Fabrication method and structure of semiconductor non-volatile memory device
    41.
    发明授权
    Fabrication method and structure of semiconductor non-volatile memory device 有权
    半导体非易失性存储器件的制造方法和结构

    公开(公告)号:US07671404B2

    公开(公告)日:2010-03-02

    申请号:US11589095

    申请日:2006-10-30

    IPC分类号: H01L29/94

    摘要: A non-volatile semiconductor memory device with good write/erase characteristics is provided. A selection gate is formed on a p-type well of a semiconductor substrate via a gate insulator, and a memory gate is formed on the p-type well via a laminated film composed of a silicon oxide film, a silicon nitride film, and a silicon oxide film. The memory gate is adjacent to the selection gate via the laminated film. In the regions on both sides of the selection gate and the memory gate in the p-type well, n-type impurity diffusion layers serving as the source and drain are formed. The region controlled by the selection gate and the region controlled by the memory gate located in the channel region between said impurity diffusion layers have the different charge densities of the impurity from each other.

    摘要翻译: 提供具有良好写入/擦除特性的非易失性半导体存储器件。 通过栅极绝缘体在半导体衬底的p型阱上形成选择栅极,并且通过由氧化硅膜,氮化硅膜和氮化硅膜构成的层叠膜在p型阱上形成存储栅极 氧化硅膜。 存储器栅极通过层叠膜与选择栅极相邻。 在p型阱中的选择栅极和存储栅极的两侧的区域中,形成用作源极和漏极的n型杂质扩散层。 由选择栅极控制的区域和由位于所述杂质扩散层之间的沟道区域中的存储栅极控制的区域具有彼此不同的杂质的电荷密度。

    Method for working semiconductor wafer
    44.
    发明授权
    Method for working semiconductor wafer 有权
    半导体晶圆工作方法

    公开(公告)号:US06221773B1

    公开(公告)日:2001-04-24

    申请号:US09254431

    申请日:1999-03-09

    IPC分类号: H01L21302

    摘要: A method for processing semiconductor wafers, which provides planarized surface in a well controllable manner and with high accuracy by processing a film with uneven surface, formed over a semiconductor wafer, within the area of a working surface with a diameter larger than that of said semiconductor wafer by not more than two times, and by processing the film with a polishing liquid supplied from a supply unit disposed on a vertically arranged working surface is disclosed. Additionally, high quality dressing of the working surface can be easily performed by virtue of the smaller diameter of the working surface. Furthermore, the vertical arrangement of the working surface makes possible ready compatibility with semiconductor wafers of enlarged diameters.

    摘要翻译: 一种用于处理半导体晶片的方法,其在工作表面的直径大于所述半导体的直径的区域内,以半导体晶片形成在半导体晶片上,通过处理具有不平坦表面的膜,以良好可控的方式并且以高精度提供平坦化表面 晶片不超过两次,并且通过用设置在垂直布置的工作表面上的供应单元供应的抛光液处理该膜。 此外,通过工作表面的较小直径,可以容​​易地进行工作表面的高质量的修整。 此外,工作表面的垂直布置使得可以准确地兼容扩大直径的半导体晶片。

    Fabrication method and structure of semiconductor non-volatile memory device
    46.
    发明授权
    Fabrication method and structure of semiconductor non-volatile memory device 有权
    半导体非易失性存储器件的制造方法和结构

    公开(公告)号:US08084810B2

    公开(公告)日:2011-12-27

    申请号:US12648796

    申请日:2009-12-29

    IPC分类号: H01L21/336

    摘要: A non-volatile semiconductor memory device with good write/erase characteristics is provided. A selection gate is formed on a p-type well of a semiconductor substrate via a gate insulator, and a memory gate is formed on the p-type well via a laminated film composed of a silicon oxide film, a silicon nitride film, and a silicon oxide film. The memory gate is adjacent to the selection gate via the laminated film. In the regions on both sides of the selection gate and the memory gate in the p-type well, n-type impurity diffusion layers serving as the source and drain are formed. The region controlled by the selection gate and the region controlled by the memory gate located in the channel region between said impurity diffusion layers have the different charge densities of the impurity from each other.

    摘要翻译: 提供具有良好写入/擦除特性的非易失性半导体存储器件。 通过栅极绝缘体在半导体衬底的p型阱上形成选择栅极,并且通过由氧化硅膜,氮化硅膜和氮化硅膜构成的层叠膜在p型阱上形成存储栅极 氧化硅膜。 存储器栅极通过层叠膜与选择栅极相邻。 在p型阱中的选择栅极和存储栅极的两侧的区域中,形成用作源极和漏极的n型杂质扩散层。 由选择栅极控制的区域和由位于所述杂质扩散层之间的沟道区域中的存储栅极控制的区域具有彼此不同的杂质的电荷密度。

    Nonvolatile semiconductor memory device with tapered sidewall gate and method of manufacturing the same
    47.
    发明授权
    Nonvolatile semiconductor memory device with tapered sidewall gate and method of manufacturing the same 有权
    具有锥形侧壁栅极的非易失性半导体存储器件及其制造方法

    公开(公告)号:US07442986B2

    公开(公告)日:2008-10-28

    申请号:US11797839

    申请日:2007-05-08

    IPC分类号: H01L29/788

    摘要: In a split gate type nonvolatile memory cell in which a MOS transistor for a nonvolatile memory using a charge storing film and a MOS transistor for selecting it are adjacently formed, the charge storing characteristic is improved and the resistance of the gate electrode is reduced. In order to prevent the thickness reduction at the corner portion of the charge storing film and improve the charge storing characteristic, a taper is formed on the sidewall of the select gate electrode. Also, in order to stably perform a silicide process for reducing the resistance of the self-aligned gate electrode, the sidewall of the select gate electrode is recessed. Alternatively, a discontinuity is formed between the upper portion of the self-aligned gate electrode and the upper portion of the select gate electrode.

