公开(公告)号：US08759668B2

公开(公告)日：2014-06-24

申请号：US13279720

申请日：2011-10-24

Applicant: Jalal Salami ,  Srinivasan Sridharan ,  Steve S. Kim ,  Aziz S. Shaikh

Inventor： Jalal Salami ,  Srinivasan Sridharan ,  Steve S. Kim ,  Aziz S. Shaikh

IPC: H01L31/0224 ,  C03C3/064 ,  C03C8/18 ,  C03C3/062 ,  H01L31/18

CPC classification number: H01L31/022425 ,  C03C3/062 ,  C03C3/064 ,  C03C8/18 ,  H01L21/2225 ,  Y02E10/50 ,  Y02E10/52

Abstract: Formulations and methods of making solar cells are disclosed. In general, the invention provides a solar cell comprising a contact made from a mixture wherein, prior to firing, the mixture comprises at least one aluminum source, at least one boron source, and about 0.1 to about 10 wt % of a glass component. Within the mixture, the overall content of aluminum is about 50 wt % to about 85 wt % of the mixture, and the overall content of boron is about 0.05 to about 20 wt % of the mixture.

Abstract translation: 公开了制造太阳能电池的制剂和方法。 通常，本发明提供一种太阳能电池，其包括由混合物制成的触点，其中在烧制之前，该混合物包含至少一种铝源，至少一种硼源和约0.1至约10重量％的玻璃组分。 在混合物中，铝的总含量为混合物的约50重量％至约85重量％，硼的总含量为混合物的约0.05至约20重量％。

公开(公告)号：US20130111953A1

公开(公告)日：2013-05-09

申请号：US13642553

申请日：2011-04-27

Applicant: John J. Maloney ,  Robert P. Blonski ,  Chandrashekhar S. Khadilkar ,  Srinivasan Sridharan

Inventor： John J. Maloney ,  Robert P. Blonski ,  Chandrashekhar S. Khadilkar ,  Srinivasan Sridharan

IPC: C03C27/04

CPC classification number: C03C27/044 ,  C03C3/066 ,  C03C3/122 ,  C03C3/14 ,  C03C8/04 ,  C03C8/14 ,  H01L21/02345 ,  H01L21/50 ,  H01L23/10 ,  H01L31/0481 ,  H01L31/0488 ,  H01L51/5246 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  Y02E10/50 ,  H01L2924/00

Abstract: Durable hermetic seals between two inorganic substrates are produced using a high-intensity electromagnetic energy source, such as laser, to heat and seal enamel layers with controlled absorption of high-intensity energy source. Durable hermetic seals incorporating electrical feedthroughs are also produced.

Abstract translation: 使用高强度电磁能源（例如激光）产生两个无机基底之间的耐久气密密封，以加热和密封具有受控吸收的高强度能量源的搪瓷层。 还生产结合电馈通的耐用气密密封件。

公开(公告)号：US08307674B2

公开(公告)日：2012-11-13

申请号：US12532424

申请日：2009-07-15

Applicant: Robert D. Gardner ,  Keith M. Mason ,  Srinivasan Sridharan ,  Aziz S. Shaikh

Inventor： Robert D. Gardner ,  Keith M. Mason ,  Srinivasan Sridharan ,  Aziz S. Shaikh

IPC: C03C27/00

CPC classification number: C03C8/24 ,  C03C3/066 ,  C03C3/072 ,  C03C3/16 ,  C03C8/245 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2924/16235 ,  H01L2924/00014

Abstract: Hot-melt sealing glass compositions that include one or more glass frits dispersed in a polymeric binder system. The polymeric binder system is a solid at room temperature, but melts at a temperature of from about 35° C. to about 90° C., thereby forming a flowable liquid dispersion that can be applied to a substrate (e.g., a cap wafer and/or a device wafer of a MEMS device) by screen printing. Hot-melt sealing glass compositions according to the invention rapidly re-solidify and adhere to the substrate after being deposited by screen printing. Thus, they do not tend to spread out as much as conventional solvent-based glass frit bonding pastes after screen printing. And, because hot-melt sealing glass compositions according to the invention are not solvent-based systems, they do not need to be force dried after deposition.

