摘要:
In a method for forming a plurality of gate patterns in parallel with each other on a photoresist layer within one circuit block, at least one dummy gate pattern is formed in parallel with the gate patterns when a pitch between said gate patterns is larger than a predetermined maximum pitch, so that pitches between the gate patterns including the dummy gate pattern are smaller than the predetermined maximum pitch. Then, a photolithography process is performed upon the photoresist layer by using a phase shift photomask having first and second openings whose difference in phase is π. The first and second openings alternate between the gate patterns including the dummy gate pattern to form phase edges therein.
摘要:
A pattern formation method of the present invention is one that forms a circuit pattern in a resist film upon a wafer 141 by exposure using a plurality of phase-shift masks. A first phase-shift mask is for an isolated pattern including a pattern with a distance between adjacent patterns (inter-pattern distance) W1 of at least 400 nm, and a second phase-shift mask is for a dense pattern including patterns with inter-pattern distances W2 under 400 nm. Affects of the optical proximity effect are eliminated through providing optimum exposure conditions for the distances between adjacent patterns W1 and W2 using the plurality of phase-shift masks in accordance with respective inter-pattern distances W1 and W2.
摘要:
A mask set has a first mask including a shielding region shielding a first pattern-defining light; a second mask including a phase-shifting region having a phase shifter edge and a non-phase-shifting region adjacent to the phase-shifting region on the phase shifter edge. A first phase of the first light portion passing through the phase-shifting region differs from a second phase of the second light portion. The first and second masks are aligned such that the phase shifter edge overlaps on the shielding region.
摘要:
A method of forming a photoresist pattern by a photolithography technique is composed of: providing a photoresist layer; exposing the photoresist layer to a first pattern-defining light using a first mask; and exposing the photoresist layer to a second pattern-defining light using a second mask. The first mask includes a shielding region shielding the first pattern-defining light. The second mask includes a phase-shifting region having a phase shifter edge and a non-phase-shifting region adjacent to the phase-shifting region on the phase shifter edge. A first light portion of the second pattern-defining light passes through the phase-shifting region. A second light portion of the second pattern-defining light passes through the non-phase-shifting region. A first phase of the first light portion differs from a second phase of the second light portion. The first and second masks are aligned such that the phase shifter edge overlaps on the shielding region.
摘要:
For a photolithography apparatus, an adjustment method is provided which comprises first and second processes. In the first process, a semiconductor wafer is successively set in one of cell positions. In each of the cell positions, a laser beam is directed to the surface of the wafer and light reflecting off the wafer surface is detected and analyzed to determine a vertical offset position of the wafer at each cell position. Data representing the vertical offset position is stored in a memory and the first process is repeated until the offset position data are derived from all cell positions. In the second process, tilt angles of the wafer at all cell positions are determined from the stored offset position data, and angle data representing the determined tilt angles are stored in a memory. The wafer is then set in one of the cell positions, and the angle data is read from the memory corresponding to the set cell position and the wafer surface is horizontally aligned. The offset position data is read from the memory corresponding to the set cell position and the wafer surface is vertically moved to the focal point. The second process is repeated until the wafer is set to all cell positions.
摘要:
In a mask including an optical shield layer formed on a transparent substrate, the light transmittance of the shield layer is changed in accordance with the density of patterns of the shield layer or the thickness of a photoresist layer on a semiconductor substrate.
摘要:
A retractable vehicle seat in which a seat main body disposed on a vehicle floor is flipped up laterally, so as to be retracted in a vehicle interior side wall of which the upper portion is inwardly inclined, may include a connection mechanism that is configured to rotatably connect the seat main body to a support stand. The connection mechanism includes a four-link mechanism having a stationary link integral with the support stand, an intermediate link integral with the seat main body, and a first link and a second link that connect these two links. The second link is configured to increase an angle between the first link and the intermediate link as the seat main body is flipped up.
摘要:
A retractable vehicle seat in which a seat main body disposed on a vehicle floor is flipped up laterally, so as to be retracted in a vehicle interior side wall of which the upper portion is inwardly inclined, may include a connection mechanism that is configured to rotatably connect the seat main body to a support stand. The connection mechanism includes a four-link mechanism having a stationary link integral with the support stand, an intermediate link integral with the seat main body, and a first link and a second link that connect these two links. The second link is configured to increase an angle between the first link and the intermediate link as the seat main body is flipped up.
摘要:
A buildup board includes a buildup layer having a multilayer structure and/or a core layer having a multilayer structure. The multilayer structure includes a signal wiring pattern, a pad connected to the signal wiring pattern, an insulating part arranged around the pad on the same layer as the pad, and a conductor arranged around the insulating part on the same layer as the pad. The multilayer structure has at least two different keepouts where the keepout is defined as a minimum interval between an outline of the pad and the conductor closest to the pad on the same layer.
摘要:
A method of designing a pattern of a hole pattern having a configuration, in which grid of interval smaller than a minimum permissible pitch according to a design rule for a semiconductor integrated circuit is provided in a pattern drawing, a hole pattern is arranged on a first lattice point which is an intersection of the grid, and, at the same time, other hole patterns are not arranged on a second lattice point group which is on the periphery of the first lattice point, and is adjacent to the first lattice point is provided. And, the number of hole patterns, which may be arranged in a third lattice point group of a plurality of lattice points which are on the periphery of a second lattice point group and are within a predetermined distance from the first lattice point, is controlled.