    摘要翻译: 在其中使用电荷存储膜的非易失性存储器的MOS晶体管和用于选择它的MOS晶体管相邻形成的分离栅极型非易失性存储单元中,电荷存储特性得到改善,栅电极的电阻降低。 为了防止电荷存储薄膜的拐角部分的厚度减小并且提高电荷存储特性,在选择栅电极的侧壁上形成锥形。 此外,为了稳定地进行用于降低自对准栅电极的电阻的硅化物工艺,选择栅电极的侧壁凹陷。 或者,在自对准栅电极的上部和选择栅电极的上部之间形成不连续。

    Non-volatile semiconductor memory device and writing method thereof
    48.
    发明授权
    Non-volatile semiconductor memory device and writing method thereof 有权
    非挥发性半导体存储器件及其写入方法

    公开(公告)号:US07339827B2

    公开(公告)日:2008-03-04

    申请号:US11147243

    申请日:2005-06-08

    摘要: In connection with rise and fall of a word line bias, the present invention adopts a procedure such that a diffusion region voltage Vs on a memory transistor side is changed, and after the voltage Vs passes a certain intermediate value Vsx, a gate voltage Vmg of the memory transistor is changed. Alternatively, there is adopted a procedure such that the gate voltage Vmg of the memory transistor is changed, and after the voltage Vmg passes a certain intermediate value Vmgx, the diffusion layer voltage Vs on the memory transistor side is changed. The values of Vsx and Vmgx are determined from the magnitude of the electric field in a gate insulating film not causing FN tunneling electron injection that causes a change in threshold voltage and the magnitude of a potential barrier against holes not causing BTBT hot hole injection.

    摘要翻译: 关于字线偏差的上升和下降,本发明采用使存储晶体管侧的扩散区电压Vs变化的过程,在电压Vs经过一定的中间值Vsx之后,栅极电压Vmg为 存储晶体管被改变。 或者,采用使存储晶体管的栅极电压Vmg改变的过程,并且在电压Vmg经过一定的中间值Vmgx之后,存储晶体管侧的扩散层电压Vs被改变。 Vsx和Vmgx的值由栅极绝缘膜中不引起FN隧穿电子注入的电场的大小确定,导致阈值电压的变化以及针对未引起BTBT热空穴注入的孔的势垒的大小。

    Nonvolatile semiconductor memory device with tapered sidewall gate and method of manufacturing the same
    49.
    发明申请
    Nonvolatile semiconductor memory device with tapered sidewall gate and method of manufacturing the same 有权
    具有锥形侧壁栅极的非易失性半导体存储器件及其制造方法

    公开(公告)号:US20050085039A1

    公开(公告)日:2005-04-21

    申请号:US10901347

    申请日:2004-07-29

    摘要: In a split gate type nonvolatile memory cell in which a MOS transistor for a nonvolatile memory using a charge storing film and a MOS transistor for selecting it are adjacently formed, the charge storing characteristic is improved and the resistance of the gate electrode is reduced. In order to prevent the thickness reduction at the corner portion of the charge storing film and improve the charge storing characteristic, a taper is formed on the sidewall of the select gate electrode. Also, in order to stably perform a silicide process for reducing the resistance of the self-aligned gate electrode, the sidewall of the select gate electrode is recessed. Alternatively, a discontinuity is formed between the upper portion of the self-aligned gate electrode and the upper portion of the select gate electrode.

    摘要翻译: 在其中使用电荷存储膜的非易失性存储器的MOS晶体管和用于选择它的MOS晶体管相邻形成的分离栅极型非易失性存储单元中,电荷存储特性得到改善,栅电极的电阻降低。 为了防止电荷存储薄膜的拐角部分的厚度减小并且提高电荷存储特性,在选择栅电极的侧壁上形成锥形。 此外,为了稳定地进行用于降低自对准栅电极的电阻的硅化物工艺,选择栅电极的侧壁凹陷。 或者,在自对准栅电极的上部和选择栅电极的上部之间形成不连续。

    Processing method, measuring method and producing method of semiconductor devices
    50.
    发明授权
    Processing method, measuring method and producing method of semiconductor devices 失效
    半导体器件的加工方法,测量方法和制造方法

    公开(公告)号:US06589871B2

    公开(公告)日:2003-07-08

    申请号:US09941757

    申请日:2001-08-30

    IPC分类号: H01L21302

    CPC分类号: H01L22/20

    摘要: A processing method capable of presenting the processing condition with a high accuracy to improve the productivity, including a step of applying a first processing to a first substrate and a step of applying a second processing to the first substrate or the second processing to a second substrate and determining a correlation function for each of in-plane positions as the data for the difference in a plurality of processing steps to each of the in-plane positions in view of on the in-plain distribution data to the in-plane position of each of the substrate as a result of the plurality of processings, calculating the in-plain distribution characteristics of the substrate under a desired processing condition in view of the correlation function and processing the substrate based on the in-plain distribution characteristics.

    摘要翻译: 一种处理方法,其能够高精度地呈现处理条件以提高生产率,包括对第一基板施加第一处理的步骤和对第一基板施加第二处理的步骤或第二处理的步骤 以及将每个平面内位置的相关函数确定为多个处理步骤中的差数据的数据,以便在每个平面内位置中考虑到不均匀分布数据到每个平面内位置的平面内位置 作为多个处理的结果,考虑到相关函数,在所需的处理条件下计算衬底的不均匀分布特性,并且基于平原分布特性来处理衬底。