Abstract:
Disclosed are conductive composites comprising a polymer, a conductor selected from metals and metal alloys, a compatibilizing agent, and an optional thickening agent.
Abstract:
Methods and formulations for modified silicone resins of Formula (II) are presented. Formula (II) comprises at least one of each of the following subunits: The R1, R2, R3, R6, R7, R8, R9, R10, R11, R12 and R13 are each independently selected from a group consisting of H, alkyl, alkenyl, alkynyl, and aryl. The X is selected from a group consisting of arylene, transition metal, inorganic oxide, and silsesquioxane. The values of t ranges from 1 to 10, y ranges from 1 to 200 and z ranges from 1 to 1,000. The elastomeric materials prepared from modified silicone resins display robust mechanical properties following prolonged exposure to high temperatures (e.g., 316° C. or higher).
Abstract:
Methods and formulations for modified silicone resins of Formula (I) are presented: The R1, R2, and R3 are each independently selected from a group consisting of H, alkyl, alkenyl, alkynyl, and aryl; n ranges from 1 to 10; m ranges from 1 to 200; and p ranges from 2 to 1,000. The elastomeric materials prepared from modified silicone resins display robust mechanical properties following prolonged exposure to high temperatures (e.g., 316° C. or higher).
Abstract:
A low viscosity polysulfide sealant composition. The composition comprises a curable polysulfide polymer; a crosslinking agent; and a plurality of core-shell particles. The core-shell particles comprise: a core comprising a ferromagnetic material; and a shell comprising silica treated with an organic sulfur containing compound. The shell is capable of bonding with the polysulfide polymer.
Abstract:
Aspects described herein generally describe epoxy resins and methods of epoxy resin formation. In some embodiments, a resin includes the reaction product of one or more polythiols, one or more polyepoxides, one or more fillers and one or more amine catalysts. Polythiols have between two and about ten thiol moieties. Polyepoxides have between two and about ten epoxy moieties. One or more amine catalysts of the formula NR1R2R3, wherein each of R1, R2, and R3 is independently linear or branched C1-20 alkyl or two or more of R1, R2, and R3 combine to form cycloalkyl. The resin has a compressive strength of at least 14 ksi at 2% offset at 70° F. and at least 8 ksi at 2% offset at 190° F.
Abstract:
A low viscosity polysulfide sealant composition. The composition comprises a curable polysulfide polymer; a crosslinking agent; and a plurality of core-shell particles. The core-shell particles comprise: a core comprising a ferromagnetic material; and a shell comprising silica treated with an organic sulfur containing compound. The shell is capable of bonding with the polysulfide polymer.
Abstract:
Adhesive formulations for forming a fluorinated poly(imide-phthalonitrile) thermoset polymer are provided. Such an adhesive formulation may comprise a fluorinated imide-phthalonitrile oligomer having Formula IV
wherein R1 is an unsubstituted or substituted aryl group and does not comprise an ether group; R2 is an unsubstituted or substituted aryl group and does not comprise an ether group; at least one of R1 and R2 comprises a fluorine substituent; and n has a value of from 1 to 30.
Abstract:
Adhesive formulations for forming a fluorinated poly(imide-phthalonitrile) thermoset polymer are provided. Such an adhesive formulation may comprise a fluorinated imide-phthalonitrile oligomer having Formula IV
wherein R1 is an unsubstituted or substituted aryl group and does not comprise an ether group; R2 is an unsubstituted or substituted aryl group and does not comprise an ether group; at least one of R1 and R2 comprises a fluorine substituent; and n has a value of from 1 to 30.
Abstract:
A conductive composite includes a first layer of elastomeric polymer, a layer of conductive fluorofluid on the first layer of elastomeric polymer, and a second layer of elastomeric polymer on the layer of conductive fluorofluid.