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    Wafer level package and wafer level packaging method
    42.
    发明申请
    Wafer level package and wafer level packaging method 审中-公开
    晶圆级封装和晶圆级封装方法

    公开(公告)号：US20080283989A1

    公开(公告)日：2008-11-20

    申请号：US12153373

    申请日：2008-05-16

    申请人： Won Kyu Jeung ,  Seog Moon Choi ,  Job Ha ,  Sang Hee Park ,  Tae Hoon Kim

    发明人： Won Kyu Jeung ,  Seog Moon Choi ,  Job Ha ,  Sang Hee Park ,  Tae Hoon Kim

    IPC分类号： H01L23/055 ,  H01L21/54

    CPC分类号： H01L23/26 ,  H01L23/055 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Provided are a wafer level package and a wafer level packaging method, which are capable of performing an attaching process at a low temperature and preventing contamination of internal devices. In the wafer level package, a device substrate includes a device region, where a device is formed, and internal pads on the top surface. The internal pads are electrically connected to the device. A cap substrate includes a getter corresponding to the device on the bottom surface. A plurality of sealing/attaching members are provided between the device substrate and the cap substrate to attach the device substrate and the cap substrate and seal the device region and the getter. The sealing/attaching members are formed of polymer. A plurality of vias penetrate the cap substrate and are connected to the internal pads. The getter provided in the sealed space defined by the sealing/attaching members can prevent the devices of the device region from being contaminated by moisture or foreign particles generated during the fabrication process, and the sealing/attaching process can be performed at a lower temperature compared with a typical sealing/attaching process using a metal.

    摘要翻译： 提供了能够在低温下执行附着处理并防止内部装置的污染的晶片级封装和晶片级封装方法。 在晶片级封装中，器件衬底包括其中形成器件的器件区域和顶表面上的内部焊盘。 内部焊盘电连接到设备。 盖基板包括对应于底表面上的装置的吸气剂。 在装置基板和盖基板之间设置多个密​​封/附接构件，以附接装置基板和盖基板，并密封装置区域和吸气剂。 密封/附接构件由聚合物形成。 多个通孔穿过盖基板并连接到内部焊盘。 设置在由密封/附接构件限定的密封空间中的吸气剂可以防止装置区域的装置被制造过程中产生的湿气或异物污染，并且密封/附着过程可以在较低的温度下进行比较 具有典型的使用金属的密封/附着工艺。

    Light emitting diode package having multi-stepped reflecting surface structure and fabrication method thereof
    43.
    发明申请
    Light emitting diode package having multi-stepped reflecting surface structure and fabrication method thereof 有权
    具有多级反射面结构的发光二极管封装及其制造方法

    公开(公告)号：US20070246715A1

    公开(公告)日：2007-10-25

    申请号：US11783948

    申请日：2007-04-13

    申请人： Sang Hyun Shin ,  Seog Moon Choi ,  Young Ki Lee

    发明人： Sang Hyun Shin ,  Seog Moon Choi ,  Young Ki Lee

    IPC分类号： H01L33/00

    CPC分类号： H01L33/483 ,  H01L33/60 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： A high luminance and high output LED package using an LED as a light source and a fabrication method thereof. The LED package includes an Al substrate with a recessed multi-stepped reflecting surface formed therein and a light source composed of LEDs mounted on the reflecting surface and electrically connected to patterned electrodes. The LED package also includes anodized insulation layers formed between the patterned electrodes and the substrate, and an encapsulant covering over the light source of the substrate. The LED package further includes an Al heat radiator formed under the LEDs to enhance heat radiation capacity. According to the present invention, the substrate is made of Al material and anodized to form insulation layers thereon, allowing superior heat radiation effect of the LED, thereby significantly increasing the lifetime and light emission efficiency of the LED package.

    摘要翻译： 使用LED作为光源的高亮度和高输出LED封装及其制造方法。 LED封装包括Al基板，其中形成有凹入的多阶反射表面，以及由安装在反射表面上并与图案化电极电连接的LED组成的光源。 LED封装还包括形成在图案化电极和衬底之间的阳极氧化绝缘层，以及覆盖在衬底的光源上的密封剂。 LED封装还包括形成在LED下面的Al散热器，以增强散热能力。 根据本发明，基板由Al材料制成并阳极氧化以在其上形成绝缘层，从而允许LED的良好的散热效果，从而显着提高LED封装的寿命和发光效率。

    Light emitting diode package, circuit board for light emitting diode package and method of manufacturing the same
    44.
    发明申请
    Light emitting diode package, circuit board for light emitting diode package and method of manufacturing the same 有权
    发光二极管封装，发光二极管封装的电路板及其制造方法