Abstract translation: 包括分散在聚合物粘合剂体系中的一种或多种玻璃料的热熔密封玻璃组合物。 聚合物粘合剂体系在室温下为固体，但在约35℃至约90℃的温度下熔融，由此形成可流动的液体分散体，其可施加到基底（例如盖片和 /或MEMS器件的器件晶片）。 根据本发明的热熔密封玻璃组合物在通过丝网印刷沉积之后快速再固化并附着到基底上。 因此，它们在丝网印刷后不会像常规的溶剂型玻璃料粘合膏一样扩散。 而且，由于根据本发明的热熔密封玻璃组合物不是溶剂型体系，它们在沉积后不需要强力干燥。

公开(公告)号：US08236598B2

公开(公告)日：2012-08-07

申请号：US12298956

申请日：2008-08-29

Applicant: Chandrashekhar S. Khadilkar ,  Srinivasan Sridharan ,  Paul S. Seman ,  Aziz S. Shaikh

Inventor： Chandrashekhar S. Khadilkar ,  Srinivasan Sridharan ,  Paul S. Seman ,  Aziz S. Shaikh

IPC: H01L21/00

CPC classification number: H01L31/022425 ,  C03C3/066 ,  C03C3/07 ,  C03C8/04 ,  C03C8/10 ,  C03C8/14 ,  C03C8/16 ,  C03C8/18 ,  Y02E10/50

Abstract: Formulations and methods of making semiconductor devices and solar cell contacts are disclosed. The invention provides a method of making a semiconductor device or solar cell contact including ink-jet printing onto a silicon wafer an ink composition, typically including a high solids loading (20-80 wt %) of glass frit and preferably a conductive metal such as silver. The wafer is then fired such that the glass frit fuses to form a glass, thereby forming a contact layer to silicon.

Abstract translation: 公开了半导体器件和太阳能电池触点的制备和方法。 本发明提供一种制造半导体器件或太阳能电池接触的方法，其包括喷墨印刷到硅晶片上的油墨组合物，通常包括高固体含量（20-80重量％）的玻璃料，优选导电金属，例如 银。 然后烧制晶片，使得玻璃料熔化形成玻璃，从而形成与硅的接触层。

公开(公告)号：US08043721B2

公开(公告)日：2011-10-25

申请号：US12464980

申请日：2009-05-13

Applicant: Chandrashekhar S. Khadilkar ,  Srinivasan Sridharan ,  Aziz S. Shaikh

Inventor： Chandrashekhar S. Khadilkar ,  Srinivasan Sridharan ,  Aziz S. Shaikh

IPC: B32B19/00

CPC classification number: C04B37/008 ,  C03C3/062 ,  C03C3/078 ,  C03C3/089 ,  C03C14/00 ,  C04B35/6264 ,  C04B35/632 ,  C04B37/028 ,  C04B2235/6567 ,  C04B2237/66 ,  C23C24/00 ,  C23C26/00 ,  H05K1/0306 ,  H05K1/053 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2203/068 ,  Y10T428/2438 ,  Y10T428/31641

Abstract: A method of applying a ceramic coating to a substrate comprises laminating one or more layers of a green ceramic tape to a rigid substrate using a tackifying resin to adhere the tape to the substrate. Upon firing, the tackifying resin ensures near zero shrinkage of the tape in the XY plane without usage of elevated pressures or temperatures during lamination of green tape to the substrate. The thermal degradation completion temperature of the tackifying resin is lower than that of the resin binder used in the green tape.

Abstract translation: 将陶瓷涂层施加到基底的方法包括使用增粘树脂将一层或多层生坯陶瓷带层压到刚性基底上以将带粘附到基底上。 在烧制时，增粘树脂确保胶带在XY平面内接近零收缩，而不会在将生胶带层压到基材中时使用升高的压力或温度。 增粘树脂的热降解完成温度低于生胶带中使用的树脂粘合剂的热降解完成温度。

公开(公告)号：US20100163101A1

公开(公告)日：2010-07-01

申请号：US12097823

申请日：2008-04-24

Applicant: Umesh Kumar ,  Virginia L. Whitford ,  Srinivasan Sridharan ,  Aziz S. Shaikh

Inventor： Umesh Kumar ,  Virginia L. Whitford ,  Srinivasan Sridharan ,  Aziz S. Shaikh

IPC: H01L31/0216 ,  H01L31/18 ,  H01B1/02

CPC classification number: H01B1/22 ,  H01L31/022425 ,  H01L31/18 ,  Y02E10/50

Abstract: Formulations and methods of making solar cells and solar cell contacts are disclosed. In general, the invention presents a solar cell contact made from a mixture wherein the mixture comprises a metal portion, which, prior to firing, comprises nickel and silver.

