公开(公告)号：US20250107305A1

公开(公告)日：2025-03-27

申请号：US18971729

申请日：2024-12-06

Applicant: ROHM CO., LTD.

Inventor： Masahiko KOBAYAKAWA

IPC: H01L33/62 ,  H01L23/495 ,  H01L33/48 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/64

Abstract: A semiconductor device includes a lead frame, a semiconductor element mounted on the top surface of the bonding region, and a case covering part of the lead frame. The bottom surface of the bonding region is exposed to the outside of the case. The lead frame includes a thin extension extending from the bonding region and having a top surface which is flush with the top surface of the bonding region. The thin extension has a bottom surface which is offset from the bottom surface of the bonding region toward the top surface of the bonding region.

公开(公告)号：US20230411581A1

公开(公告)日：2023-12-21

申请号：US18459763

申请日：2023-09-01

Applicant: ROHM CO., LTD.

Inventor： Masahiko KOBAYAKAWA ,  Kazuhiro MIREBA ,  Shintaro YASUDA ,  Junichi ITAI ,  Taisuke OKADA

IPC: H01L33/62 ,  H01L23/495 ,  H01L23/31 ,  H01L23/488 ,  H01L33/48 ,  H01L33/52 ,  H01L25/075 ,  H01L33/64 ,  H01L33/54 ,  H01L23/48 ,  H01L33/50 ,  H01L33/56 ,  H01L33/60

CPC classification number: H01L33/62 ,  H01L23/49541 ,  H01L23/4951 ,  H01L23/31 ,  H01L23/488 ,  H01L33/48 ,  H01L23/49575 ,  H01L23/49517 ,  H01L33/52 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/642 ,  H01L33/64 ,  H01L23/49568 ,  H01L33/483 ,  H01L33/54 ,  H01L23/48 ,  H01L23/495 ,  H01L23/49503 ,  H01L23/49548 ,  H01L33/502 ,  H01L33/56 ,  H01L33/60 ,  H01L33/647 ,  H01L25/167

Abstract: A semiconductor light emitting device includes a semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.

公开(公告)号：US20220384699A1

公开(公告)日：2022-12-01

申请号：US17885181

申请日：2022-08-10

Applicant: ROHM CO., LTD.

Inventor： Masahiko KOBAYAKAWA ,  Kazuhiro MIREBA ,  Shintaro YASUDA ,  Junichi ITAI ,  Taisuke OKADA

IPC: H01L33/62 ,  H01L23/495 ,  H01L23/31 ,  H01L23/488 ,  H01L33/48 ,  H01L33/52 ,  H01L25/075 ,  H01L33/64 ,  H01L33/54 ,  H01L23/48 ,  H01L33/50 ,  H01L33/56 ,  H01L33/60

Abstract: A semiconductor light emitting device includes a semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.

公开(公告)号：US20210057312A1

公开(公告)日：2021-02-25

申请号：US17091690

申请日：2020-11-06

Applicant: ROHM CO., LTD.

Inventor： Masahiko KOBAYAKAWA ,  Kazuhiro MIREBA ,  Shintaro YASUDA ,  Junichi ITAI ,  Taisuke OKADA

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/488 ,  H01L33/48 ,  H01L33/52 ,  H01L25/075 ,  H01L33/64 ,  H01L33/62 ,  H01L33/54 ,  H01L23/48 ,  H01L33/50 ,  H01L33/56 ,  H01L33/60

Abstract: A semiconductor light emitting device includes a semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.

公开(公告)号：US20200343428A1

公开(公告)日：2020-10-29

申请号：US16928688

申请日：2020-07-14

Applicant: ROHM CO., LTD.

Inventor： Masahiko KOBAYAKAWA ,  Shinji ISOKAWA ,  Riki SHIMABUKURO

IPC: H01L33/64 ,  H01L33/62 ,  H01L25/075 ,  H01L33/48 ,  H01L33/50 ,  H01L33/54 ,  H01L33/60 ,  H01L27/02 ,  H01L29/866 ,  H01L33/32 ,  H01L33/56

Abstract: An LED (Light Emitting Diode) module includes an LED unit having one or more LED chips and a case. The case includes: a body including a base plate made of ceramic, the base plate having a main surface and a bottom surface opposite to the main surface; a through conductor penetrating through the base plate; and one or more pads formed on the main surface and making conductive connection with the through conductor, the pads mounting thereon the LED unit. The through conductor includes a main surface exposed portion exposed to the main surface and overlapping the LED unit when viewed from top, a bottom surface reaching portion connected to the main surface exposed portion and reaching the bottom surface. The pads cover at least a portion of the main surface exposed portion.