    公开(公告)号：US20070201213A1

    公开(公告)日：2007-08-30

    申请号：US11710436

    申请日：2007-02-26

    申请人： Sang Hyun Shin ,  Seog Moon Choi ,  Young Ki Lee

    发明人： Sang Hyun Shin ,  Seog Moon Choi ,  Young Ki Lee

    IPC分类号： H05K1/14

    CPC分类号： H01L33/486 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/01322 ,  H05K1/053 ,  H05K3/0052 ,  Y10T29/49155 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A circuit board for a light emitting diode package improved in heat radiation efficiency and a manufacturing method thereof. In a simple manufacturing process, insulating layers are formed by anodizing on a portion of a thermally conductive board body and plated with a conductive material. In the light emitting diode package, a board body is made of a thermally conductive metal. Insulating oxidation layers are formed at a pair of opposing edges of the board body. First conductive patterns are formed on the insulating oxidation layers, respectively. Also, second conductive patterns are formed in contact with the board body at a predetermined distance from the first conductive patterns, respectively. The light emitting diode package ensures heat generated from the light emitting diode to radiate faster and more effectively. Additionally, the insulating layers are formed integral with the board body by anodizing, thus enhancing productivity and durance.

    摘要翻译： 一种用于散热效率提高的发光二极管封装的电路板及其制造方法。 在简单的制造工艺中，通过在导热板本体的一部分上阳极氧化并且电镀导电材料来形成绝缘层。 在发光二极管封装中，板体由导热金属制成。 绝缘氧化层形成在板体的一对相对的边缘处。 分别在绝缘氧化层上形成第一导电图案。 此外，第二导电图案分别形成为与板体相距预定距离与第一导电图案接触。 发光二极管封装确保了发光二极管产生的热量更快更有效地辐射。 此外，绝缘层通过阳极氧化与板体形成一体，从而提高生产率和耐久性。

    3D power module package
    46.
    发明授权
    3D power module package 有权
    3D电源模块封装

    公开(公告)号：US08842438B2

    公开(公告)日：2014-09-23

    申请号：US13177270

    申请日：2011-07-06

    申请人： Tae Hoon Kim ,  Jae Cheon Doh ,  Seog Moon Choi

    发明人： Tae Hoon Kim ,  Jae Cheon Doh ,  Seog Moon Choi

    IPC分类号： H05K7/00 ,  H01L23/34 ,  H01L23/31 ,  H01L23/495 ,  H01L23/433 ,  H01L25/16

    CPC分类号： H01L23/3121 ,  H01L23/4334 ,  H01L23/49531 ,  H01L23/49575 ,  H01L25/16 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Disclosed herein is a 3D power module package, including: a power converting unit packaged to include a heat radiating substrate, a power device connected to the heat radiating substrate, and a lead frame; a controlling unit packaged to include a controlling unit substrate and IC and controlling devices mounted on an upper portion of the controlling unit substrate; and an electrical connecting unit electrically connecting the packaged power converting unit and the packaged controlling unit.

    摘要翻译： 本文公开了一种3D功率模块封装，包括：封装成包括散热基板的功率转换单元，连接到散热基板的功率器件和引线框架; 控制单元，其被封装成包括控制单元基板和IC以及安装在所述控制单元基板的上部的控制装置; 以及电连接单元，电连接所述封装的电力转换单元和所述封装的控制单元。

    Transformer having the heat radiation function
    47.
    发明授权
    Transformer having the heat radiation function 失效
    具有放热功能的变压器

    公开(公告)号：US08493167B2

    公开(公告)日：2013-07-23

    申请号：US12981066

    申请日：2010-12-29

    申请人： Jong Man Kim ,  Kyu Bum Han ,  Seog Moon Choi

    发明人： Jong Man Kim ,  Kyu Bum Han ,  Seog Moon Choi

    IPC分类号： H01F27/08

    CPC分类号： H01F27/085

    摘要： Disclosed herein is a transformer having a heat radiation function. The transformer includes a pair of cores having an E-shape and facing and contacting each other to form central pillars and outer peripheral parts, a transforming coil part wound on the central pillars of the pair of cores and dropping voltage, and a heat radiation pipe formed to have a cylindrical shape and positioned inward from the transforming coil part to radiate heat generated from the transforming coil part, thereby well discharging heat generated from the coil.