Abstract translation: 公开了制造太阳能电池和太阳能电池触点的制剂和方法。 通常，本发明提供了由混合物制成的太阳能电池触点，其中混合物包括金属部分，其在烧制之前包括镍和银。

公开(公告)号：US07740899B2

公开(公告)日：2010-06-22

申请号：US10431346

申请日：2003-05-07

Applicant: Srinivasan Sridharan ,  Michail Moroz

Inventor： Srinivasan Sridharan ,  Michail Moroz

IPC: B05D5/12 ,  B05D3/02

CPC classification number: C03C8/20 ,  C03C8/02 ,  C03C8/14 ,  C03C8/22

Abstract: The present invention provides an electronic device having a lead-free and cadmium-free glass composition applied thereto and fired to form an acid resistant overglaze, and a method of overglazing an electronic device using the lead-free and cadmium-free glass composition. The lead-free and cadmium-free glass composition fuses at low firing temperatures and is particularly suitable for use in thick film pastes. The glass composition forms predominantly bismuth titanate and/or zinc titanate crystals upon firing. Preferably, glass compositions include by weight from about 11% to about 52% SiO2, from 3.4% to about 40% TiO2, up to about 75% Bi2O3, up to about 40% by weight ZnO, where the sum of Bi2O3 and ZnO comprises from about 15% to about 85% of the glass composition by weight.

Abstract translation: 本发明提供了一种电子装置，其具有施加到其上的无铅和无镉玻璃组合物并烧制以形成耐酸釉料，以及使用无铅和无镉玻璃组合物来搪瓷电子器件的方法。 无铅和无镉玻璃组合物在低烧成温度下熔化，特别适用于厚膜糊剂。 玻璃组合物在烧制时主要形成钛酸铋和/或钛酸锌晶体。 优选地，玻璃组合物包括按重量计约11％至约52％SiO 2，3.4％至约40％TiO 2，至多约75％Bi 2 O 3，至多约40％重量的ZnO，其中Bi 2 O 3和ZnO的总和包含 约占玻璃组合物重量的约15％至约85％。

公开(公告)号：US20090220799A1

公开(公告)日：2009-09-03

申请号：US12464980

申请日：2009-05-13

Applicant: Chandrashekhar S. Khadilkar ,  Srinivasan Sridharan ,  Aziz S. Shaikh

Inventor： Chandrashekhar S. Khadilkar ,  Srinivasan Sridharan ,  Aziz S. Shaikh

IPC: B32B17/10 ,  B32B17/06 ,  C03C3/097 ,  C03C3/089 ,  C03C3/078 ,  C03C3/076

CPC classification number: C04B37/008 ,  C03C3/062 ,  C03C3/078 ,  C03C3/089 ,  C03C14/00 ,  C04B35/6264 ,  C04B35/632 ,  C04B37/028 ,  C04B2235/6567 ,  C04B2237/66 ,  C23C24/00 ,  C23C26/00 ,  H05K1/0306 ,  H05K1/053 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2203/068 ,  Y10T428/2438 ,  Y10T428/31641

Abstract: A method of applying a ceramic coating to a substrate comprises laminating one or more layers of a green ceramic tape to a rigid substrate using a tackifying resin to adhere the tape to the substrate. Upon firing, the tackifying resin ensures near zero shrinkage of the tape in the XY plane without usage of elevated pressures or temperatures during lamination of green tape to the substrate. The thermal degradation completion temperature of the tackifying resin is lower than that of the resin binder used in the green tape.

