Non-Volatile Magnetic Memory with Low Switching Current and High Thermal Stability
    41.
    发明申请
    Non-Volatile Magnetic Memory with Low Switching Current and High Thermal Stability 有权
    具有低开关电流和高热稳定性的非易失性磁存储器

    公开(公告)号:US20120205761A1

    公开(公告)日:2012-08-16

    申请号:US13453928

    申请日:2012-04-23

    Abstract: A non-volatile current-switching magnetic memory element includes a bottom electrode, a pinning layer formed on top of the bottom electrode, and a fixed layer formed on top of the pinning layer. The memory element further includes a tunnel layer formed on top of the pinning layer, a first free layer formed on top of the tunnel layer, a granular film layer formed on top of the free layer, a second free layer formed on top of the granular film layer, a cap layer formed on top of the second layer and a top electrode formed on top of the cap layer.

    Abstract translation: 非易失性电流切换磁存储元件包括底电极,形成在底电极顶部的钉扎层和形成在钉扎层顶部上的固定层。 存储元件还包括形成在钉扎层顶部的隧道层,形成在隧道层顶部上的第一自由层,形成在自由层顶部上的颗粒膜层,形成在颗粒状的顶部上的第二自由层 膜层,形成在第二层的顶部上的盖层和形成在盖层的顶部上的顶部电极。

    LOW CURRENT SWITCHING MAGNETIC TUNNEL JUNCTION DESIGN FOR MAGNETIC MEMORY USING DOMAIN WALL MOTION
    45.
    发明申请
    LOW CURRENT SWITCHING MAGNETIC TUNNEL JUNCTION DESIGN FOR MAGNETIC MEMORY USING DOMAIN WALL MOTION 有权
    使用域墙运动的磁流记忆的低电流开关磁通连接设计

    公开(公告)号:US20090109739A1

    公开(公告)日:2009-04-30

    申请号:US12255624

    申请日:2008-10-21

    Abstract: A multi-state low-current-switching magnetic memory element (magnetic memory element) comprising a free layer, two stacks, and a magnetic tunneling junction is disclosed. The stacks and magnetic tunneling junction are disposed upon surfaces of the free layer, with the magnetic tunneling junction located between the stacks. The stacks pin magnetic domains within the free layer, creating a free layer domain wall. A current passed from stack to stack pushes the domain wall, repositioning the domain wall within the free layer. The position of the domain wall relative to the magnetic tunnel junction corresponds to a unique resistance value, and passing current from a stack to the magnetic tunnel junction reads the magnetic memory element's resistance. Thus, unique memory states may be achieved by moving the domain wall.

    Abstract translation: 公开了一种包括自由层,两个堆叠和磁性隧道结的多状态低电流切换磁存储元件(磁存储元件)。 堆叠和磁性隧道结设置在自由层的表面上,磁性隧道结位于堆叠之间。 堆叠在自由层内引导磁畴,产生自由层畴壁。 从堆栈传递到堆栈的电流推动域壁,重新定位自由层内的域壁。 畴壁相对于磁性隧道结的位置对应于唯一的电阻值,并且将电流从堆叠传递到磁性隧道结读取磁存储元件的电阻。 因此,可以通过移动域壁来实现唯一的记忆状态。

    Non-Volatile Magnetic Memory with Low Switching Current and High Thermal Stability
    46.
    发明申请
    Non-Volatile Magnetic Memory with Low Switching Current and High Thermal Stability 有权
    具有低开关电流和高热稳定性的非易失性磁存储器

    公开(公告)号:US20080191251A1

    公开(公告)日:2008-08-14

    申请号:US11739648

    申请日:2007-04-24

    Abstract: One embodiment of the present invention includes a an embodiment of the present invention includes a non-volatile current-switching magnetic memory element including a bottom electrode; a pinning layer formed on top of the bottom electrode; a fixed layer formed on top of the pinning layer; a tunnel layer formed on top of the pinning layer; a first free layer formed on top of the tunnel layer; a granular film layer formed on top of the free layer; a second free layer formed on top of the granular film layer; a cap layer formed on top of the second layer; and a top electrode formed on top of the cap layer.

    Abstract translation: 本发明的一个实施例包括本发明的一个实施例,其包括一个包括底部电极的非易失性电流切换磁存储元件; 形成在底部电极顶部的钉扎层; 形成在钉扎层顶部的固定层; 形成在钉扎层之上的隧道层; 形成在隧道层顶部的第一自由层; 形成在自由层顶部的粒状膜层; 形成在所述粒状膜层顶部的第二自由层; 盖层,形成在第二层的顶部; 以及形成在盖层顶部上的顶部电极。

    Redeposition control in MRAM fabrication process
    49.
    发明授权
    Redeposition control in MRAM fabrication process 有权
    MRAM制造工艺中的再沉积控制

    公开(公告)号:US08883520B2

    公开(公告)日:2014-11-11

    申请号:US13530381

    申请日:2012-06-22

    CPC classification number: H01L43/02 H01L27/222 H01L43/12

    Abstract: Methods and structures are described to reduce metallic redeposition material in the memory cells, such as MTJ cells, during pillar etching. One embodiment forms metal studs on top of the landing pads in a dielectric layer that otherwise covers the exposed metal surfaces on the wafer. Another embodiment patterns the MTJ and bottom electrode separately. The bottom electrode mask then covers metal under the bottom electrode. Another embodiment divides the pillar etching process into two phases. The first phase etches down to the lower magnetic layer, then the sidewalls of the barrier layer are covered with a dielectric material which is then vertically etched. The second phase of the etching then patterns the remaining layers. Another embodiment uses a hard mask above the top electrode to etch the MTJ pillar until near the end point of the bottom electrode, deposits a dielectric, then vertically etches the remaining bottom electrode.

    Abstract translation: 描述了方法和结构以在柱蚀刻期间减少存储器单元(例如MTJ电池)中的金属沉积材料。 一个实施例在位于晶片上暴露的金属表面的电介质层中的着陆焊盘的顶部上形成金属螺柱。 另一个实施例分别对MTJ和底部电极进行图案化。 底部电极掩模然后覆盖底部电极下面的金属。 另一实施例将柱蚀刻工艺分为两个阶段。 第一阶段蚀刻到较低的磁性层,然后阻挡层的侧壁被电介质材料覆盖,然后将其垂直蚀刻。 蚀刻的第二阶段然后对剩余的层进行图案化。 另一个实施例使用顶部电极上方的硬掩模来蚀刻MTJ柱直到靠近底部电极的端点,沉积电介质,然后垂直蚀刻剩余的底部电极。

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