    摘要翻译： 这里公开了具有散热功能的变压器。 变压器包括一对具有E形并且彼此面对并相互接触以形成中心柱和外围部分的一对铁芯，缠绕在一对铁芯的中心柱上的变压线圈部分和降压电压，以及散热管 形成为具有圆筒形状并且位于从变压线圈部向内的位置，以辐射由变压线圈部产生的热量，从而充分地排出线圈产生的热量。

    Method forming a semiconductor light emitting device with perforations formed within
    48.
    发明授权
    Method forming a semiconductor light emitting device with perforations formed within 有权
    形成其中形成有穿孔的半导体发光器件的方法

    公开(公告)号：US08476090B2

    公开(公告)日：2013-07-02

    申请号：US12952760

    申请日：2010-11-23

    申请人： Sang Hyun Shin ,  Seog Moon Choi ,  Young Ki Lee

    发明人： Sang Hyun Shin ,  Seog Moon Choi ,  Young Ki Lee

    IPC分类号： H01L33/52 ,  H05K3/10

    CPC分类号： H01L33/486 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/01322 ,  H05K1/053 ,  H05K3/0052 ,  Y10T29/49155 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A circuit board for a light emitting diode package improved in heat radiation efficiency and a manufacturing method thereof. In a simple manufacturing process, insulating layers are formed by anodizing on a portion of a thermally conductive board body and plated with a conductive material. In the light emitting diode package, a board body is made of a thermally conductive metal. Insulating oxidation layers are formed at a pair of opposing edges of the board body. First conductive patterns are formed on the insulating oxidation layers, respectively. Also, second conductive patterns are formed in contact with the board body at a predetermined distance from the first conductive patterns, respectively. The light emitting diode package ensures heat generated from the light emitting diode to radiate faster and more effectively. Additionally, the insulating layers are formed integral with the board body by anodizing, thus enhancing productivity and durance.

    摘要翻译： 一种用于散热效率提高的发光二极管封装的电路板及其制造方法。 在简单的制造工艺中，通过在导热板本体的一部分上阳极氧化并且电镀导电材料来形成绝缘层。 在发光二极管封装中，板体由导热金属制成。 绝缘氧化层形成在板体的一对相对的边缘处。 分别在绝缘氧化层上形成第一导电图案。 此外，第二导电图案分别形成为与板体相距预定距离与第一导电图案接触。 发光二极管封装确保了发光二极管产生的热量更快更有效地辐射。 此外，绝缘层通过阳极氧化与板体形成一体，从而提高生产率和耐久性。

    HEAT DISSIPATION DEVICE FOR POWER CONVERSION MODULE
    50.
    发明申请
    HEAT DISSIPATION DEVICE FOR POWER CONVERSION MODULE 有权
    电源转换模块的散热装置

    公开(公告)号：US20120103589A1

    公开(公告)日：2012-05-03

    申请号：US13037803

    申请日：2011-03-01

    申请人： Young Ho Sohn ,  Kyu Bum Han ,  Young Jin Cho ,  Seog Moon Choi

    发明人： Young Ho Sohn ,  Kyu Bum Han ,  Young Jin Cho ,  Seog Moon Choi

    IPC分类号： F28F7/00

    CPC分类号： H05K7/209 ,  H05K7/20409

    摘要： Disclosed herein is a heat dissipation device for a power conversion module. The device includes a casing, a high-heat-dissipation heat sink and a circuit board. The casing includes a heat-dissipation fin unit which has heat dissipation fins arranged at positions spaced apart from each other by predetermined intervals. The casing has a mounting space therein. The high-heat-dissipation heat sink is installed in the mounting space of the casing. The circuit board is coupled to a lower surface of the casing. Therefore, the weight and size of the heat dissipation device can be reduced. In addition, the heat sink and the casing having the heat dissipation fins dissipate heat at the same time, thus enhancing the heat dissipation efficiency. Moreover, in an optimal design, the high-heat-dissipation heat sink is located at a position corresponding to a part which generates high heat so that the heat dissipation efficiency can be maximized.

    摘要翻译： 这里公开了一种用于电力转换模块的散热装置。 该装置包括壳体，高散热散热器和电路板。 壳体包括散热翅片单元，其散热片布置在彼此间隔预定间隔的位置处。 壳体在其中具有安装空间。 高散热散热器安装在外壳的安装空间中。 电路板耦合到壳体的下表面。 因此，可以减小散热装置的重量和尺寸。 此外，散热片和具有散热片的壳体同时散热，从而提高散热效率。 此外，在最佳设计中，高散热散热器位于与产生高热量的部分相对应的位置，从而可以使散热效率最大化。