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    METHOD FOR MANUFACTURING DISPLAY DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
    43.
    发明申请
    METHOD FOR MANUFACTURING DISPLAY DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE 有权
    用于制造显示器件的方法和用于制造电子器件的方法

    公开(公告)号：US20170033287A1

    公开(公告)日：2017-02-02

    申请号：US15213767

    申请日：2016-07-19

    Applicant: Semiconductor Energy Laboratory Co., Ltd.

    Inventor： Akihiro CHIDA

    IPC: H01L51/00 ,  H01L51/56

    CPC classification number: H01L51/003 ,  G02F1/133305 ,  G02F1/134309 ,  G02F1/1345 ,  G02F1/136213 ,  G02F1/1368 ,  G02F2001/13613 ,  H01L27/3276 ,  H01L51/0097 ,  H01L51/56 ,  H01L2227/323 ,  H01L2227/326 ,  H01L2251/5338

    Abstract: Provided is a method for manufacturing a highly reliable display device. The method includes steps of providing a first layer, a first insulating layer, an electrode, and a second insulating layer over a first surface of a first substrate; removing a part of the second insulating layer to provide a first opening; providing a display element and a second layer over the second insulating layer; providing a third layer and a third insulating layer over a second surface of a second substrate; removing part of the third layer and part of the third insulating layer to provide a second opening; overlapping the first substrate and the second substrate with a bonding layer positioned therebetween such that the first surface and the second surface face each other and the first opening and the second opening have an overlap region; separating the first substrate and the first layer from the first insulating layer; providing a third substrate such that the first insulating layer and the third substrate overlap with each other; separating the second substrate, part of the bonding layer, part of the second layer, and the third layer from the third insulating layer; and providing a fourth substrate such that the third insulating layer and the fourth substrate overlap with each other.

    Abstract translation: 提供一种用于制造高度可靠的显示装置的方法。 该方法包括在第一衬底的第一表面上提供第一层，第一绝缘层，电极和第二绝缘层的步骤; 去除所述第二绝缘层的一部分以提供第一开口; 在所述第二绝缘层上提供显示元件和第二层; 在第二基板的第二表面上提供第三层和第三绝缘层; 去除第三层的一部分和第三绝缘层的一部分以提供第二开口; 与所述第一基板和所述第二基板重叠，所述接合层位于所述第一基板和所述第二基板之间，使得所述第一表面和所述第二表面彼此面对，并且所述第一开口和所述第二开口具有重叠 将第一基板和第一层与第一绝缘层分离; 提供第三基板，使得第一绝缘层和第三基板彼此重叠; 从所述第三绝缘层分离所述第二基板，所述结合层的一部分，所述第二层的一部分和所述第三层; 以及提供第四基板，使得第三绝缘层和第四基板彼此重叠。

    Light-Emitting Device, Module, Electronic Device, and Method for Manufacturing Light-Emitting Device
    44.
    发明申请
    Light-Emitting Device, Module, Electronic Device, and Method for Manufacturing Light-Emitting Device 有权
    发光装置，模块，电子装置以及制造发光装置的方法

    公开(公告)号：US20160111485A1

    公开(公告)日：2016-04-21

    申请号：US14882918

    申请日：2015-10-14

    Applicant: Semiconductor Energy Laboratory Co., Ltd.

    Inventor： Akihiro CHIDA

    IPC: H01L27/32 ,  H01L51/56 ,  H01L51/52

    CPC classification number: H01L51/5246 ,  H01L27/322 ,  H01L27/3262 ,  H01L27/3276 ,  H01L51/0097 ,  H01L51/56 ,  H01L2227/323 ,  H01L2251/5338 ,  H01L2251/558 ,  Y02E10/549 ,  Y02P70/521

    Abstract: A light-emitting element, a bonding layer, and a frame-like partition are formed over a substrate. The partition is provided to surround the bonding layer and the light-emitting element, with a gap left between the partition and the bonding layer. A pair of substrates overlap with each other under a reduced-pressure atmosphere and then exposed to an air atmosphere or a pressurized atmosphere, whereby the reduced-pressure state of a space surrounded by the pair of substrates and the partition is maintained and atmospheric pressure is applied to the pair of substrates. Alternatively, a light-emitting element and a bonding layer are formed over a substrate. A pair of substrates overlap with each other, and then, pressure is applied to the bonding layer with the use of a member having a projection before or at the same time as curing of the bonding layer.