公开(公告)号：US20190393139A1

公开(公告)日：2019-12-26

申请号：US16562288

申请日：2019-09-05

Applicant: ROHM CO., LTD.

Inventor： Masahiko KOBAYAKAWA ,  Kazuhiro MIREBA ,  Shintaro YASUDA ,  Junichi ITAI ,  Taisuke OKADA

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/488 ,  H01L33/48 ,  H01L33/52 ,  H01L25/075 ,  H01L33/62 ,  H01L33/54 ,  H01L23/48 ,  H01L33/50 ,  H01L33/56 ,  H01L33/60 ,  H01L33/64

Abstract: A semiconductor light emitting device includes semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.

公开(公告)号：US20180331266A1

公开(公告)日：2018-11-15

申请号：US16033610

申请日：2018-07-12

Applicant: ROHM CO., LTD.

Inventor： Masahiko KOBAYAKAWA ,  Shinji ISOKAWA ,  Riki SHIMABUKURO

IPC: H01L33/64 ,  H01L25/075 ,  H01L33/54 ,  H01L33/50 ,  H01L29/866 ,  H01L27/02 ,  H01L33/56 ,  H01L33/32

CPC classification number: H01L33/647 ,  H01L24/73 ,  H01L25/0753 ,  H01L27/0248 ,  H01L29/866 ,  H01L33/32 ,  H01L33/486 ,  H01L33/50 ,  H01L33/502 ,  H01L33/507 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64 ,  H01L33/641 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01322 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An LED (Light Emitting Diode) module includes an LED unit having one or more LED chips and a case. The case includes: a body including a base plate made of ceramic, the base plate having a main surface and a bottom surface opposite to the main surface; a through conductor penetrating through the base plate; and one or more pads formed on the main surface and making conductive connection with the through conductor, the pads mounting thereon the LED unit. The through conductor includes a main surface exposed portion exposed to the main surface and overlapping the LED unit when viewed from top, a bottom surface reaching portion connected to the main surface exposed portion and reaching the bottom surface. The pads cover at least a portion of the main surface exposed portion.

公开(公告)号：US20180331260A1

公开(公告)日：2018-11-15

申请号：US16040082

申请日：2018-07-19

Applicant: ROHM CO., LTD.

Inventor： Masahiko KOBAYAKAWA

IPC: H01L33/44 ,  H01L33/60

CPC classification number: H01L33/44 ,  H01L33/46 ,  H01L33/60 ,  H01L2224/48227 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2924/3025 ,  H01L2924/00

Abstract: An LED module 101 is provided with an LED chip 200 that includes a sub-mount substrate 210 made of Si and a semiconductor layer 220 laminated on the sub-mount substrate 210. The module also includes white resin 280 that does not transmit light from the semiconductor layer 220 and that covers at least part of a side of the sub-mount substrate 210, where the side is connected to the surface on which the semiconductor layer 220 is laminated. These arrangements enhance the brightness of the LED module 101.

公开(公告)号：US20180218967A1

公开(公告)日：2018-08-02

申请号：US15938660

申请日：2018-03-28

Applicant: ROHM CO., LTD.

Inventor： Masahiko KOBAYAKAWA ,  Kazuhiro MIREBA ,  Shintaro YASUDA ,  Junichi ITAI ,  Taisuke OKADA

IPC: H01L23/495 ,  H01L33/64 ,  H01L33/62 ,  H01L33/60 ,  H01L33/56 ,  H01L33/50 ,  H01L23/48 ,  H01L25/075

CPC classification number: H01L23/49503 ,  H01L23/31 ,  H01L23/48 ,  H01L23/495 ,  H01L23/4951 ,  H01L23/49541 ,  H01L23/49548 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/483 ,  H01L33/486 ,  H01L33/502 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

Abstract: A semiconductor light emitting device includes semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.

公开(公告)号：US20180076371A1

公开(公告)日：2018-03-15

申请号：US15818202

申请日：2017-11-20

Applicant: ROHM CO., LTD.

Inventor： Masahiko KOBAYAKAWA ,  Kazuhiro MIREBA ,  Shintaro YASUDA ,  Junichi ITAI ,  Taisuke OKADA

IPC: H01L33/64 ,  H01L33/50 ,  H01L33/56 ,  H01L33/62 ,  H01L25/075 ,  H01L33/60

Abstract: A semiconductor light emitting device includes a semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad. The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.