Abstract translation: 将陶瓷涂层施加到基底的方法包括使用增粘树脂将一层或多层生坯陶瓷带层压到刚性基底上以将带粘附到基底上。 在烧制时，增粘树脂确保胶带在XY平面内接近零收缩，而不会在将生胶带层压到基材中时使用升高的压力或温度。 增粘树脂的热降解完成温度低于生胶带中使用的树脂粘合剂的热降解完成温度。

公开(公告)号：US07547369B2

公开(公告)日：2009-06-16

申请号：US11468798

申请日：2006-08-31

Applicant: Chandrashekhar S. Khadilkar ,  Srinivasan Sridharan ,  Aziz S. Shaikh

Inventor： Chandrashekhar S. Khadilkar ,  Srinivasan Sridharan ,  Aziz S. Shaikh

IPC: C03B29/00

CPC classification number: C04B37/008 ,  C03C3/062 ,  C03C3/078 ,  C03C3/089 ,  C03C14/00 ,  C04B35/6264 ,  C04B35/632 ,  C04B37/028 ,  C04B2235/6567 ,  C04B2237/66 ,  C23C24/00 ,  C23C26/00 ,  H05K1/0306 ,  H05K1/053 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2203/068 ,  Y10T428/2438 ,  Y10T428/31641

Abstract: A method of applying a ceramic coating to a substrate comprises laminating one or more layers of a green ceramic tape to a rigid substrate using a tackifying resin to adhere the tape to the substrate. Upon firing, the tackifying resin ensures near zero shrinkage of the tape in the XY plane without usage of elevated pressures or temperatures during lamination of green tape to the substrate. The thermal degradation completion temperature of the tackifying resin is lower than that of the resin binder used in the green tape.

Abstract translation: 将陶瓷涂层施加到基底的方法包括使用增粘树脂将一层或多层生坯陶瓷带层压到刚性基底上以将带粘附到基底上。 在烧制时，增粘树脂确保胶带在XY平面内接近零收缩，而不会在将生胶带层压到基材中时使用升高的压力或温度。 增粘树脂的热降解完成温度低于生胶带中使用的树脂粘合剂的热降解完成温度。

公开(公告)号：US20090005733A1

公开(公告)日：2009-01-01

申请号：US11877967

申请日：2007-10-24

Applicant: Jessica G. Chiu ,  Gregory Waimong Chan ,  Gabriel Asongwe ,  Robert C. Esselstein ,  Douglas Gesswein ,  Srinivasan Sridharan ,  Nianjiong Joan Bei ,  William E. Webler ,  Stephen G. Schaible ,  Mina Chow ,  Yan Shen ,  Hongzhi Bai ,  Mark J. Bly ,  Thomas R. Hatten

Inventor： Jessica G. Chiu ,  Gregory Waimong Chan ,  Gabriel Asongwe ,  Robert C. Esselstein ,  Douglas Gesswein ,  Srinivasan Sridharan ,  Nianjiong Joan Bei ,  William E. Webler ,  Stephen G. Schaible ,  Mina Chow ,  Yan Shen ,  Hongzhi Bai ,  Mark J. Bly ,  Thomas R. Hatten

IPC: A61M25/10 ,  A61M25/09

CPC classification number: A61M25/10 ,  A61M25/1002 ,  A61M2025/1052

Abstract: Embodiments include an infusion-occlusion system having a delivery catheter, a guide catheter adapted to receive the delivery catheter, and a guidewire with an occlusion device adapted to be received within the guide catheter. The guide catheter of the catheter kit may be provided with an occlusion device at the distal end of the guide catheter. The delivery catheter may have an accessory lumen, coaxial or co-linear lumen, a supporting mandrel, or an occlusion device at its distal end. Moreover, according to some embodiments, occlusion devices may be a single material or a composite balloon having an inner liner and an outer layer of different materials, a high compliance low pressure balloon, or a filter device that restricts particles from passing through but does not restrict fluid, such as blood. An inflation device with a large volume and low volume syringe can be used to inflate the balloon.

Abstract translation: 实施例包括具有输送导管的输液阻塞系统，适于接收输送导管的引导导管，以及具有适于容纳在引导导管内的闭塞装置的导丝。 导管套件的引导导管可以在引导导管的远端处设置有闭塞装置。 输送导管可以具有附件腔，同轴或共线腔，支撑心轴或其远端处的闭塞装置。 此外，根据一些实施例，闭塞装置可以是具有内衬和不同材料外层的单一材料或复合球囊，高顺应性低压气球或限制颗粒通过但不限制的过滤装置 限制流体，如血液。 可以使用具有大体积和低体积注射器的充气装置来使气囊膨胀。