    Abstract translation: 在基板上形成发光元件，接合层和框状隔板。 隔板被设置为围绕结合层和发光元件，间隔物留在隔板和接合层之间。 一对基板在减压气氛下彼此重叠，然后暴露于空气气氛或加压气氛中，由此保持由一对基板和隔板包围的空间的减压状态，并且大气压力为 应用于一对基板。 或者，在基板上形成发光元件和接合层。 一对基板彼此重叠，然后使用在接合层固化之前或同时具有突出部件的构件将压力施加到接合层。

    SEMICONDUCTOR SUBSTRATE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    45.
    发明申请
    SEMICONDUCTOR SUBSTRATE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 审中-公开
    半导体基板和制造半导体器件的方法

    公开(公告)号：US20150333036A1

    公开(公告)日：2015-11-19

    申请号：US14728134

    申请日：2015-06-02

    Applicant: Semiconductor Energy Laboratory Co., Ltd.

    Inventor： Akihiro CHIDA ,  Yoshiaki OIKAWA ,  Chiho KAWANABE

    IPC: H01L23/00

    CPC classification number: H01L24/96 ,  H01L21/561 ,  H01L21/568 ,  H01L21/78 ,  H01L27/1262 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A first semiconductor substrate is used which has a structure in which a peeling layer is not formed in a section subjected to a first dividing treatment, so that the peeling layer is not exposed at the end surface of a second semiconductor substrate when the second semiconductor substrate is cut out of the first semiconductor substrate. In addition, a supporting material is provided on a layer to be peeled of the second semiconductor substrate before the second semiconductor substrate is subjected to a second dividing treatment.

    Abstract translation: 使用第一半导体基板，其具有其中在经受第一分割处理的部分中不形成剥离层的结构，使得当第二半导体基板上的剥离层不暴露在第二半导体基板的端面时 被切出第一半导体衬底。 另外，在对第二半导体衬底进行第二次分割处理之前，在要被剥离的第二半导体衬底的层上提供支撑材料。

    SEMICONDUCTOR SUBSTRATE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    48.
    发明申请
    SEMICONDUCTOR SUBSTRATE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 审中-公开
    半导体基板和制造半导体器件的方法

    公开(公告)号：US20140248744A1

    公开(公告)日：2014-09-04

    申请号：US14276239

    申请日：2014-05-13

    Applicant: Semiconductor Energy Laboratory Co., Ltd.

    Inventor： Akihiro CHIDA ,  Yoshiaki OIKAWA ,  Chiho KAWANABE

    IPC: H01L27/12 ,  H01L21/78

    CPC classification number: H01L24/96 ,  H01L21/561 ,  H01L21/568 ,  H01L21/78 ,  H01L27/1262 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: Provided is a method for manufacturing a semiconductor device, which prevents waste generation from being caused peeling of films and prevents failure of peeling from being caused by waste due to peeling of films. A first semiconductor substrate is used which has a structure in which a peeling layer is not formed in a section subjected to a first dividing treatment, so that the peeling layer is not exposed at the end surface of a second semiconductor substrate when the second semiconductor substrate is cut out of the first semiconductor substrate. In addition, a supporting material is provided on a layer to be peeled of the second semiconductor substrate before the second semiconductor substrate is subjected to a second dividing treatment.

    Abstract translation: 提供一种制造半导体器件的方法，其防止废物产生被膜剥离，并防止由于剥离而导致的剥离不会导致剥离。 使用第一半导体基板，其具有其中在经受第一分割处理的部分中不形成剥离层的结构，使得当第二半导体基板上的剥离层不暴露在第二半导体基板的端面时 被切出第一半导体衬底。 另外，在对第二半导体衬底进行第二次分割处理之前，在要被剥离的第二半导体衬底的层上提供支撑材料。

    DISPLAY DEVICE
    50.
    发明申请
    DISPLAY DEVICE 有权

    公开(公告)号：US20240414973A1

    公开(公告)日：2024-12-12

    申请号：US18742113

    申请日：2024-06-13

    Applicant: Semiconductor Energy Laboratory Co., Ltd.

    Inventor： Takuya KAWATA ,  Akihiro CHIDA

    IPC: H10K59/60 ,  G06F1/16 ,  H10K50/84 ,  H10K59/12 ,  H10K59/40 ,  H10K71/00 ,  H10K77/10 ,  H10K101/00 ,  H10K102/00

    Abstract: A display device, an electronic device, or a lighting device that is unlikely to be broken is provided. A flexible first substrate and a flexible second substrate overlap with each other with a display element provided therebetween. A flexible third substrate is bonded on the outer surface of the first substrate, and a flexible fourth substrate is bonded on the outer surface of the second substrate. The third substrate is formed using a material softer than the first substrate, and the fourth substrate is formed using a material softer than the second substrate.

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