SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

    公开(公告)号:US20190393354A1

    公开(公告)日:2019-12-26

    申请号:US16481512

    申请日:2018-01-26

    Abstract: A semiconductor device which has favorable electrical characteristics is provided. A method for manufacturing a semiconductor device with high productivity is provided. A method for manufacturing a semiconductor device with a high yield is provided.A method for manufacturing a semiconductor device includes a first step of forming a first insulating layer containing silicon and nitrogen, a second step of adding oxygen in a vicinity of a surface of the first insulating layer, a third step of forming a semiconductor layer containing a metal oxide over and in contact with the first insulating layer, a fourth step of forming a second insulating layer containing oxygen over and in contact with the semiconductor layer, a fifth step of performing plasma treatment in an atmosphere containing oxygen at a first temperature, a sixth step of performing plasma treatment in an atmosphere containing oxygen at a second temperature lower than the first temperature, and a seventh step of forming a third insulating layer containing silicon and nitrogen over the second insulating layer.

    SEMICONDUCTOR DEVICE
    42.
    发明申请

    公开(公告)号:US20190074382A1

    公开(公告)日:2019-03-07

    申请号:US16182075

    申请日:2018-11-06

    Abstract: A semiconductor device comprising a first transistor, a second insulating film, a conductive film, and a capacitor is provided. The first transistor comprises a first oxide semiconductor film, a gate insulating film over the first oxide semiconductor film, and a gate electrode over the gate insulating film. The second insulating film is provided over the gate electrode. The conductive film is electrically connected to the first oxide semiconductor film. The capacitor comprises a second oxide semiconductor film, the second insulating film over the second oxide semiconductor film, and the conductive film over the second insulating film. The first oxide semiconductor film comprises a first region and a second region. Each of a carrier density of the second region and a carrier density of the second oxide semiconductor film is higher than a carrier density of the first region.

    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
    48.
    发明申请
    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF 有权
    半导体器件及其制造方法

    公开(公告)号:US20150311346A1

    公开(公告)日:2015-10-29

    申请号:US14685737

    申请日:2015-04-14

    Abstract: Provided is a transistor with small parasitic capacitance or high frequency characteristics or a semiconductor device including the transistor. An oxide semiconductor film includes a first region in contact with a first conductive film, a second region in contact with a first insulating film, a third region in contact with a third insulating film, a fourth region in contact with a second insulating film, and a fifth region in contact with a second conductive film. The first insulating film is positioned over the first conductive film and the oxide semiconductor film. The second insulating film is positioned over the second conductive film and the oxide semiconductor film. The third insulating film is positioned over the first insulating film, the second insulating film, and the oxide semiconductor film. The third conductive film and the oxide semiconductor film partly overlap with each other with the third insulating film provided therebetween.

    Abstract translation: 提供具有小寄生电容或高频特性的晶体管或包括晶体管的半导体器件。 氧化物半导体膜包括与第一导电膜接触的第一区域,与第一绝缘膜接触的第二区域,与第三绝缘膜接触的第三区域,与第二绝缘膜接触的第四区域,以及 与第二导电膜接触的第五区域。 第一绝缘膜位于第一导电膜和氧化物半导体膜之上。 第二绝缘膜位于第二导电膜和氧化物半导体膜之上。 第三绝缘膜位于第一绝缘膜,第二绝缘膜和氧化物半导体膜上。 第三导电膜和氧化物半导体膜在其间设置有第三绝缘膜,彼此部分重叠。

    DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE

    公开(公告)号:US20250113706A1

    公开(公告)日:2025-04-03

    申请号:US18728171

    申请日:2023-01-11

    Abstract: A display device capable of performing display at high luminance is provided. After a first layer including a first light-emitting material emitting blue light is formed into an island shape over a first pixel electrode, a second layer including a second light-emitting material emitting light with a longer wavelength than blue light is formed into an island shape over a second pixel electrode. Then, an insulating layer overlapping with a region interposed between the first pixel electrode and the second pixel electrode is formed, and a common electrode is formed to cover the first layer, the second layer, and the insulating layer. The insulating layer is formed by performing patterning treatment and etching treatment at least twice.

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