: Atsuyuki Fukano
发明人: Atsuyuki Fukano
CPC分类号: H01L25/50 , H01L24/10 , H01L24/13 , H01L24/81 , H01L2224/13 , H01L2224/13099 , H01L2224/81122 , H01L2224/81801 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01058 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14
摘要: A unique integrated circuit device and method for using same is disclosed. The integrated circuit includes a plurality of bonding pads. Coupled to each bonding pads is a ferromagnetic material and an external connector, such as a solder bump. The ferromagnetic material is isolated to an area associated with each bonding pad. When the ferromagnetic material is magnetized, it is capable of aligning the solder bump to a connection point of another device, as long as the connection point is magnetically attracted. The other device may be a second integrated circuit device or a circuit board. As a result, the bonding pad aligns with and connects to the connection point.
摘要翻译: 公开了一种独特的集成电路装置及其使用方法。 集成电路包括多个接合焊盘。 耦合到每个接合焊盘是铁磁材料和外部连接器,例如焊料凸块。 铁磁材料被隔离到与每个接合焊盘相关的区域。 当铁磁材料被磁化时,只要连接点被磁吸引,就可以将焊料凸点对准另一个装置的连接点。 另一个装置可以是第二集成电路装置或电路板。 结果,接合焊盘与连接点对准并连接到连接点。
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公开(公告)号:US11901325B2
公开(公告)日:2024-02-13
申请号:US15543113
申请日:2016-01-13
IPC分类号: H01L23/498 , H01L23/48 , H01L23/00 , H01L25/065 , H01L25/00
CPC分类号: H01L24/27 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/29 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L25/0657 , H01L25/50 , H01L24/32 , H01L2224/111 , H01L2224/11003 , H01L2224/131 , H01L2224/133 , H01L2224/1308 , H01L2224/1319 , H01L2224/1369 , H01L2224/13078 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13157 , H01L2224/13164 , H01L2224/13686 , H01L2224/1403 , H01L2224/16058 , H01L2224/16059 , H01L2224/16146 , H01L2224/16147 , H01L2224/16227 , H01L2224/16235 , H01L2224/16237 , H01L2224/17107 , H01L2224/271 , H01L2224/27003 , H01L2224/27515 , H01L2224/2919 , H01L2224/2929 , H01L2224/29082 , H01L2224/29387 , H01L2224/32145 , H01L2224/32225 , H01L2224/73104 , H01L2224/81101 , H01L2224/81122 , H01L2224/81903 , H01L2224/83101 , H01L2224/83122 , H01L2224/83203 , H01L2224/83856 , H01L2224/9211 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06565 , H01L2225/06589 , H01L2924/00015 , H01L2924/3841 , H01L2924/00015 , H01L2224/83851 , H01L2224/9211 , H01L2224/81 , H01L2224/83 , H01L2224/83203 , H01L2924/00014 , H01L2224/131 , H01L2924/014 , H01L2224/81122 , H01L2924/00012 , H01L2224/83122 , H01L2924/00012 , H01L2224/271 , H01L2924/00012 , H01L2224/13155 , H01L2924/00014 , H01L2224/13157 , H01L2924/00014 , H01L2224/13139 , H01L2924/00014 , H01L2224/13147 , H01L2924/00014 , H01L2224/13144 , H01L2924/00014 , H01L2224/13164 , H01L2924/00014 , H01L2224/133 , H01L2924/00014 , H01L2224/2919 , H01L2924/0635 , H01L2224/2919 , H01L2924/0665 , H01L2224/2929 , H01L2924/0635 , H01L2224/2929 , H01L2924/0665 , H01L2224/29387 , H01L2924/05442 , H01L2224/29387 , H01L2924/05432 , H01L2224/29387 , H01L2924/00012 , H01L2224/1319 , H01L2924/00014 , H01L2224/111 , H01L2924/00012 , H01L2224/1369 , H01L2924/00014 , H01L2224/13686 , H01L2924/00014
摘要: Provided is a multilayer substrate including laminated semiconductor substrates each having a penetrating hole (hereinafter referred to as through hole) having a plated film formed in the inner surface. The multilayer substrate has excellent conduction characteristics and can be manufactured at low cost. Conductive particles are selectively present at a position where the through holes face each other as viewed in a plan view of the multilayer substrate. The multilayer substrate has a connection structure in which the facing through holes are connected by the conductive particles, and the semiconductor substrates each having the through hole are bonded by an insulating adhesive.
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公开(公告)号:US09966357B2
公开(公告)日:2018-05-08
申请号:US14811466
申请日:2015-07-28
发明人: Chien Ling Hwang , Ying-Jui Huang , Yi-Li Hsiao
CPC分类号: H01L24/97 , B23K1/0016 , B23K1/203 , B23K3/047 , B23K3/082 , H01L21/67144 , H01L24/75 , H01L24/81 , H01L24/95 , H01L2224/16225 , H01L2224/16227 , H01L2224/75183 , H01L2224/7565 , H01L2224/75702 , H01L2224/75753 , H01L2224/759 , H01L2224/7598 , H01L2224/81024 , H01L2224/81122 , H01L2224/81169 , H01L2224/81801 , H01L2924/00014 , H01L2924/15311 , H01L2224/0401
摘要: A method includes moving a first bond head along a first guide apparatus for a first loop. The first guide apparatus is configured in a ring shape. The method also includes picking up a first die using the first bond head during the first loop, and aligning the first die with a first package substrate. The aligning the first die with the first package substrate includes moving the first package substrate in a first direction and a second direction. The first direction and the second direction are contained in a first plane parallel to the first loop. The method further includes placing the first die over the first package substrate during the first loop.
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公开(公告)号:US09105760B2
公开(公告)日:2015-08-11
申请号:US14040004
申请日:2013-09-27
发明人: Chien Ling Hwang , Ying-Jui Huang , Yi-Li Hsiao
CPC分类号: H01L24/97 , B23K1/0016 , B23K1/203 , B23K3/047 , B23K3/082 , H01L21/67144 , H01L24/75 , H01L24/81 , H01L24/95 , H01L2224/16225 , H01L2224/16227 , H01L2224/75183 , H01L2224/7565 , H01L2224/75702 , H01L2224/75753 , H01L2224/759 , H01L2224/7598 , H01L2224/81024 , H01L2224/81122 , H01L2224/81169 , H01L2224/81801 , H01L2924/00014 , H01L2924/15311 , H01L2224/0401
摘要: An apparatus includes a guide ring, and a bond head installed on the guide ring. The bond head is configured to move in loops along the guide ring. The bond head is configured to pick up dies and place the dies during the loops.
摘要翻译: 一种装置包括导向环和安装在引导环上的接合头。 结合头被构造成沿着导向环移动成环。 结合头被配置为拾取模具并且在回路期间放置模具。
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